KR960032766U - 티엘형 반도체 패키지 - Google Patents

티엘형 반도체 패키지

Info

Publication number
KR960032766U
KR960032766U KR2019950006149U KR19950006149U KR960032766U KR 960032766 U KR960032766 U KR 960032766U KR 2019950006149 U KR2019950006149 U KR 2019950006149U KR 19950006149 U KR19950006149 U KR 19950006149U KR 960032766 U KR960032766 U KR 960032766U
Authority
KR
South Korea
Prior art keywords
type semiconductor
semiconductor package
package
type
semiconductor
Prior art date
Application number
KR2019950006149U
Other languages
English (en)
Other versions
KR200164521Y1 (ko
Inventor
노길섭
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019950006149U priority Critical patent/KR200164521Y1/ko
Publication of KR960032766U publication Critical patent/KR960032766U/ko
Application granted granted Critical
Publication of KR200164521Y1 publication Critical patent/KR200164521Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR2019950006149U 1995-03-30 1995-03-30 티엘형 반도체 패키지 KR200164521Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950006149U KR200164521Y1 (ko) 1995-03-30 1995-03-30 티엘형 반도체 패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950006149U KR200164521Y1 (ko) 1995-03-30 1995-03-30 티엘형 반도체 패키지

Publications (2)

Publication Number Publication Date
KR960032766U true KR960032766U (ko) 1996-10-24
KR200164521Y1 KR200164521Y1 (ko) 2000-01-15

Family

ID=19410381

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950006149U KR200164521Y1 (ko) 1995-03-30 1995-03-30 티엘형 반도체 패키지

Country Status (1)

Country Link
KR (1) KR200164521Y1 (ko)

Also Published As

Publication number Publication date
KR200164521Y1 (ko) 2000-01-15

Similar Documents

Publication Publication Date Title
DE69518935D1 (de) Halbleiterpackung
KR960038755U (ko) 반도체 패키지
KR960032766U (ko) 티엘형 반도체 패키지
KR970046772U (ko) 반도체 패키지
KR970019769U (ko) 반도체 패키지
KR970046932U (ko) 반도체패키지
KR970046979U (ko) 반도체패키지 구조
KR970003287U (ko) 반도체 패키지
KR960035636U (ko) 반도체 시엘시시 패키지
KR970025866U (ko) 반도체 패키지
KR970046902U (ko) 반도체 패키지
KR970025863U (ko) 반도체 패키지
KR970046904U (ko) 반도체 패키지
KR970046905U (ko) 반도체 패키지
KR960032765U (ko) 반도체 패키지
KR970025862U (ko) 반도체 패키지
KR970025861U (ko) 반도체 패키지
KR970025860U (ko) 반도체 패캐이지
KR970025859U (ko) 반도체 패키이지
KR970019768U (ko) 반도체 패키지
KR970015329U (ko) 반도체 패키지
KR970007239U (ko) 반도체 패키지
KR970003288U (ko) 반도체 패키지
KR970046913U (ko) 반도체 패키지
KR970046955U (ko) 반도체 패키지

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090922

Year of fee payment: 11

EXPY Expiration of term