KR960009274U - Clamp air supply for preventing wafer chipping - Google Patents

Clamp air supply for preventing wafer chipping

Info

Publication number
KR960009274U
KR960009274U KR2019940020974U KR19940020974U KR960009274U KR 960009274 U KR960009274 U KR 960009274U KR 2019940020974 U KR2019940020974 U KR 2019940020974U KR 19940020974 U KR19940020974 U KR 19940020974U KR 960009274 U KR960009274 U KR 960009274U
Authority
KR
South Korea
Prior art keywords
air supply
clamp air
preventing wafer
wafer chipping
chipping
Prior art date
Application number
KR2019940020974U
Other languages
Korean (ko)
Other versions
KR0116363Y1 (en
Inventor
최영일
김광성
진기현
Original Assignee
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업 주식회사 filed Critical 현대전자산업 주식회사
Priority to KR2019940020974U priority Critical patent/KR0116363Y1/en
Publication of KR960009274U publication Critical patent/KR960009274U/en
Application granted granted Critical
Publication of KR0116363Y1 publication Critical patent/KR0116363Y1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR2019940020974U 1994-08-19 1994-08-19 Wafer clamp KR0116363Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940020974U KR0116363Y1 (en) 1994-08-19 1994-08-19 Wafer clamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940020974U KR0116363Y1 (en) 1994-08-19 1994-08-19 Wafer clamp

Publications (2)

Publication Number Publication Date
KR960009274U true KR960009274U (en) 1996-03-16
KR0116363Y1 KR0116363Y1 (en) 1998-04-22

Family

ID=19391070

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940020974U KR0116363Y1 (en) 1994-08-19 1994-08-19 Wafer clamp

Country Status (1)

Country Link
KR (1) KR0116363Y1 (en)

Also Published As

Publication number Publication date
KR0116363Y1 (en) 1998-04-22

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090102

Year of fee payment: 12

EXPY Expiration of term