KR0119734Y1 - Molding die - Google Patents
Molding dieInfo
- Publication number
- KR0119734Y1 KR0119734Y1 KR2019940021630U KR19940021630U KR0119734Y1 KR 0119734 Y1 KR0119734 Y1 KR 0119734Y1 KR 2019940021630 U KR2019940021630 U KR 2019940021630U KR 19940021630 U KR19940021630 U KR 19940021630U KR 0119734 Y1 KR0119734 Y1 KR 0119734Y1
- Authority
- KR
- South Korea
- Prior art keywords
- pin
- molding die
- holder base
- addition
- main cavity
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
본 고안은 반도체 몰딩다이의 구조를 대폭적으로 간소화 시켜 설계 및 제작이 용이하도록 한 몰딩다이에 관한 것으로, 홀더베이스(11) 내부에 핀플레이트(22)를 메인캐비티(12)하단에 설치하고, 이젝터핀(14) 헤드하단에 와셔스프링(20)을 삽입하여 이젝팅 동작이 가능하도록 한다. 또한, 메인캐비티(12) 하형에 리턴핀(13)을 위치시켜 상,하형 결합시 리턴핀(13)의 후퇴에 의하여 적절한 이젝터핀(14)의 깊이를 유지하도록 한다. 상기 리턴핀(13)은 캐비티(15)를 중심으로 양측에 설치하는 것이 유리하다. 또한, 홀더베이스(11)와 메인캐비티(12)사이에 핀 플레이트(22)를 활용하여 탄성이 뛰어난 플로우팅(Floating) 핀(21),을 삽입하므로서 불필요한 압력 분산을 억제하여 금형의 품질을 향상시킨다. 홀더베이스(11) 하단에는 필러(23)를 결합한다. 따라서, 이젝팅 시스템의 구조가 간단하여 소형화, 경량화가 용이하고, 이에 따른 제작기간 및 제작비용을 줄일 수 있으며, 몰딩다이의 소형화로 프레스 크기의 축소가 용이하다. 또한, 구조가 간단하여 불량발생의 우려가 적고, 필러의 제약이 배제되어 최적의 설계에 의한 품질의 향상을 도모할 수 있는 것이다.The present invention relates to a molding die that greatly simplifies the structure of a semiconductor molding die to facilitate design and fabrication. The pin plate 22 is installed at the bottom of the main cavity 12 in the holder base 11, and the ejector The washer spring 20 is inserted into the lower end of the pin 14 to enable the ejecting operation. In addition, the return pin 13 is positioned on the lower mold of the main cavity 12 to maintain the proper ejector pin 14 by retreating the return pin 13 when the upper and lower molds are coupled. The return pin 13 is advantageously provided at both sides with respect to the cavity 15. In addition, by inserting the floating pin 21 having excellent elasticity by utilizing the pin plate 22 between the holder base 11 and the main cavity 12, the unnecessary pressure dispersion is suppressed to improve the mold quality. Let's do it. The filler 23 is coupled to the bottom of the holder base 11. Therefore, the structure of the ejecting system is simple, so that the size and weight of the ejecting system can be easily reduced, and thus, the manufacturing period and manufacturing cost can be reduced. In addition, the structure is simple, so there is little possibility of defects, the filler is eliminated, and the quality can be improved by the optimal design.
Description
제1도는 종래의 상형 몰딩다이 평면도.1 is a plan view of a conventional upper mold molding die.
제2도는 종래의 하형 몰딩다이 평면도.2 is a plan view of a conventional mold lowering die.
제3도는 종래의 상,하형 몰딩다이 결합도.Figure 3 is a conventional upper and lower molding die bond.
제4도는 종래의 상,하형 몰딩다이 부품 조립도.Figure 4 is a conventional top, bottom molding die assembly parts.
제5도는 종래의 상,하형 몰딩다이 상세도.5 is a detailed view of a conventional upper and lower molding die.
제6도는 본 고안의 상,하형 몰딩다이 결합상태도.6 is a coupling state of the upper and lower molding die of the present invention.
*도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings
11: 홀더베이스 12: 메인캐비티11: holder base 12: main cavity
13: 리턴핀 14: 이젝터핀13: Return pin 14: Ejector pin
15: 캐비티 20: 와셔스프링15: cavity 20: washer spring
21: 플로우팅핀 22: 핀플레이트21: floating pin 22: pin plate
본 고안은 반도체 몰딩다이에 관한 것으로, 특히 구조를 대폭적으로 간소화시켜 설계 및 제작이 용이하도록 한 몰딩다이에 관한 것이다.The present invention relates to a semiconductor molding die, and more particularly to a molding die that greatly simplifies the structure to facilitate design and fabrication.
종래에는 제1도 내지 제5도에 나타낸 바와 같이, 홀더베이스(13a, 13b)내에 메인캐비티(18a, 18b), 센터블럭(17a, 17b), 아웃사이드플레이트(12a, 12b) 및 세트블럭 (14a, 14b)등을 조립하고, 그 하단부에 핀플레이트(24a, 24b), 드라이브플레이트(23a, 23b), 이젝터핀(25a, 25b, 26), 리턴핀(11a, 11b) 및 쉴드스크류(27a, 27b)등을 구비하며, 압력을 전달하는 필러(15a, 15b)를 형성시킨다. 또한, 상기 메인캐비티(18a, 18b)에는 캐비티(16a, 16b), 게이트(22), 런너(21) 및 로케이션 핀(19)을 형성하고, 센터블럭(17a, 17b)에는 몰딩용 수지를 공급하는 포트(20)를 형성한다.Conventionally, as shown in FIGS. 1 to 5, the main cavities 18a and 18b, the center blocks 17a and 17b, the outside plates 12a and 12b and the set blocks in the holder bases 13a and 13b are shown. 14a, 14b, etc., and at the lower end thereof, pin plates 24a, 24b, drive plates 23a, 23b, ejector pins 25a, 25b, 26, return pins 11a, 11b, and shield screws 27a. 27b) and the like to form pillars 15a and 15b that transmit pressure. In addition, the main cavities 18a and 18b are formed with cavities 16a and 16b, gates 22, runners 21 and location pins 19, and molding resins are supplied to the center blocks 17a and 17b. A port 20 is formed.
이러한 종래의 고안은 리이드프레임 및 수지(Compound)가 몰딩다이에 셋팅되면, 하형이 프레스에 의하여 상부로 올라와 상형과 밀착된다. 상형과 하형의 밀착이 완료되면, 포트(20)에 저장된 수지를 플런저(Plunger)가 상승하여 위로 밀어올린다. 이때, 수지는 몰딩다이 온도에 의해 녹아 런너(21), 게이트(22)등을 통하여 캐비티(16a, 16b) 에 공급된다. 캐비티(16a, 16b)에 공급된 수지가 일정시간이 경과한후 경화되면 프레스를 하강시켜 상, 하형을 분리한다. 이때, 상형 이젝터핀(25a)과 결합된 리턴스프링의 탄성에 의하여 상기 이젝터핀(25a)이 튀어나오면서 성형된 제품을 밀어 금형으로부터 분리시킨다. 또한, 하형측도 프레스에 의하여 하강이 완료되면, 프레스의 이젝터시스템에 의하여 드라이브 플레이트(23b)를 위로 밀어올려 이젝터핀(25b)이 제품을 밀게 되므로서 금형으로부터 분리시킨다. 언로더에 의하여 제품의 이송이 끝나면 프레스가 홈 위치까지 상승하면서 이젝터핀(25b)은 원래 위치로 복원된다.This conventional design, when the lead frame and the resin (Compound) is set in the molding die, the lower mold is raised to the upper by the press close contact with the upper mold. When the close contact between the upper mold and the lower mold is completed, the plunger (Plunger) is raised to push up the resin stored in the port 20. At this time, the resin is melted by the molding die temperature and supplied to the cavities 16a and 16b through the runner 21, the gate 22, and the like. When the resin supplied to the cavities 16a and 16b is cured after a certain time has elapsed, the press is lowered to separate the upper and lower molds. At this time, the ejector pin 25a protrudes by the elasticity of the return spring coupled to the upper ejector pin 25a to push the molded product to separate from the mold. In addition, when the lower die side is also completed by the press, the drive plate 23b is pushed up by the ejector system of the press, and the ejector pin 25b pushes the product to separate from the mold. When the transfer of the product by the unloader is finished, the ejector pin 25b is restored to its original position while the press is raised to the home position.
그러나, 이러한 종래의 기술은 이젝팅 시스템이 복잡하여 이젝트핀 깊이 불량등이 대량으로 발생되고, 이젝팅 시스템의 존재로 인하여 몰딩다이의 크기가 대형화되어 취급이 용이하지 못할뿐 아니라 압력이 분산되는 결점이 있으며, 제작기간 및 비용이 많이 소요되는 문제점이 있었다.However, this conventional technique has a drawback in that the ejecting system is complicated and a large amount of eject pin depth defects are generated, and due to the existence of the ejecting system, the size of the molding die is increased, which makes it difficult to handle and the pressure is dispersed. There was a problem that takes a lot of production period and cost.
위와같은 목적을 달성하기 위하여 본 고안은 홀더베이스 내부에 이젝팅시스템과 별도의 플레이트를 설치하여 크기를 소형화 하고, 이젝팅 동작이 이루어지도록 구성함을 그 기술적 구성상의 기본 특징으로 한다.In order to achieve the above object, the present invention has a basic feature of the technical configuration that the size of the ejection system and a separate plate is installed in the holder base to reduce the size, and configured to perform the ejecting operation.
위와같이 구성된 본 고안의 실시예를 첨부된 도면을 참조하면서 자세히 설명하면 다음과 같다.When described in detail with reference to the accompanying drawings an embodiment of the present invention configured as described above are as follows.
제6도에 나타낸 바와 같이, 홀더베이스(11)내부에 핀플레이트(22)를 메인캐비티(12) 하단에 설치하고, 이젝터핀(14) 헤드하단에 와셔스프링(20)을 삽입하여 이젝팅 동작이 가능하도록 한다. 또한, 메인캐비티(12) 하형에 리턴핀(13)을 위치시켜 상,하형 결합시 리턴핀(13)의 후퇴에 의하여 적절한 이젝터핀(14)의 깊이를 유지하도록 한다. 상기 리턴핀(13)은 캐비티(15)를 중심으로 양측에 설치하는 것이 유리하다. 또한, 홀더베이스(11)와 메인캐비티(12)사이에 핀 플레이트(22)를 활용하여 탄성이 뛰어난 플로우팅(Floating) 핀(21)을 삽입하므로서 불필요한 압력분산을 억제하여 금형의 품질을 향상시킨다. 홀더베이스(11) 하단에는 필러(23)을 결합한다.As shown in FIG. 6, the pin plate 22 is installed at the lower end of the main cavity 12 in the holder base 11, and the washer spring 20 is inserted into the ejector pin 14 head to eject the ejecting operation. Make this possible. In addition, the return pin 13 is positioned on the lower mold of the main cavity 12 to maintain the proper ejector pin 14 by retreating the return pin 13 when the upper and lower molds are coupled. The return pin 13 is advantageously provided at both sides with respect to the cavity 15. In addition, by inserting the floating pin 21 having excellent elasticity by utilizing the pin plate 22 between the holder base 11 and the main cavity 12 to suppress unnecessary pressure dispersion to improve the quality of the mold. . The filler 23 is coupled to the bottom of the holder base 11.
이러한 본 고안은 상,하형이 밀착되면, 리턴핀(13)이 리턴동작하여 핀플레이트(22)를 밀게된다. 이때, 이젝터핀(14)도 함께 밀려 내려가게되어 하측에 설치된 와셔스프링(20)을 압축하게 되고, 리턴량은 제품에 적당한 이젝터핀(14)의 깊이로 조절되어 유지하게 된다. 또한, 필러(23)를 통하여 전달된 압력이 플로우팅 핀(21)에 작용하여 약간 압축시킴과 동시에 메인캐비티(12)의 중요부분에 압력을 집중전달하게 된다. 한편, 포트(19)내부에 저장된 수지가 녹으면, 런너(17)와 게이트(16)를 통하여 캐비티(15)로 흘러들어가 경화하게 되고, 경화가 완료되면 프레스에 의하여 상,하 금형이 분리하게 된다. 이때, 압축되어 있던 와셔스프링(20)의 탄성에 의하여 핀플레이트(22)가 리턴되므로서 이젝터핀(14)이 제품을 밀어 금형에서 분리시킨다.When the upper and lower molds are in close contact with the present invention, the return pin 13 returns to push the pin plate 22. At this time, the ejector pin 14 is also pushed down to compress the washer spring 20 installed on the lower side, the return amount is adjusted to maintain the depth of the ejector pin 14 suitable for the product. In addition, the pressure transmitted through the filler 23 acts on the floating pin 21 to compress slightly, and at the same time concentrates the pressure on an important part of the main cavity 12. On the other hand, when the resin stored in the pot 19 is melted, it flows into the cavity 15 through the runner 17 and the gate 16 to be cured. When the curing is completed, the upper and lower molds are separated by a press. do. At this time, the pin plate 22 is returned by the elasticity of the washer spring 20 that has been compressed, so that the ejector pin 14 pushes the product to separate it from the mold.
이상에서 살펴본 바와같이, 본 고안은 이젝팅 시스템의 구조가 간단하여 소형화, 경량화가 용이하고, 이에 따른 제작기간 및 제작비용을 줄일 수 있으며, 몰딩다이의 소형화로 프레스 크기의 축소가 용이하다. 또한, 구조가 간단하여 불량발생의 우려가 적고, 필러의 제약이 배제되어 최적의 설계에 의한 품질의 향상을 도모할 수 있는 것이다.As described above, the present invention has a simple structure of the ejecting system, so that the size and weight of the ejecting system can be easily reduced. As a result, the press size can be easily reduced due to the miniaturization of the molding die. In addition, the structure is simple, so there is little possibility of defects, the filler is eliminated, and the quality can be improved by the optimal design.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940021630U KR0119734Y1 (en) | 1994-08-25 | 1994-08-25 | Molding die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940021630U KR0119734Y1 (en) | 1994-08-25 | 1994-08-25 | Molding die |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960009277U KR960009277U (en) | 1996-03-16 |
| KR0119734Y1 true KR0119734Y1 (en) | 1998-08-01 |
Family
ID=19391554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940021630U KR0119734Y1 (en) | 1994-08-25 | 1994-08-25 | Molding die |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0119734Y1 (en) |
-
1994
- 1994-08-25 KR KR2019940021630U patent/KR0119734Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960009277U (en) | 1996-03-16 |
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