KR960025859A

KR960025859A - Formation method of lead for cathode extraction of tantalum capacitor

Info

Publication number: KR960025859A
Application number: KR1019940034178A
Authority: KR
Inventors: 최강식
Original assignee: 서두칠; 대우전자부품 주식회사
Priority date: 1994-12-14
Filing date: 1994-12-14
Publication date: 1996-07-20

Abstract

본 발명은 남땜시 납(Pb)속에 은(Ag)입자가 고용되는 리칭(Leaching)현상을 방지하기 위하여 납의 조성을 변화시킨 탄탈 콘덴서의 음극 인출용 납의 조성방법에 관한 것으로 팁형 탄탈 콘덴서에 음극 리드선을 인출하기 위하여 납땜하는 경우 사용되는 납의 조성은 2∼4%의 은(Ag)과 75∼90%의 주석(Sn), 10∼21%의 납(Pb)으로 구성된 합금으로 탄탈 콘덴서의 펠릿의 외주연에 MnO₂층을 형성하고 상기 MnO₂층의 외주연에 카본(Carbon)과 은(Ag)의 결합층을 형성하고 상기 결합층의 일측에 음극 리드선이 납땜되어 결합되었으나 상기 조성의 납으로 음극 리드선을 납땜하면 납(Pb)속에 은(Ag) 입자가 고용되는 리칭(Leaching) 현상이 발생하여 탄탈 콘덴서의 특성인 손실각의 정점이 증가하고 기판에 콘덴서를 장착할 때 용융점이 낮아 인두등으로 가열함에 따라 열이 전달되어 탄탈 콘덴서의 불량을 초래하는 문제점이 있어왔던바 음극 리드선을 납땜하는 납의 조성을 은(Ag)과 주석(Pb)으로 이루어진 2원함금으로 구성하여 납(Pb)을 포함하지 않게 하므로서 리칭현상을 방지하고 종전의 조성으로 현성된 납보다 용융점을 15℃ 이상 높은 219℃로 유지하여 PCB 기판에 콘덴서를 장착할 때 열의 전달을 늦추어 탄탈 콘덴서의 불량을 방지 할 수 있는 납을 제공하므로서 탄탈 콘덴서의 특성을 향상시키는 효과는 갖는 탄탈 콘덴서의 음극 인출용 납의 조성방법에 관한 발명이다.The present invention relates to a method for forming lead for cathode withdrawal of a tantalum capacitor in which lead composition is changed in order to prevent a leaching phenomenon in which silver (Ag) particles are dissolved in lead (Pb) during soldering. The lead used in soldering for drawing is an alloy composed of 2-4% silver (Ag), 75-90% tin (Sn), and 10-21% lead (Pb). A MnO ₂ layer was formed on the periphery, and a bonding layer of carbon and silver was formed on the outer periphery of the MnO ₂ layer, and a cathode lead wire was soldered to one side of the bonding layer, but the cathode was formed of lead. When soldering a lead wire, a leaching phenomenon occurs in which silver particles are dissolved in lead, thereby increasing the peak of the loss angle characteristic of the tantalum capacitor, and lowering the melting point when the capacitor is mounted on the substrate. As it heats up, heat is transferred There has been a problem that causes the defect of the tantalum capacitor. The composition of the lead soldering the cathode lead wire is composed of a binary alloy composed of silver (Ag) and tin (Pb), so that it does not contain lead (Pb), thereby preventing the leaching phenomenon. Improved the properties of tantalum capacitors by maintaining the melting point at 219 ° C, which is 15 ° C or more higher than conventional lead, and providing lead that prevents defects of tantalum capacitors by delaying heat transfer when mounting capacitors on PCBs. The effect to make is the invention regarding the composition method of the lead for cathode extraction of a tantalum capacitor which has.

Description

Formation method of lead for cathode extraction of tantalum capacitor

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도 (A)는 종래의 납땜시 탄탈 콘덴서의 손실각의 정점을 나타내는 그래프, (B)는 본 발명에 의한 납땜시 탄탈 콘덴서의 손실각의 정점을 나타내는 그래프.2 (A) is a graph showing the peak of the loss angle of the conventional tantalum capacitor during soldering, (B) is a graph showing the peak of the loss angle of the tantalum capacitor during soldering according to the present invention.

Claims

A component of lead 8 which solders the cathode lead wire 2 of the tantalum capacitor to the pellets 4 is formed of a binary alloy composed of 2-3% silver (Ag) and 97-98% tin (Sn). A method of forming lead for the cathode withdrawal of a tantalum capacitor, characterized in that.

※ Note: The disclosure is based on the initial application.