KR960026399U - 접착제 도포용 헤드 장치 - Google Patents

접착제 도포용 헤드 장치

Info

Publication number
KR960026399U
KR960026399U KR2019940037053U KR19940037053U KR960026399U KR 960026399 U KR960026399 U KR 960026399U KR 2019940037053 U KR2019940037053 U KR 2019940037053U KR 19940037053 U KR19940037053 U KR 19940037053U KR 960026399 U KR960026399 U KR 960026399U
Authority
KR
South Korea
Prior art keywords
head device
adhesive application
adhesive
application
head
Prior art date
Application number
KR2019940037053U
Other languages
English (en)
Other versions
KR0129459Y1 (ko
Inventor
정상헌
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR2019940037053U priority Critical patent/KR0129459Y1/ko
Publication of KR960026399U publication Critical patent/KR960026399U/ko
Application granted granted Critical
Publication of KR0129459Y1 publication Critical patent/KR0129459Y1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
KR2019940037053U 1994-12-28 1994-12-28 접착제 도포용 헤드 장치 KR0129459Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940037053U KR0129459Y1 (ko) 1994-12-28 1994-12-28 접착제 도포용 헤드 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940037053U KR0129459Y1 (ko) 1994-12-28 1994-12-28 접착제 도포용 헤드 장치

Publications (2)

Publication Number Publication Date
KR960026399U true KR960026399U (ko) 1996-07-22
KR0129459Y1 KR0129459Y1 (ko) 1998-12-15

Family

ID=19403754

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940037053U KR0129459Y1 (ko) 1994-12-28 1994-12-28 접착제 도포용 헤드 장치

Country Status (1)

Country Link
KR (1) KR0129459Y1 (ko)

Also Published As

Publication number Publication date
KR0129459Y1 (ko) 1998-12-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050727

Year of fee payment: 8

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