KR960029742U - 캐패시터를 구비한 패키지 - Google Patents
캐패시터를 구비한 패키지Info
- Publication number
- KR960029742U KR960029742U KR2019950003312U KR19950003312U KR960029742U KR 960029742 U KR960029742 U KR 960029742U KR 2019950003312 U KR2019950003312 U KR 2019950003312U KR 19950003312 U KR19950003312 U KR 19950003312U KR 960029742 U KR960029742 U KR 960029742U
- Authority
- KR
- South Korea
- Prior art keywords
- capacitor
- package
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950003312U KR0128229Y1 (ko) | 1995-02-27 | 1995-02-27 | 캐패시터를 구비한 패키지 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950003312U KR0128229Y1 (ko) | 1995-02-27 | 1995-02-27 | 캐패시터를 구비한 패키지 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960029742U true KR960029742U (ko) | 1996-09-17 |
| KR0128229Y1 KR0128229Y1 (ko) | 1998-10-15 |
Family
ID=19408501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950003312U KR0128229Y1 (ko) | 1995-02-27 | 1995-02-27 | 캐패시터를 구비한 패키지 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0128229Y1 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100945501B1 (ko) * | 2007-03-15 | 2010-03-09 | 주식회사 하이닉스반도체 | 반도체 패키지 |
-
1995
- 1995-02-27 KR KR2019950003312U patent/KR0128229Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR0128229Y1 (ko) | 1998-10-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20040719 Year of fee payment: 7 |
|
| LAPS | Lapse due to unpaid annual fee |