KR960009277U - Molding die - Google Patents

Molding die

Info

Publication number
KR960009277U
KR960009277U KR2019940021630U KR19940021630U KR960009277U KR 960009277 U KR960009277 U KR 960009277U KR 2019940021630 U KR2019940021630 U KR 2019940021630U KR 19940021630 U KR19940021630 U KR 19940021630U KR 960009277 U KR960009277 U KR 960009277U
Authority
KR
South Korea
Prior art keywords
molding die
die
molding
Prior art date
Application number
KR2019940021630U
Other languages
Korean (ko)
Other versions
KR0119734Y1 (en
Inventor
오용영
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019940021630U priority Critical patent/KR0119734Y1/en
Publication of KR960009277U publication Critical patent/KR960009277U/en
Application granted granted Critical
Publication of KR0119734Y1 publication Critical patent/KR0119734Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR2019940021630U 1994-08-25 1994-08-25 Molding die KR0119734Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940021630U KR0119734Y1 (en) 1994-08-25 1994-08-25 Molding die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940021630U KR0119734Y1 (en) 1994-08-25 1994-08-25 Molding die

Publications (2)

Publication Number Publication Date
KR960009277U true KR960009277U (en) 1996-03-16
KR0119734Y1 KR0119734Y1 (en) 1998-08-01

Family

ID=19391554

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940021630U KR0119734Y1 (en) 1994-08-25 1994-08-25 Molding die

Country Status (1)

Country Link
KR (1) KR0119734Y1 (en)

Also Published As

Publication number Publication date
KR0119734Y1 (en) 1998-08-01

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090223

Year of fee payment: 12

EXPY Expiration of term