KR960024678A - Wafer exposure method and apparatus therefor - Google Patents

Wafer exposure method and apparatus therefor Download PDF

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Publication number
KR960024678A
KR960024678A KR1019940033044A KR19940033044A KR960024678A KR 960024678 A KR960024678 A KR 960024678A KR 1019940033044 A KR1019940033044 A KR 1019940033044A KR 19940033044 A KR19940033044 A KR 19940033044A KR 960024678 A KR960024678 A KR 960024678A
Authority
KR
South Korea
Prior art keywords
reticle
wafer
exposure
wafer exposure
exposure method
Prior art date
Application number
KR1019940033044A
Other languages
Korean (ko)
Other versions
KR0129123B1 (en
Inventor
최원수
Original Assignee
문정환
Lg 반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 문정환, Lg 반도체주식회사 filed Critical 문정환
Priority to KR1019940033044A priority Critical patent/KR0129123B1/en
Publication of KR960024678A publication Critical patent/KR960024678A/en
Application granted granted Critical
Publication of KR0129123B1 publication Critical patent/KR0129123B1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

본 발명은 웨이퍼 노광 방법 및 노광 장치에 관한 것으로, 웨이퍼 에지상의 사용할 수 없는 부분의 노광방향을 바꾸어 진행하여 동일 웨이퍼상에서 사용가능한 넬 다이의 갯수를 증가시키도록한 웨이퍼 노광 방법과, 이러한 노광 방법이 실현될수 있도록 기존의 레티클로딩 시스템에 회전기능을 부가시키는 것을 특징으로 한다.BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a wafer exposure method and an exposure apparatus, wherein the wafer exposure method wherein the exposure direction of the unusable portion on the wafer edge is changed to increase the number of usable dies on the same wafer, It is characterized by adding the rotation function to the existing reticle system to be realized.

Description

웨이퍼 노광 방법 및 그 장치Wafer exposure method and apparatus therefor

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명의 레티클 회전부를 부가한 레티클 체인저를 도시한 도면.3 shows a reticle changer with a reticle rotation of the invention.

Claims (4)

웨이퍼 노광 방법에 있어서, 웨이퍼 노광시에 일정방향으로 노광을 진행하다가 상기 웨이퍼의 에지부분을노광할 때에 필요에 따라 레티클을 90°로 회전시켜 노광하여 웨이퍼 상에 넬 다이의 수를 증가시키는 것을 특징으로 하는 웨이퍼 노광 방법.A method of exposing a wafer, wherein the exposure is performed in a predetermined direction at the time of exposure of the wafer, and when the edge portion of the wafer is exposed, the reticle is rotated by 90 ° to be exposed to increase the number of channel dies on the wafer. Wafer exposure method. 여러 형태의 레티클을 보관하는 레티클 카세트와, 상기 레티클 카세트로부터 레티클을 골라 채택하는 레티클 체인저와, 상기 레티클 체인저로부터 레티클을 받아 장착하는 레티클 스테이지를 구비하여 이루어진 레티클 로딩 시스템을 가지는 웨이퍼 노광 장치에 있어서, 상기 레티클 체인저에 상기 레티클을 회전시키는 기능을 가진 레티클 회전부를부가하여 형성시킨 것을 특징으로 하는 웨이퍼 노광 장치.A wafer exposure apparatus having a reticle loading system including a reticle cassette for storing various types of reticles, a reticle changer for selecting a reticle from the reticle cassette, and a reticle stage for receiving and mounting a reticle from the reticle changer. And a reticle rotating part having a function of rotating the reticle to the reticle changer. 제2항에 있어서, 상기 레티클 회전부를 별도의 장치로 레티클 로딩 시스템에 부가하여 레티클 로딩 시스템을 형성시키는 것을 특징으로 하는 웨이퍼 노광 장치.The wafer exposure apparatus of claim 2, wherein the reticle rotation is added to the reticle loading system by a separate device to form a reticle loading system. 제2항에 있어서, 상기 레티클에 센싱할 수 있는 레티클 셋팅 마크를 4변에 형성시키는 것을 특징으로 하는 웨이퍼 노광 장치.The wafer exposure apparatus according to claim 2, wherein reticle setting marks which can be sensed on the reticle are formed on four sides. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940033044A 1994-12-07 1994-12-07 Wafer exposure method and apparatus thereof KR0129123B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940033044A KR0129123B1 (en) 1994-12-07 1994-12-07 Wafer exposure method and apparatus thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940033044A KR0129123B1 (en) 1994-12-07 1994-12-07 Wafer exposure method and apparatus thereof

Publications (2)

Publication Number Publication Date
KR960024678A true KR960024678A (en) 1996-07-20
KR0129123B1 KR0129123B1 (en) 1998-04-04

Family

ID=19400518

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940033044A KR0129123B1 (en) 1994-12-07 1994-12-07 Wafer exposure method and apparatus thereof

Country Status (1)

Country Link
KR (1) KR0129123B1 (en)

Also Published As

Publication number Publication date
KR0129123B1 (en) 1998-04-04

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