KR960012306A - 집적회로의 제조에서 알루미늄을 포함한 층의 스퍼터링 증착을 평탄화 하기위한 방법 - Google Patents
집적회로의 제조에서 알루미늄을 포함한 층의 스퍼터링 증착을 평탄화 하기위한 방법 Download PDFInfo
- Publication number
- KR960012306A KR960012306A KR1019950030579A KR19950030579A KR960012306A KR 960012306 A KR960012306 A KR 960012306A KR 1019950030579 A KR1019950030579 A KR 1019950030579A KR 19950030579 A KR19950030579 A KR 19950030579A KR 960012306 A KR960012306 A KR 960012306A
- Authority
- KR
- South Korea
- Prior art keywords
- planarizing
- manufacture
- integrated circuits
- containing aluminum
- layers containing
- Prior art date
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title 1
- 229910052782 aluminium Inorganic materials 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000004544 sputter deposition Methods 0.000 title 1
Classifications
-
- H01L21/203—
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/32051—Deposition of metallic or metal-silicide layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4433326A DE4433326A1 (de) | 1994-09-19 | 1994-09-19 | Verfahren zur planarisierenden Sputterabscheidung einer aluminiumhaltigen Schicht bei der Herstellung integrierter Schaltungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR960012306A true KR960012306A (ko) | 1996-04-20 |
Family
ID=6528580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950030579A KR960012306A (ko) | 1994-09-19 | 1995-09-19 | 집적회로의 제조에서 알루미늄을 포함한 층의 스퍼터링 증착을 평탄화 하기위한 방법 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0706205A3 (ko) |
| JP (1) | JPH0897148A (ko) |
| KR (1) | KR960012306A (ko) |
| DE (1) | DE4433326A1 (ko) |
| TW (1) | TW276351B (ko) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5658828A (en) * | 1989-11-30 | 1997-08-19 | Sgs-Thomson Microelectronics, Inc. | Method for forming an aluminum contact through an insulating layer |
| JPH04363024A (ja) * | 1990-11-30 | 1992-12-15 | Toshiba Corp | 半導体装置の製造方法 |
| KR920010620A (ko) * | 1990-11-30 | 1992-06-26 | 원본미기재 | 다층 상호접속선을 위한 알루미늄 적층 접점/통로 형성방법 |
| JPH07109030B2 (ja) * | 1991-02-12 | 1995-11-22 | アプライド マテリアルズ インコーポレイテッド | 半導体ウェーハ上にアルミニウム層をスパッタする方法 |
| DE69319993T2 (de) * | 1992-09-22 | 1998-12-10 | Sgs Thomson Microelectronics | Methode zur Herstellung eines Metallkontaktes |
-
1994
- 1994-09-19 DE DE4433326A patent/DE4433326A1/de not_active Withdrawn
-
1995
- 1995-08-11 TW TW084108373A patent/TW276351B/zh not_active IP Right Cessation
- 1995-09-18 EP EP95114656A patent/EP0706205A3/de not_active Withdrawn
- 1995-09-19 KR KR1019950030579A patent/KR960012306A/ko not_active Application Discontinuation
- 1995-09-19 JP JP7264748A patent/JPH0897148A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0706205A2 (de) | 1996-04-10 |
| EP0706205A3 (de) | 1997-10-22 |
| TW276351B (ko) | 1996-05-21 |
| JPH0897148A (ja) | 1996-04-12 |
| DE4433326A1 (de) | 1996-03-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |