KR960012296B1 - Tantalium electrolytic capacitor coating apparatus - Google Patents
Tantalium electrolytic capacitor coating apparatus Download PDFInfo
- Publication number
- KR960012296B1 KR960012296B1 KR1019930008354A KR930008354A KR960012296B1 KR 960012296 B1 KR960012296 B1 KR 960012296B1 KR 1019930008354 A KR1019930008354 A KR 1019930008354A KR 930008354 A KR930008354 A KR 930008354A KR 960012296 B1 KR960012296 B1 KR 960012296B1
- Authority
- KR
- South Korea
- Prior art keywords
- tantalum
- liquid
- release liquid
- release
- electrolytic capacitor
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims description 19
- 238000000576 coating method Methods 0.000 title description 8
- 239000011248 coating agent Substances 0.000 title description 7
- 239000007788 liquid Substances 0.000 claims abstract description 27
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052715 tantalum Inorganic materials 0.000 claims description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 238000000034 method Methods 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000007784 solid electrolyte Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
제1도는 본 발명의 장치를 나타내는 정면도.1 is a front view showing the apparatus of the present invention.
제2도는 본 발명의 장치를 나타내는 평면도.2 is a plan view showing the apparatus of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 이형액 도포롤러 2 : 이형액 배트1: Release liquid applying roller 2: Release liquid bat
3 : 스폰지 4 : 탄탈콘덴서의 리드선3: sponge 4: lead wire of tantalum capacitor
본 발명은 전자기기에 사용되는 딥형(dip type)탄탈 전해 콘덴서의 제조시 소자의 리드선 일측에 이형제를 도포시키는 장치에 관한 것으로, 더욱 상세하게는 딥형 탄탈콘덴서의 제조시 액상수지에 소자를 침적시키므로 적당량의 액상수지가 소자에 도포되어 양호한 부품을 생상시킬 수 있도록 탄탈콘덴서의 제조시 리드선(lead wire)에 이형제를 도포시키는 장치에 관한 것이다.The present invention relates to a device for applying a release agent to one side of the lead wire of the device in the manufacture of a dip type tantalum electrolytic capacitor for use in electronic devices, and more particularly, in order to deposit the device in a liquid resin during the production of a dip tantalum capacitor The present invention relates to an apparatus for applying a release agent to a lead wire in the manufacture of a tantalum capacitor so that an appropriate amount of liquid resin can be applied to the device to produce good parts.
일반적으로 탄탈고체 전해 콘덴서는 내부양극소자를 탄탈분말의 소결소자를 사용하여 유전체 피막을 형성후 고체 전해질로 된 이산화망간층을 질산망간의 열분해에 의하여 형성하여 그 위에 음극을 인출하기 위하여 카본(Carbon), 은(Ag)도포를 도포형성한 소자를 케이스(case)에 수함하거나 수지몰드 하는 방법으로 제품화시키게 되며 이러한 탄탈콘덴서에는 딥타입(dip type), 칩타입(chip type), 금속케이스타입이 있다.In general, tantalum solid electrolytic capacitors use an internal anode element to form a dielectric film using a sintered element of tantalum powder, and then form a manganese dioxide layer made of solid electrolyte by pyrolysis of manganese nitrate to draw a cathode thereon. In this case, a device coated with silver (Ag) coating is formed into a case or resin molded. Such tantalum capacitors include a dip type, a chip type, and a metal case type. .
이러한 딥타입(dip type)탄탈 콘덴서의 제조공정을 살펴보면, 탄탈분말 파우더를 접합제와 혼합하여 금형에 의해 펠렛(Pellet)으로 성형하는 성형공정, 펠렛을 진공 소결로에 넣고 열을 가하여 펠렛내의 접합제와 불순물을 제거한 다음 순수한 탄탈분말 파우더만 소결시키는 소결공정, 전반적으로 양호한 화학처리 공정작업성을 부여하기 위하여 펠렛을 알루미늄 벨트에 용접하는 소자 용접공정, 용접된 펠렛을 인산 수용액에서 전기분해시켜 탄탈표면에 유전체로서 산화 탄탈피막(Ta2O3)을 형성시키는 화성공정, 탄탈피막위에 전해질층을 형성하기 위해 소자를 질산망간액 중에 침적시킨 후 소성로에서 열분해시켜 이산화망간(MnO2) 고체 전해질층을 형성하기 위한 소성공정, 이산화망간층(MnO2)형성후 필요한 카본도포 은막층 도포 리드선을 용접하는 조립공정, 조립공정에서 솔더링(Soldering)이 종료후 에폭시(Epoxy)계 액체수지에 자연상태로 반제품을 침적시켜 수지를 코팅(Coating)시키는 공정이 순차적으로 구성되어 있다.Looking at the manufacturing process of such a dip type tantalum capacitor, a molding process in which tantalum powder powder is mixed with a binder and formed into pellets by a mold, and the pellets are put in a vacuum sintering furnace and heated to join the pellets. Sintering process to remove agent and impurities and sinter only pure tantalum powder powder, Device welding process for welding pellets to aluminum belt to give good chemical treatment process overall, Tantalum by electrolysis of welded pellets in aqueous phosphate solution A chemical conversion process for forming a tantalum oxide film (Ta 2 O 3 ) as a dielectric on the surface, in order to form an electrolyte layer on the tantalum film, the device is deposited in manganese nitrate solution and thermally decomposed in a kiln to form a manganese dioxide (MnO 2 ) solid electrolyte layer. for forming the firing process, the manganese dioxide layer (MnO 2) to weld the necessary carbon coated silver film layer applied to the lead wire after the formation The lip step, a step of soldering (Soldering) is an epoxy (Epoxy) based liquid resin after the end immersed in the semi-finished natural coating (Coating) the resin in the assembly process consists of a sequence.
상기의 탄탈콘덴서의 제조공정중 탄탈소자에 수지를 코팅(Coating)시키는 코팅공정에서 종래에는 편평한 액상수지에 소자를 침적시킬 경우 침적깊이가 일정하지 않아 역상수지가 도포되지 않아야 될 리드선에 액상수지가 도포되어 탄탈콘덴서의 리드선을 기판에 용접시 용접이 불가능하여 제품불량을 일으키는 문제점이 있었다.In the coating process of coating a resin on a tantalum element during the manufacturing process of the tantalum capacitor, when the element is deposited on a flat liquid resin, the deposition depth is not constant, so that the liquid resin may not be applied to the reverse phase resin. When the lead wire of the tantalum capacitor is applied to the substrate by welding, welding is not possible, which causes product defects.
본 발명은 상기한 문제점을 제거하기 위하여 안출한 것으로, 탄탈 콘덴서의 리드선에 수지가 묻지 않도록 이형액의 도포를 용이하게 할 수 있는 탄탈콘덴서의 이형제 도포장치를 제공하는 것을 목적으로 한다.An object of the present invention is to provide a release agent applying apparatus for tantalum capacitors, which can facilitate application of a release liquid so that resins do not adhere to lead wires of tantalum capacitors.
본 발명은 상기의 목적을 달성하기 위해 회전하는 롤러를 이용하여 일정시간에 다수량의 탄탈콘덴서의 리드선을 이형액으로 도포할 수 있도록 한 것이다.The present invention is to enable the application of the lead wire of a large amount of tantalum capacitor in a release liquid by using a rotating roller to achieve the above object.
이하, 첨부된 도면에 의하여 본 발명을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제1도는 본 장치의 정면도를 나타낸 것으로 도면에서 보는 바와 같이 전, 후 왕복운동을 하는 이형액 도포 롤러(roller)(1)와 이형액을 담고 스폰지(3)가 설치된 이형액 배트(bat)(2)로 구성되어 있다.FIG. 1 is a front view of the apparatus, and as shown in the drawing, a release liquid bat (roller) having a release liquid applying roller 1 and a release liquid containing a release liquid and a sponge 3, which performs a reciprocating motion before and after ( It consists of 2).
상기와 같이 구성된 본 장치의 작용 및 효과를 설명하면 다음과 같다.Referring to the operation and effects of the device configured as described above are as follows.
탄탈콘덴서가 용접된 알루미늄 벨트(5)를 콘덴서의 몸통(6)에서 1mm를 제외한 부위를 이형액으로 도포하기 위해 제2도에서 보는 바와 같이 스폰지(3)가 내장된 이형액 배트(bat)(2)에 설치하고, 탄탈콘덴서의 리드선(4)위에 이형액 도포롤러(1)가 전후 왕복으로 이동하게 되면 이형액을 충분히 보유한 스폰지(3)와 탄탈콘덴서의 리드선(4)을 누르고 지나가게 된다.Release agent bat containing sponge 3 as shown in FIG. 2 to apply the tantalum capacitor-welded aluminum belt 5 with release liquid to a portion other than 1 mm from the body 6 of the condenser. 2) and when the release liquid application roller 1 is moved back and forth on the lead wire 4 of the tantalum capacitor, the sponge 3 holding enough release liquid and the lead wire 4 of the tantalum capacitor are pressed. .
이때 이형액 도포 롤러(1)가 지나간 탄탈콘덴서의 리드선(4)에 스폰지(3)에 보유한 이형액이 충분히 묻게된다.At this time, the release liquid held in the sponge 3 is sufficiently buried in the lead wire 4 of the tantalum capacitor through which the release liquid applying roller 1 has passed.
상기와 같이 구성된 본 발명의 이형제 도포장치에 의하면 용이하게 탄탈콘덴서의 리드선에 이형액을 도포할 수 있으면, 또한 롤러의 이동속도를 조절함으로써 이형액 도포속도를 조절하여 생산성을 증가시킬 수 있으며, 도포하고자 하는 리드선에 이형액을 충분히 도포시킴으로써 액상수지에 대하여 이형액을 증가시켜 탄탈콘덴서의 불량율을 감소시킬 수 있는 효과가 있다.According to the release agent coating apparatus of the present invention configured as described above, if the release liquid can be easily applied to the lead wire of the tantalum capacitor, the productivity can be increased by adjusting the release liquid coating speed by adjusting the moving speed of the roller, By applying a sufficient amount of the release liquid to the lead wire to be improved to the liquid resin has an effect that can reduce the defect rate of the tantalum capacitor.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019930008354A KR960012296B1 (en) | 1993-05-15 | 1993-05-15 | Tantalium electrolytic capacitor coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019930008354A KR960012296B1 (en) | 1993-05-15 | 1993-05-15 | Tantalium electrolytic capacitor coating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR940027000A KR940027000A (en) | 1994-12-10 |
| KR960012296B1 true KR960012296B1 (en) | 1996-09-18 |
Family
ID=19355446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019930008354A KR960012296B1 (en) | 1993-05-15 | 1993-05-15 | Tantalium electrolytic capacitor coating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR960012296B1 (en) |
-
1993
- 1993-05-15 KR KR1019930008354A patent/KR960012296B1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR940027000A (en) | 1994-12-10 |
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