KR960026721A - Marking method of semiconductor package - Google Patents

Marking method of semiconductor package Download PDF

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Publication number
KR960026721A
KR960026721A KR1019940037167A KR19940037167A KR960026721A KR 960026721 A KR960026721 A KR 960026721A KR 1019940037167 A KR1019940037167 A KR 1019940037167A KR 19940037167 A KR19940037167 A KR 19940037167A KR 960026721 A KR960026721 A KR 960026721A
Authority
KR
South Korea
Prior art keywords
ink
coated
semiconductor package
package
marking
Prior art date
Application number
KR1019940037167A
Other languages
Korean (ko)
Inventor
김리훈
Original Assignee
황인길
아남산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황인길, 아남산업 주식회사 filed Critical 황인길
Priority to KR1019940037167A priority Critical patent/KR960026721A/en
Publication of KR960026721A publication Critical patent/KR960026721A/en

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Abstract

본 발명은 반도체 패키지의 마킹방법에 관한 것으로서, 합성수지재로된 반도체 패키지(1)의 패키지(2) 표면에 묻은 이물질 또는 잘못된 마킹을 제거하고 코팅잉크의 접착력 증대성을 향상시킬 수 있도록 적정한 온도로 가열시킨 다음, 마킹되는 패키지 표면(2)에 적정량(㎛)의 코팅잉크(3)를 코팅한 후, 코팅된 잉크를 소정시간 건조시킨다음, 코팅된 잉크(3)의 표면에 레이저 또는 잉크로 마킹할 수 있도록 하므로서 마킹된 문자 및 도형의 선명성을 높이고, 마킹작업시 잘못된 마킹부의 재작업을 용이하게 실시할 수 있으며, 반도체 패키지 제품의 외관품질을 향상시킬 수 있는 것이다.The present invention relates to a method for marking a semiconductor package, and to remove foreign substances or incorrect markings on the surface of the package (2) of the semiconductor package (1) made of a synthetic resin material at an appropriate temperature to improve adhesion of the coating ink. After heating, a suitable amount (μm) of coating ink 3 is coated on the package surface 2 to be marked, and then the coated ink is dried for a predetermined time, and then a laser or ink is applied to the surface of the coated ink 3. By making it possible to mark, it is possible to increase the sharpness of the marked characters and figures, to easily rework the wrong marking part during the marking work, and to improve the appearance quality of the semiconductor package product.

Description

반도체패키지의 마킹방법Marking method of semiconductor package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (2)

합성수지재로된 반도체 패키지(1)의 패키지(2) 표면에 묻은 이물질 또는 잘못된 마킹을 제거하고 코팅잉크의 접착력 증대성을 향상시킬 수 있도록 적정한 온도로 가열시킨 다음, 마킹되는 패키지 표면(2)레 적정량(㎛)의 코팅잉크(3)를 코팅한 후, 코팅된 코팅잉크(3)를 소정시간 건조시킨다음, 코팅된 잉크(3)의 표면에 레이저 또는 잉크로 마킹할 수 있도록 한 것을 특징으로 하는 반도체 패키지의 마킹방법.The package surface (2) which is marked by heating to an appropriate temperature so as to remove foreign substances or wrong markings on the surface of the package 2 of the synthetic resin material 1 and improve the adhesion increaseability of the coating ink. After coating an appropriate amount (μm) of the coating ink (3), the coated coating ink (3) is dried for a predetermined time, characterized in that the surface of the coated ink (3) can be marked with a laser or ink A method of marking a semiconductor package. 제1항에 있어서, 상기 패키지(2) 표면에 코팅되는 코팅잉크(3)는 발광성이 좋은 것을 코팅하여 된 것을 특징으로 하는 반도체 패키지의 마킹방법.The method for marking a semiconductor package according to claim 1, wherein the coating ink (3) coated on the surface of the package (2) is coated with a good luminous property. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940037167A 1994-12-27 1994-12-27 Marking method of semiconductor package KR960026721A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940037167A KR960026721A (en) 1994-12-27 1994-12-27 Marking method of semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940037167A KR960026721A (en) 1994-12-27 1994-12-27 Marking method of semiconductor package

Publications (1)

Publication Number Publication Date
KR960026721A true KR960026721A (en) 1996-07-22

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ID=66769474

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940037167A KR960026721A (en) 1994-12-27 1994-12-27 Marking method of semiconductor package

Country Status (1)

Country Link
KR (1) KR960026721A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100480834B1 (en) * 2002-11-27 2005-04-07 앰코 테크놀로지 코리아 주식회사 Permanent-tape structure for laser marking
KR100942635B1 (en) * 2008-01-30 2010-02-17 (주)한빛레이저 Pack coating laser marking method for marking recognition.
CN114192989A (en) * 2021-11-30 2022-03-18 深圳市裕展精密科技有限公司 Method for printing code on base material and code printing equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100480834B1 (en) * 2002-11-27 2005-04-07 앰코 테크놀로지 코리아 주식회사 Permanent-tape structure for laser marking
KR100942635B1 (en) * 2008-01-30 2010-02-17 (주)한빛레이저 Pack coating laser marking method for marking recognition.
CN114192989A (en) * 2021-11-30 2022-03-18 深圳市裕展精密科技有限公司 Method for printing code on base material and code printing equipment

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