KR960015821A - Wire bonding device - Google Patents

Wire bonding device Download PDF

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Publication number
KR960015821A
KR960015821A KR1019940028104A KR19940028104A KR960015821A KR 960015821 A KR960015821 A KR 960015821A KR 1019940028104 A KR1019940028104 A KR 1019940028104A KR 19940028104 A KR19940028104 A KR 19940028104A KR 960015821 A KR960015821 A KR 960015821A
Authority
KR
South Korea
Prior art keywords
rod
inductor
wire bonding
stator
lifting means
Prior art date
Application number
KR1019940028104A
Other languages
Korean (ko)
Other versions
KR0155773B1 (en
Inventor
남수근
Original Assignee
이대원
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이대원, 삼성항공산업 주식회사 filed Critical 이대원
Priority to KR1019940028104A priority Critical patent/KR0155773B1/en
Priority to US08/547,731 priority patent/US5653375A/en
Priority to JP30513995A priority patent/JP3672366B2/en
Priority to CN95118532A priority patent/CN1065788C/en
Publication of KR960015821A publication Critical patent/KR960015821A/en
Application granted granted Critical
Publication of KR0155773B1 publication Critical patent/KR0155773B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

본 발명은 와이어 본딩 헤드 및 이를 이용한 본딩장치를 개시한다.The present invention discloses a wire bonding head and a bonding apparatus using the same.

본 발명은 리니어 스템핑 모우터로 이루어진 X, Y 테이블과, 이 X,Y 테이블의 상면에 회동가능하게 설치되며 단부에 와이어를 본딩하기 위한 트렌스듀셔가 설치된 로드와, 로드의 단부에 인접되게 설치되어 이를 승강시키는 제1승강수단과, 이 제1승강수단의 전면의 X, Y 테이블상에 설치되어 상기 로드의 단부를 승강시키는 제2승강수단을 구비하여 된 것에 특징이 있으며, 이는 본딩헤드의 구동에 따른 에너지 손실을 줄일수 있는 잇점을 가진다.The present invention is a X, Y table made of a linear stamping motor, a rod is installed rotatably on the upper surface of the X, Y table, the rod is provided with a transducer for bonding the wire at the end, and installed adjacent to the end of the rod And a first lifting means for elevating it, and a second elevating means for elevating the end of the rod by being installed on the X and Y tables in front of the first elevating means. It has the advantage of reducing energy loss due to driving.

Description

와이어 본딩(wire bonding) 장치Wire bonding device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명에 따른 와이어 본딩장치를 도시한 측면도,1 is a side view showing a wire bonding apparatus according to the present invention,

제2도는 와이어 본딩헤드의 본딩 사이클을 도시한 도면.2 shows a bonding cycle of a wire bonding head.

Claims (6)

리니어 스템핑 모우터로 이루어진 X, Y 테이블과, 이 X, Y 테이블의 상면에 회동가능하게 설치되며 단부에 와이어를 본딩하기 위한 트렌스듀셔가 설치된 로드와, 로드의 단부에 인접되게 설치되어 이를 승강시키는 제1승강수단과, 이 제1승강수단의 전면의 X, Y 테이블상에 설치되어 상기 로드의 단부를 승강시키는 제2승강수단을 구비하여 된 것을 특징으로 하는 와이어 본딩 헤드.X and Y tables composed of linear stamping motors, rods rotatably mounted on the upper surfaces of the X and Y tables, and equipped with a transducer for bonding wires at the ends thereof, and installed adjacent to the ends of the rods, And a second elevating means arranged on an X, Y table on the front surface of the first elevating means to elevate an end of the rod. 제1항에 있어서, 상기 제1승강수단은 상기 X,Y 테이블 상에 수직으로 설치된 인덕터와 이 인덕터를 따라 수직 방향으로 슬라이딩되는 스테이터를 구비한 리니어 스텝핑 모우터와, 상기 인덕터의 단부에 설치된 서포트와 로드의 단부를 연결하는 스프링과, 상기 스테이터에 설치되며 로드 단부의 당면과 접촉되는 헤드를 구비하여 구성된 것을 특징으로 하는 와이어 본딩 헤드.The support apparatus of claim 1, wherein the first elevating means includes a linear stepping motor having an inductor vertically disposed on the X and Y tables, a stator sliding vertically along the inductor, and a support provided at an end of the inductor. And a spring for connecting an end portion of the rod to the stator, and a head mounted on the stator and in contact with an immediate surface of the rod end portion. 제1항에 있어서, 상기 제2승강수단은 보이스 코일 모우터인 것을 특징으로 하는 와이어 본딩 헤드.The wire bonding head of claim 1, wherein the second lifting means is a voice coil motor. 칩과 리드 프레임을 와이어 본딩하는 와이어 본딩장치에 있어서, 리니어 스템핑 모우터로 이루어진 X,Y 테이블과, 이 X, Y 테이블의 상면에 회동가능하게 설치되며 단부에 와이어를 본딩하기 위한 트렌스듀셔가 설치된 로드와, 로드의 단부에 인접되게 설치되어 이를 승강시키는 제1승강수단과, 이 제1승강수단의 전면의 X,Y 테이블상에 설치되어 상기 로드의 단부를 승강시키는 제2승강수단을 구비하여 된 것을 본딩헤드를 포함하여 구성된 것을 특징으로 하는 와이어 본딩 장치.In a wire bonding apparatus for wire bonding a chip and a lead frame, an X and Y table made of a linear stamping motor, and a transducer for rotatably bonding the wire at an end thereof are rotatably installed on the upper surface of the X and Y table. A rod installed therein; first lifting means installed adjacent to an end of the rod to elevate it; and second lifting means installed on an X and Y table in front of the first lifting means to elevate the end of the rod. The wire bonding apparatus, comprising a bonding head. 제4항에 있어서, 상기 제1승강수단은 X, Y 테이블 상에 수직으로 설치된 인덕터와 이 인덕터를 따라 수직 방향으로 슬라이딩되는 스테이터를 구비한 리니어 스텝핑 모우터와, 상기 인덕터의 단부에 설치된 서포토와 로드의 단부를 연결하는 스프링과, 상기 스테이터에 설치되며 로드 단부의 상면과 접촉되는 헤드를 구비하여 구성된 것을 특징으로 하는 와이어 본딩 장치.5. The apparatus of claim 4, wherein the first elevating means comprises: a linear stepping motor having an inductor vertically mounted on an X and Y table, a stator sliding vertically along the inductor, and a servo photo installed at an end of the inductor; And a spring for connecting an end portion of the rod and a head mounted to the stator and in contact with an upper surface of the rod end portion. 제4항에 있어서, 상기 제2승강수단은 보이스 코일 모우터인 것을 특징으로 하는 와이어 본딩 장치.5. The wire bonding apparatus according to claim 4, wherein the second lifting means is a voice coil motor. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940028104A 1994-10-29 1994-10-29 Wire bonding head and bonding device using that KR0155773B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019940028104A KR0155773B1 (en) 1994-10-29 1994-10-29 Wire bonding head and bonding device using that
US08/547,731 US5653375A (en) 1994-10-29 1995-10-26 Wire bonding apparatus
JP30513995A JP3672366B2 (en) 1994-10-29 1995-10-30 Wire bonding equipment
CN95118532A CN1065788C (en) 1994-10-29 1995-10-30 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940028104A KR0155773B1 (en) 1994-10-29 1994-10-29 Wire bonding head and bonding device using that

Publications (2)

Publication Number Publication Date
KR960015821A true KR960015821A (en) 1996-05-22
KR0155773B1 KR0155773B1 (en) 1998-12-01

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Application Number Title Priority Date Filing Date
KR1019940028104A KR0155773B1 (en) 1994-10-29 1994-10-29 Wire bonding head and bonding device using that

Country Status (1)

Country Link
KR (1) KR0155773B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101044879B1 (en) * 2004-10-20 2011-06-28 엘지전자 주식회사 Scroll compressor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11289446B2 (en) * 2018-03-28 2022-03-29 Asm Technology Singapore Pte Ltd Multiple actuator wire bonding apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101044879B1 (en) * 2004-10-20 2011-06-28 엘지전자 주식회사 Scroll compressor

Also Published As

Publication number Publication date
KR0155773B1 (en) 1998-12-01

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