KR960035632U - Anti-flash mold base die - Google Patents

Anti-flash mold base die

Info

Publication number
KR960035632U
KR960035632U KR2019950008734U KR19950008734U KR960035632U KR 960035632 U KR960035632 U KR 960035632U KR 2019950008734 U KR2019950008734 U KR 2019950008734U KR 19950008734 U KR19950008734 U KR 19950008734U KR 960035632 U KR960035632 U KR 960035632U
Authority
KR
South Korea
Prior art keywords
mold base
base die
flash mold
flash
die
Prior art date
Application number
KR2019950008734U
Other languages
Korean (ko)
Other versions
KR200173049Y1 (en
Inventor
노길섭
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019950008734U priority Critical patent/KR200173049Y1/en
Publication of KR960035632U publication Critical patent/KR960035632U/en
Application granted granted Critical
Publication of KR200173049Y1 publication Critical patent/KR200173049Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
KR2019950008734U 1995-04-26 1995-04-26 Mold base die for preventing flash KR200173049Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950008734U KR200173049Y1 (en) 1995-04-26 1995-04-26 Mold base die for preventing flash

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950008734U KR200173049Y1 (en) 1995-04-26 1995-04-26 Mold base die for preventing flash

Publications (2)

Publication Number Publication Date
KR960035632U true KR960035632U (en) 1996-11-21
KR200173049Y1 KR200173049Y1 (en) 2000-03-02

Family

ID=19412162

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950008734U KR200173049Y1 (en) 1995-04-26 1995-04-26 Mold base die for preventing flash

Country Status (1)

Country Link
KR (1) KR200173049Y1 (en)

Also Published As

Publication number Publication date
KR200173049Y1 (en) 2000-03-02

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Legal Events

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E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
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FPAY Annual fee payment

Payment date: 20081125

Year of fee payment: 10

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