KR960022788A - Epoxy resin composition for prepreg with controlled adhesiveness - Google Patents

Epoxy resin composition for prepreg with controlled adhesiveness Download PDF

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Publication number
KR960022788A
KR960022788A KR1019940038785A KR19940038785A KR960022788A KR 960022788 A KR960022788 A KR 960022788A KR 1019940038785 A KR1019940038785 A KR 1019940038785A KR 19940038785 A KR19940038785 A KR 19940038785A KR 960022788 A KR960022788 A KR 960022788A
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South Korea
Prior art keywords
epoxy resin
resin composition
prepreg
integer
alkyl group
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KR1019940038785A
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Korean (ko)
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KR100336966B1 (en
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김도현
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김준웅
주식회사 선경인더스트리
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Publication of KR100336966B1 publication Critical patent/KR100336966B1/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4035—Hydrazines; Hydrazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4064—Curing agents not provided for by the groups C08G59/42 - C08G59/66 sulfur containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

본 발명은 점착성이 조절된 프리프레그용 에폭시 수지조성물에 관한 것으로서, 더욱 상세하게는 에폭시 수지 조성물에 다음 구조식 (I)로 표시되는 점착 증진제와 다음 구조식(II)로 표시되는 점착 조절제를 첨가하여 이루어짐으로써 점착성(tackiness)이 조절되고 투명한 외관을 갖는 프리프레그용 에폭시 수지조성물에 관한 것이다.The present invention relates to an epoxy resin composition for prepreg with controlled adhesion, and more particularly, by adding an adhesion promoter represented by the following structural formula (I) and an adhesion regulator represented by the following structural formula (II) to the epoxy resin composition. The present invention relates to an epoxy resin composition for prepreg in which tackiness is controlled and has a transparent appearance.

상기식에서, R1는 C1~C7의 알킬기이고, R2는 C2~C6의 알킬기이고, R3은또는 이고, x는 4~15의 정수이고, y는 10~70의 정수이고, p는 1~5의 정수이고, m과 n은 m+n=3의 관계가 있는 정수들이다.Wherein R 1 is an alkyl group of C 1 to C 7 , R 2 is an alkyl group of C 2 to C 6 , and R 3 is or X is an integer from 4 to 15, y is an integer from 10 to 70, p is an integer from 1 to 5, and m and n are integers having a relationship of m + n = 3.

Description

점착성이 조절된 프리프레그용 에폭시 수지조성물Epoxy resin composition for prepreg with controlled adhesiveness

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (3)

에폭시 수지와 경화제로 이루어진 프리프레그용 에폭시 수지조성물에 있어서, 상기 수지조성물에 다음 구조식 (I)로 표시되는 점착 증진제가 전체 수지조성물에 0.5~30중량% 함유되어 있고, 다음 구조식(II)로 표시되는 점착 조절제가 상기 점착 증진제 100중량부에 대하여 0~15중량부 함유되어 있는 것을 특징으로 하는 프리프레그용 에폭시 수지조성물.In the epoxy resin composition for prepreg consisting of an epoxy resin and a curing agent, 0.5 to 30% by weight of the adhesion promoter represented by the following structural formula (I) is contained in the resin composition in the resin composition, and is represented by the following structural formula (II) Epoxy resin composition for prepregs, characterized in that 0 to 15 parts by weight based on 100 parts by weight of the adhesion promoter is contained. 상기식에서, R1는 C1~C7의 알킬기이고, R2는 C2~C6의 알킬기이고, R3은또는 이고, x는 4~15의 정수이고, y는 10~70의 정수이고, p는 1~5의 정수이고, m과 n은 m+n=3의 관계가 있는 정수들이다.Wherein R 1 is an alkyl group of C 1 to C 7 , R 2 is an alkyl group of C 2 to C 6 , and R 3 is or X is an integer from 4 to 15, y is an integer from 10 to 70, p is an integer from 1 to 5, and m and n are integers having a relationship of m + n = 3. 제1항에 있어서, 상기 에폭시 수지로는 비스페놀 A형 수지, 비스페놀 F형 수지, 페놀노보락형 수지, 크레졸 노보락형 수지, 브롬함유 에폭시 수지, 변성 에폭시 수지 또는 고강도형 에폭시 수지를 사용하는 것을 특징으로 하는 프리프레그용 에폭시 수지조성물.The method of claim 1, wherein the epoxy resin is bisphenol A resin, bisphenol F resin, phenol novolak-type resin, cresol novolak-type resin, bromine-containing epoxy resin, modified epoxy resin or high-strength epoxy resin is used. Epoxy resin composition for prepreg. 제1항에 있어서, 상기 경화제로는 디시안디아미드, 디클로로페닐디메틸우레아, 벤질디메틸아민, 이미다졸, BF3계 착제, 디아미노디페닐설폰 또는 아디핀산 디하이드라자이드를 사용하는 것을 특징으로 하는 프리프레그용 에폭시 수지조성물.The method of claim 1, wherein as the curing agent, dicyandiamide, dichlorophenyldimethylurea, benzyldimethylamine, imidazole, BF 3- based complex, diaminodiphenylsulfone or adipic acid dihydrazide is used. Epoxy resin composition for prepreg. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940038785A 1994-12-29 1994-12-29 Tackiness controlled epoxy resin composition for prepreg KR100336966B1 (en)

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Application Number Priority Date Filing Date Title
KR1019940038785A KR100336966B1 (en) 1994-12-29 1994-12-29 Tackiness controlled epoxy resin composition for prepreg

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Application Number Priority Date Filing Date Title
KR1019940038785A KR100336966B1 (en) 1994-12-29 1994-12-29 Tackiness controlled epoxy resin composition for prepreg

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KR960022788A true KR960022788A (en) 1996-07-18
KR100336966B1 KR100336966B1 (en) 2002-11-23

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KR101948874B1 (en) 2018-06-29 2019-02-15 국도화학 주식회사 Resin composition, manufacturing method the same, prepreg including the same, laminated plate including the same, metal foil coated with resin including the same

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