KR960016668A - 냉각유체통과용 내부 도관을 갖는 패키지를 구비한 초소형 전자장치 - Google Patents

냉각유체통과용 내부 도관을 갖는 패키지를 구비한 초소형 전자장치 Download PDF

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Publication number
KR960016668A
KR960016668A KR1019950039469A KR19950039469A KR960016668A KR 960016668 A KR960016668 A KR 960016668A KR 1019950039469 A KR1019950039469 A KR 1019950039469A KR 19950039469 A KR19950039469 A KR 19950039469A KR 960016668 A KR960016668 A KR 960016668A
Authority
KR
South Korea
Prior art keywords
package body
microelectronic device
cooling fluid
integrated circuit
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019950039469A
Other languages
English (en)
Korean (ko)
Inventor
아자르 카베
Original Assignee
엠. 케이. 영
에이티 앤드 티 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엠. 케이. 영, 에이티 앤드 티 코포레이션 filed Critical 엠. 케이. 영
Publication of KR960016668A publication Critical patent/KR960016668A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H10W74/124—
    • H10W40/47—
    • H10W72/5449—
    • H10W72/932—
    • H10W74/00—
    • H10W74/10—
    • H10W90/756—

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1019950039469A 1994-10-31 1995-10-30 냉각유체통과용 내부 도관을 갖는 패키지를 구비한 초소형 전자장치 Withdrawn KR960016668A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33222294A 1994-10-31 1994-10-31
US332,222 1994-10-31

Publications (1)

Publication Number Publication Date
KR960016668A true KR960016668A (ko) 1996-05-22

Family

ID=23297264

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950039469A Withdrawn KR960016668A (ko) 1994-10-31 1995-10-30 냉각유체통과용 내부 도관을 갖는 패키지를 구비한 초소형 전자장치

Country Status (6)

Country Link
EP (1) EP0709884A2 (cg-RX-API-DMAC10.html)
JP (1) JPH08213525A (cg-RX-API-DMAC10.html)
KR (1) KR960016668A (cg-RX-API-DMAC10.html)
AU (1) AU3452895A (cg-RX-API-DMAC10.html)
CA (1) CA2160495A1 (cg-RX-API-DMAC10.html)
TW (1) TW278225B (cg-RX-API-DMAC10.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0768711A3 (en) * 1995-10-13 1998-07-08 AT&T Corp. Microelectronic package with device cooling
GB2313960A (en) * 1996-06-08 1997-12-10 Marconi Gec Ltd Heat sink including a cooling pipe having a planar section
US6891385B2 (en) 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
US7064953B2 (en) 2001-12-27 2006-06-20 Formfactor, Inc. Electronic package with direct cooling of active electronic components
US6771500B1 (en) 2003-03-27 2004-08-03 Stmicroelectronics, Inc. System and method for direct convective cooling of an exposed integrated circuit die surface
DK200301577A (da) 2003-10-27 2005-04-28 Danfoss Silicon Power Gmbh Flowfordelingsenhed og köleenhed
US6992381B2 (en) 2003-10-31 2006-01-31 Intel Corporation Using external radiators with electroosmotic pumps for cooling integrated circuits
US7364684B2 (en) * 2004-08-16 2008-04-29 Delphi Technologies, Inc. Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels
US7205653B2 (en) 2004-08-17 2007-04-17 Delphi Technologies, Inc. Fluid cooled encapsulated microelectronic package
DE102009055717A1 (de) * 2009-11-26 2011-06-01 Continental Automotive Gmbh Sensormodul und Herstellungsverfahren eines Sensormoduls
EP2605345B1 (en) 2011-12-13 2021-04-28 Alcatel Lucent Thermal management of photonics assemblies
US9961798B2 (en) 2013-04-04 2018-05-01 Infineon Technologies Austria Ag Package and a method of manufacturing the same
US9449895B2 (en) * 2013-05-03 2016-09-20 Infineon Technologies Ag Cooling system for molded modules and corresponding manufacturing methods
US9613885B2 (en) 2015-03-03 2017-04-04 Infineon Technologies Ag Plastic cooler for semiconductor modules
JP7075837B2 (ja) * 2018-06-29 2022-05-26 三菱重工業株式会社 半導体素子の冷却構造及び電子デバイスの冷却構造
CN114430642B (zh) * 2020-10-29 2024-12-10 春鸿电子科技(重庆)有限公司 液冷散热装置

Also Published As

Publication number Publication date
AU3452895A (en) 1996-05-09
JPH08213525A (ja) 1996-08-20
TW278225B (cg-RX-API-DMAC10.html) 1996-06-11
EP0709884A2 (en) 1996-05-01
CA2160495A1 (en) 1996-05-01

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Legal Events

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000