KR960009137A - Lead frame connection method using laser welding - Google Patents
Lead frame connection method using laser welding Download PDFInfo
- Publication number
- KR960009137A KR960009137A KR1019940020898A KR19940020898A KR960009137A KR 960009137 A KR960009137 A KR 960009137A KR 1019940020898 A KR1019940020898 A KR 1019940020898A KR 19940020898 A KR19940020898 A KR 19940020898A KR 960009137 A KR960009137 A KR 960009137A
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- welding
- nickel layer
- substrate
- voltage regulator
- Prior art date
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Laser Beam Processing (AREA)
Abstract
본 발명은 전압조정기의 리드 프레임 연결에 관한 것으로, 전압조정기 하우징의 리드 프레임과 기판의 니켈층을 직접 접촉시켜 용접을 실시하여 작업의 편리성을 증가하며 보다 견고한 용접을 하는 데 그 목적이 있다.The present invention relates to a lead frame connection of the voltage regulator, the welding is performed by directly contacting the lead frame of the voltage regulator housing and the nickel layer of the substrate to increase the convenience of work and to provide a more robust welding.
본 발명은 기판에 위치한 도체 상면에 용접판과 니켈층을 형성하고 전압조정기 하우징의 리드 프레임의 일단을 상기 기판 상면의 니켈층 상측부에 위치시키고 니켈층과 접하는 리드 프레임에 레이저 용접을 실시하여 용접점을 형성한다.The present invention forms a welding plate and a nickel layer on the upper surface of the conductor located on the substrate, and place one end of the lead frame of the voltage regulator housing on the upper nickel layer of the upper surface of the substrate and perform laser welding on the lead frame in contact with the nickel layer. Form a point.
상기의 본 발명은 강한 접착강도를 가지며, 빠르고 깨끗한 용접을 실시하여 양질의 제품을 생산하는 효과가 있다.The present invention has a strong adhesive strength, there is an effect of producing a good quality product by performing a fast and clean welding.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제3도는 본 발명에 의한 리드 프레임의 연결방법을 도시한 도면.3 is a view showing a method of connecting a lead frame according to the present invention.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940020898A KR960009137A (en) | 1994-08-24 | 1994-08-24 | Lead frame connection method using laser welding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940020898A KR960009137A (en) | 1994-08-24 | 1994-08-24 | Lead frame connection method using laser welding |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960009137A true KR960009137A (en) | 1996-03-22 |
Family
ID=66697688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940020898A KR960009137A (en) | 1994-08-24 | 1994-08-24 | Lead frame connection method using laser welding |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960009137A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190116163A (en) | 2019-08-29 | 2019-10-14 | 삼성전기주식회사 | Electronic component and board having the same mounted thereon |
-
1994
- 1994-08-24 KR KR1019940020898A patent/KR960009137A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190116163A (en) | 2019-08-29 | 2019-10-14 | 삼성전기주식회사 | Electronic component and board having the same mounted thereon |
US11276529B2 (en) | 2019-08-29 | 2022-03-15 | Samsung Electro-Mechanics Co., Ltd. | Electronic component and board having the same mounted thereon |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR910011098A (en) | How to Form Through Holes in Polyimide Substrates | |
DE69005589D1 (en) | METHOD FOR FAST AND EVEN HEATING A MULTILAYERED COMPONENT CONTAINING AN ION-CONDUCTING MACROMOLECULAR MATERIAL ENVELOPED BETWEEN TWO HIGH-ELECTRONIC-CONDUCTING COMPONENTS. | |
FR2366620A1 (en) | CAPACITIVE KEY FOR A KEYBOARD | |
KR890012330A (en) | Trimming elements and their short circuit methods | |
WO2002019388A3 (en) | Class v flextensional transducer with directional beam patterns | |
KR987000704A (en) | ELECTRICAL CONNECTION METHOD | |
KR960009137A (en) | Lead frame connection method using laser welding | |
KR960705215A (en) | Acceleration Sensor (Beschleunigungssensor) | |
ATE217737T1 (en) | CORONA STATION FOR THE PRETREATMENT OF A MATERIAL WEB | |
EP0823782A3 (en) | Piezoelectric component | |
KR970007418A (en) | Socket for inspection of display panel | |
KR920000118A (en) | Wire Bonding Method | |
KR880001046A (en) | Electrical connection method inside the semiconductor component | |
KR960009138A (en) | Lead frame connection method using laser soldering | |
ATE189936T1 (en) | MUSICAL INSTRUMENT FOR PRODUCING AT LEAST ONE SOUND | |
KR970704582A (en) | Method for forming auxiliary electrode layer to common electrode pattern in thermal head | |
KR920702178A (en) | Ultrasonic Probe and Manufacturing Method Thereof | |
KR860006310A (en) | Backbead Control Method in 1-side Welding Machine | |
KR980004324A (en) | Piezoelectric Buzzer Manufacturing Method | |
JPS57190784A (en) | Joining method for non-conductive member and conductive member | |
KR960014531A (en) | Manufacturing method of paper sorting device and screen for paper sorting device | |
JPS57211244A (en) | Formation of bonding electrode | |
KR890007623A (en) | Manufacturing Method of Circuit Board | |
SE0102476D0 (en) | Bonding method and product | |
JPS57176736A (en) | Manufacture of semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |