KR960026714A - Mold mold structure for semiconductor package - Google Patents

Mold mold structure for semiconductor package Download PDF

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Publication number
KR960026714A
KR960026714A KR1019940038872A KR19940038872A KR960026714A KR 960026714 A KR960026714 A KR 960026714A KR 1019940038872 A KR1019940038872 A KR 1019940038872A KR 19940038872 A KR19940038872 A KR 19940038872A KR 960026714 A KR960026714 A KR 960026714A
Authority
KR
South Korea
Prior art keywords
mold
compound
lead frame
gate
semiconductor package
Prior art date
Application number
KR1019940038872A
Other languages
Korean (ko)
Other versions
KR0167145B1 (en
Inventor
문영업
Original Assignee
황인길
아남산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황인길, 아남산업 주식회사 filed Critical 황인길
Priority to KR1019940038872A priority Critical patent/KR0167145B1/en
Publication of KR960026714A publication Critical patent/KR960026714A/en
Application granted granted Critical
Publication of KR0167145B1 publication Critical patent/KR0167145B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

Abstract

본 발명은 반도체 패키지를 성형하는 몰드금형의 구조에 대한 것으로, 특히 리드프레임의 사이드레일 모서리를 곡선으로 가공한 챔퍼형 리드프레임의 몰드성형시 사이드레일의 모서리부분을 통해 컴파운드가 누출되는 것을 방지토록 한 것으로, 본 발명에서는 게이트(3)가 형성된 몰드금형(1)(2)의 최외곽게이트(3a)에 인접하여 홀(4)을 관통 설치하고 상기 홀(4)에 컴파운드 누출방지용 핀(5)을 삽입 설치하여 상기 최외곽게이트(3a)에 당접하는 챔퍼형 리드프레임(10)을 형성하는 사이드레일(11)의 모서리부분(11a)을 막아주도록 함으로써 몰드시 컴파운드의 노출을 미연에 방지토록 하여 몰드효율을 높이고 제품의 생산원가를 대폭 절감할 수 있는 범용성의 몰드금형을 제공하게 되는 것이다.The present invention relates to a structure of a mold mold for molding a semiconductor package, and in particular, to prevent the compound from leaking through the corner portion of the side rail during mold molding of the chamfer type lead frame, which is processed by curved the side rail edge of the lead frame. In one embodiment of the present invention, a hole (4) penetrates adjacent to the outermost gate (3a) of the mold mold (1) (2) on which the gate (3) is formed, and a compound leak-proof pin (5) is formed in the hole (4). ) To prevent the exposure of the compound at the time of molding by inserting and blocking the edge 11a of the side rail 11 forming the chamfered lead frame 10 in contact with the outermost gate 3a. It is to provide a universal mold mold that can increase the mold efficiency and significantly reduce the production cost of the product.

Description

반도체 패키지용 몰드금형구조Mold mold structure for semiconductor package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (2)

상하부 몰드금형(1)(2) 사이에 와이어본딩 처리된 자재(리드프레임의 패드위에 반도체 칩을 탑재하고 반도체칩과 내부리드를 와이어를 연결한 것)를 세팅하여 상부몰드금형(1) 또는 하부몰드금형(2) 상에 형성된 게이트(3)를 통해 컴파운드(열경화성수지)를 밀어넣어 일정형의 반도체 패키지를 형성하는 몰드금형(1)(2)을 구성함에 있어서, 게이트(3)가 형성된 몰드금형(1)(2)의 최외곽게이트(3a)에 인접하여 홀(4)을 관통 설치하고, 상기 홀(4)에 컴파운드 누출방지용 핀(5)을 삽입 설치하여 상기 최외곽게이트(3a)에 당접하는 챔퍼형 리드프레임(10)을 형성하는 사이드레일(11)의 모서리부분(11a)을 압착하여 막아줌으로써 컴파운트의 누출을 방지함을 특징으로 하는 반도체 패키지용 몰드금형구조.Upper mold mold (1) or lower part by setting wire bonded material between upper and lower mold mold (1) (2) (with semiconductor chip mounted on lead frame pad and connecting semiconductor chip and inner lead with wire) In forming the mold mold (1) (2) in which a compound (thermosetting resin) is pushed through the gate (3) formed on the mold mold (2) to form a predetermined semiconductor package, the mold on which the gate (3) is formed The hole 4 is penetrated adjacent to the outermost gate 3a of the mold 1 and 2, and a compound leakage preventing pin 5 is inserted into the hole 4 to install the outermost gate 3a. A mold mold structure for a semiconductor package, characterized by preventing the leakage of the compound by pressing and preventing the edge portion (11a) of the side rail (11) forming the chamfer-shaped lead frame (10) in contact with. 제1항에 있어서, 상기 홀(4)에 삽입 설치되는 컴파운드 누출방지용 핀(5)의 선단면(51) 돌출높이가 챔퍼형 리드프레임(10)의 두께 이하가 되도록 함을 특징으로 하는 반도체 패키지용 몰드금형 구조.The semiconductor package according to claim 1, wherein the protruding height of the front end surface (51) of the compound leakage preventing pin (5) inserted into the hole (4) is less than or equal to the thickness of the chamfered lead frame (10). Mold mold structure. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940038872A 1994-12-29 1994-12-29 Semiconductor package type mold precision structure KR0167145B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940038872A KR0167145B1 (en) 1994-12-29 1994-12-29 Semiconductor package type mold precision structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940038872A KR0167145B1 (en) 1994-12-29 1994-12-29 Semiconductor package type mold precision structure

Publications (2)

Publication Number Publication Date
KR960026714A true KR960026714A (en) 1996-07-22
KR0167145B1 KR0167145B1 (en) 1998-12-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940038872A KR0167145B1 (en) 1994-12-29 1994-12-29 Semiconductor package type mold precision structure

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KR (1) KR0167145B1 (en)

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* Cited by examiner, † Cited by third party
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KR20220109359A (en) 2022-07-18 2022-08-04 이우성 Fire and Disaster Prevention System with Rotating Nozzle

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KR0167145B1 (en) 1998-12-15

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