KR960022792A - Moisture hardening type epoxy resin composition and coating composition containing same - Google Patents

Moisture hardening type epoxy resin composition and coating composition containing same Download PDF

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KR960022792A
KR960022792A KR1019940039942A KR19940039942A KR960022792A KR 960022792 A KR960022792 A KR 960022792A KR 1019940039942 A KR1019940039942 A KR 1019940039942A KR 19940039942 A KR19940039942 A KR 19940039942A KR 960022792 A KR960022792 A KR 960022792A
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group
epoxy resin
resin composition
general formula
moisture
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KR1019940039942A
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KR100324643B1 (en
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채승미
유창준
김세경
백기훈
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김충세
고려화학 주식회사
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/302—Water
    • C08G18/307—Atmospheric humidity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Paints Or Removers (AREA)

Abstract

본 발명은 방식 특성이 우수하며 녹면이 직접 도장할 수 있는 습식 경화형의 에폭시기 수지 조성물과 이를 함유한 도료조성물에 관한 것으로서, 좀 더 구체적으로는 다음의 일반식(I)로 표시되는 수지(성분A)와 케티민류의 에폭시 경화제(성분 B)의 혼합물로 이루어진 습기경화형 애폭시수지 조성물에 관한 것이다.The present invention relates to a wet-curable epoxy-based resin composition and a paint composition containing the same, which are excellent in anticorrosive properties and can be directly coated by green wool, and more specifically, a resin represented by the following general formula (I) (component A) The present invention relates to a moisture-curable epoxy resin composition composed of a mixture of an epoxy curing agent (component B) of) and ketimines.

상기 식(I)에서 R1은 비스페놀 A형 또는 F형의 구조로서 포화되거나 치환기로서 알킬기 또는 아릴기를 포함할 수 있으며, 주기율표상의 V족, VI족 VII족의 비금속원소를 치환기로 포함할 수 있고, R2는 탄소수 5이상의 알킬렌기, 아릴렌기 또는 시클로알킬렌기 또는 선형의 고무 탄성체로 다음의 일반식(II)로 표시될 수 있다.In Formula (I), R 1 may be saturated as a bisphenol A or F structure or may include an alkyl group or an aryl group as a substituent, and may include a nonmetallic element of Group V or Group VII on the periodic table as a substituent. , R 2 is an alkylene group having 5 or more carbon atoms, an arylene group or a cycloalkylene group or a linear rubber elastomer, and may be represented by the following general formula (II).

상기 식(II)에서 R3는 탄소수 6~20의 알킬렌기, 아릴렌기 또는 시클로알킬렌기로서 주기율표상의 V족, VI족 또는 VII족의 비금속 원소를 치환기로 포함할 수 있으며, R4는 양말단 히드록실기의 선형 고무탄성체이고, m은 0을 포함한 양의 정수이다.In Formula (II), R 3 is an alkylene group, arylene group, or cycloalkylene group having 6 to 20 carbon atoms and may include a nonmetallic element of Group V, VI, or VII on the periodic table as a substituent, and R 4 is a sock end It is a linear rubber elastic body of a hydroxyl group, m is a positive integer containing 0.

Description

습기경화형 에폭시수지 조성물과 이를 함유하는 도료조성물Moisture hardening type epoxy resin composition and coating composition containing same

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (8)

다음의 일반식(I)로 표시되는 수지(성분A)와 케티민류의 에폭시 경화제(성분 B)의 혼합물로 이루어진 습식경화형 애폭시수지 조성물에 관한 것이다.The wet hardening type epoxy resin composition which consists of a mixture of resin (component A) represented by the following general formula (I) and an epoxy hardening | curing agent (component B) of ketimines. 상기 식(I)에서 R1은 비스페놀 A형 또는 F형의 구조로서 포화되거나 치환기로서 알킬기 또는 아릴기를 포함할 수 있으며, 주기율표상의 V족, VI족 VII족의 비금속원소를 치환기로 포함할 수 있고, R2는 탄소수 6이상의 알킬렌기, 아릴렌기 또는 시클로알킬렌기 또는 선형의 고무 탄성체로 다음의 일반식(II)로 표시될 수 있다.In Formula (I), R 1 may be saturated as a bisphenol A or F structure or may include an alkyl group or an aryl group as a substituent, and may include a nonmetallic element of Group V or Group VII on the periodic table as a substituent. , R 2 is an alkylene group having 6 or more carbon atoms, an arylene group or a cycloalkylene group or a linear rubber elastomer, and may be represented by the following general formula (II). 상기 식(II)에서 R3는 탄소수 6~20의 알킬렌기, 아릴렌기 또는 시클로알킬렌기로서 주기율표상의 V족, VI족 또는 VII족의 비금속 원소를 치환기로 포함할 수 있으며, R4는 양말단 히드록실기의 선형 고무탄성체이고, m은 0을 포함한 양의 정수이다.In Formula (II), R 3 is an alkylene group, arylene group, or cycloalkylene group having 6 to 20 carbon atoms and may include a nonmetallic element of Group V, VI, or VII on the periodic table as a substituent, and R 4 is a sock end It is a linear rubber elastic body of a hydroxyl group, m is a positive integer containing 0. 제1항에 있어서, 상기 R4는 500~10,000의 수평균 분자량을 가지며 선형구조임을 특징으로 하는 습기경화형 에폭기수지 조성물.The moisture-curable epoxy resin composition of claim 1, wherein R 4 has a number average molecular weight of 500 to 10,000 and a linear structure. 제1항에 있어서, 상기 일반식(I)로 표시되는 성분 A는 이소시아네이트 함량이 5%이하임을 특징으로 하는 습기경화형 에폭시수지 조성물.The moisture-curable epoxy resin composition according to claim 1, wherein component A represented by the general formula (I) has an isocyanate content of 5% or less. 제1항에 있어서, 상기 일반식(I)로 표시되는 성분 A는 에폭시 당량이 2,500 이하임을 특징으로 하는 습기경화형 에폭시수지 조성물.The moisture-curable epoxy resin composition according to claim 1, wherein component A represented by the general formula (I) has an epoxy equivalent of 2,500 or less. 제1항에 있어서, 상기 케티민류의 에폭시 경화제가 1급 및 2급 아민기를 포함하지 않는 것임을 특징으로 하는 습기경화형 에폭기수지 조성물.The moisture curing type epoxy resin composition according to claim 1, wherein the epoxy curing agent of ketimines does not contain primary and secondary amine groups. 제1항에 있어서, 상기 성분 A와 성분 B는 1:2.0~0.5의 당량비로 혼합됨을 특징으로 하는 습기경화형 에폭시수지 조성물.The moisture-curable epoxy resin composition according to claim 1, wherein the component A and the component B are mixed in an equivalent ratio of 1: 2.0 to 0.5. 도료 100주량부에 대해 제1항 내지 제6항 중 어느 한 항에 따른 습기형화형 에폭시수지 조성물 15~60중량부가 함유된 습기경화형 도료 조성물.A moisture-curable coating composition containing 15 to 60 parts by weight of the moisture-curable epoxy resin composition according to any one of claims 1 to 6, based on 100 parts by weight of the paint. 다음이 일반식(III)으로 표시되느 디이소시아네이트 화합물과 다음의 일반식(IV)로 표시되는 디올 화합물을 당량비 2:1로 혼합하여 50~100℃에서 1차 우레탄 형성 반응시켜 다음의 일반식(V)로 표시되는 양말단 이소시아네이트 우레탄 선중합체를 제조한 다음, 여기에 다음의 일반식(VI)로 표시되는 비스페놀 A형 에폭시수지를 혼합하여 80~130℃의 온도범위에서 2차 우레탄 형성 반응시켜 다음의 일반식(I)로 표시되는 이소시아네이트기를 함유하는 에폭시 수지(성분 A)를 제조하는 것을 특징으로 하는 습기경화형 에폭시 수지(성분 A)의 제조방법.Next, the diisocyanate compound represented by the general formula (III) and the diol compound represented by the following general formula (IV) are mixed in an equivalent ratio of 2: 1, and the primary urethane formation reaction is carried out at 50 to 100 ° C. After preparing the isocyanate urethane isocyanate urethane prepolymer represented by V), the bisphenol A type epoxy resin represented by the following general formula (VI) is mixed and reacted to form a secondary urethane at a temperature range of 80 to 130 ° C. The manufacturing method of the moisture hardening type epoxy resin (component A) characterized by manufacturing the epoxy resin (component A) containing the isocyanate group represented by the following general formula (I). 상기 식에서 R1은 비스페놀 A형 또는 F형의 구조로서 포화되거나 치환기로서 알킬기 또는 아릴기를 포함할 수 있으며, 주기율표상의 V족, VI족 또는 VII족의 비금속원소를 치환기로 포함할 수 있고, R3는 탄소수 6~20의 알킬렌기, 아릴렌기 또는 시클로알킬렌기로서 주기율표상의 V족, VI족 또는 VII족의 비금속원소를 치환기로 포함할 수 있으며, R4는 수평균 분자량 500~10,000의 양말단 히드록실기의 선형 고무탄성체이고, m은 0을 포함한 양의 정수이다.Wherein R 1 may be saturated as a bisphenol A or F structure or may include an alkyl group or an aryl group as a substituent, and may include a nonmetallic element of Group V, VI or VII on the periodic table as a substituent, and R 3 Is an alkylene group, arylene group or cycloalkylene group having 6 to 20 carbon atoms and may include a nonmetallic element of Group V, VI or VII on the periodic table as a substituent, and R 4 is a sock end hydroxide having a number average molecular weight of 500 to 10,000 It is a linear rubber elastic body of a siloxane group, and m is a positive integer containing 0. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940039942A 1994-12-30 1994-12-30 Moisture curable epoxy resin composition and paint composition containing the same KR100324643B1 (en)

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