KR960026366A - - Google Patents

Info

Publication number
KR960026366A
KR960026366A KR19950048195A KR19950048195A KR960026366A KR 960026366 A KR960026366 A KR 960026366A KR 19950048195 A KR19950048195 A KR 19950048195A KR 19950048195 A KR19950048195 A KR 19950048195A KR 960026366 A KR960026366 A KR 960026366A
Authority
KR
South Korea
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR19950048195A
Other languages
Korean (ko)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR960026366A publication Critical patent/KR960026366A/ko
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58After-treatment
    • C23C14/5826Treatment with charged particles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • H10P14/6924
    • H10W20/098
    • H10P14/6336
    • H10P14/6682
    • H10P14/6686
    • H10P14/6922

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR19950048195A 1994-12-13 1995-12-11 Ceased KR960026366A (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6332603A JPH08167601A (ja) 1994-12-13 1994-12-13 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
KR960026366A true KR960026366A (cg-RX-API-DMAC10.html) 1996-07-22

Family

ID=18256802

Family Applications (1)

Application Number Title Priority Date Filing Date
KR19950048195A Ceased KR960026366A (cg-RX-API-DMAC10.html) 1994-12-13 1995-12-11

Country Status (3)

Country Link
US (2) US5700736A (cg-RX-API-DMAC10.html)
JP (1) JPH08167601A (cg-RX-API-DMAC10.html)
KR (1) KR960026366A (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08167601A (ja) 1994-12-13 1996-06-25 Sony Corp 半導体装置の製造方法
JP3641869B2 (ja) * 1996-03-19 2005-04-27 ソニー株式会社 半導体装置の製造方法
US6284677B1 (en) * 1997-04-18 2001-09-04 United Semiconductor Corp. Method of forming fluorosilicate glass (FSG) layers with moisture-resistant capability
US6008540A (en) * 1997-05-28 1999-12-28 Texas Instruments Incorporated Integrated circuit dielectric and method
JP2000003909A (ja) * 1998-06-15 2000-01-07 Kishimoto Sangyo Co Ltd 半導体デバイス用絶縁膜および半導体デバイス
US6403464B1 (en) 1999-11-03 2002-06-11 Taiwan Semiconductor Manufacturing Company Method to reduce the moisture content in an organic low dielectric constant material
US6716770B2 (en) 2001-05-23 2004-04-06 Air Products And Chemicals, Inc. Low dielectric constant material and method of processing by CVD
US7074489B2 (en) * 2001-05-23 2006-07-11 Air Products And Chemicals, Inc. Low dielectric constant material and method of processing by CVD

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2697315B2 (ja) * 1991-01-23 1998-01-14 日本電気株式会社 フッ素含有シリコン酸化膜の形成方法
JP2699695B2 (ja) 1991-06-07 1998-01-19 日本電気株式会社 化学気相成長法
JPH05226480A (ja) * 1991-12-04 1993-09-03 Nec Corp 半導体装置の製造方法
JP2773530B2 (ja) * 1992-04-15 1998-07-09 日本電気株式会社 半導体装置の製造方法
US5492736A (en) * 1994-11-28 1996-02-20 Air Products And Chemicals, Inc. Fluorine doped silicon oxide process
JPH08167601A (ja) 1994-12-13 1996-06-25 Sony Corp 半導体装置の製造方法
US5807785A (en) * 1996-08-02 1998-09-15 Applied Materials, Inc. Low dielectric constant silicon dioxide sandwich layer
US5827785A (en) * 1996-10-24 1998-10-27 Applied Materials, Inc. Method for improving film stability of fluorosilicate glass films
US5908672A (en) * 1997-10-15 1999-06-01 Applied Materials, Inc. Method and apparatus for depositing a planarized passivation layer
US5876798A (en) * 1997-12-29 1999-03-02 Chartered Semiconductor Manufacturing, Ltd. Method of fluorinated silicon oxide film deposition

Also Published As

Publication number Publication date
JPH08167601A (ja) 1996-06-25
US5700736A (en) 1997-12-23
US6169023B1 (en) 2001-01-02

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Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000