KR960009138A - Lead frame connection method using laser soldering - Google Patents

Lead frame connection method using laser soldering Download PDF

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Publication number
KR960009138A
KR960009138A KR1019940020902A KR19940020902A KR960009138A KR 960009138 A KR960009138 A KR 960009138A KR 1019940020902 A KR1019940020902 A KR 1019940020902A KR 19940020902 A KR19940020902 A KR 19940020902A KR 960009138 A KR960009138 A KR 960009138A
Authority
KR
South Korea
Prior art keywords
lead frame
voltage regulator
laser soldering
substrate
regulator housing
Prior art date
Application number
KR1019940020902A
Other languages
Korean (ko)
Inventor
조영호
Original Assignee
서두칠
대우전자부품 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서두칠, 대우전자부품 주식회사 filed Critical 서두칠
Priority to KR1019940020902A priority Critical patent/KR960009138A/en
Publication of KR960009138A publication Critical patent/KR960009138A/en

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  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

본 발명은 전압조정기의 리드 프레임 연결방법에 관한 것으로, 전압조정기 하우징과 기판의 연결시 저항용접이 필요치 않으며 니켈 와이어를 사용하지 않고 연결하는 구조를 갖는 리드 프레임 연결방법을 제공함이 목적이다.The present invention relates to a method of connecting a lead frame of a voltage regulator, and an object of the present invention is to provide a lead frame connecting method having a structure in which resistance welding is not required when connecting the voltage regulator housing and a substrate and connecting without using a nickel wire.

본 발명은 기판의 상면에 형성한 도체의 상측부에 땜납으로 구성한 솔더부를 형성하여 상기 솔더부에 전압조정기 하우징의 리드 프레임을 접촉시켜 레이저 솔더링을 실시하여 기판의 도체와 전압조정기 하우징의 리드 프레임을 연결한다.The present invention forms a solder portion composed of solder on the upper side of the conductor formed on the upper surface of the substrate, and the lead frame of the voltage regulator housing is brought into contact with the solder portion to perform laser soldering to form a lead frame of the conductor of the substrate and the voltage regulator housing. Connect.

상기의 본 발명은 종래의 저항용접에 비해 안전성이 향상되며 작업의 편리성이 증가하는 효과가 있다.The present invention has the effect of improving the safety and convenience of operation compared to the conventional resistance welding.

Description

레이저 솔더링을 이용한 리드 프레임 연결방법Lead frame connection method using laser soldering

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 종래의 저항용접을 이용한 연결을 도시하는 도면,1 is a view showing a connection using a conventional resistance welding,

제2도의 (가)도는 본 발명에 의한 리드 프레임의 연결을 도시하는 도면이고, (나)도는 (가)도의 연결부위의 단면도이다.(A) of FIG. 2 is a figure which shows the connection of the lead frame by this invention, (b) is sectional drawing of the connection part of (a) figure.

Claims (1)

기판(14) 상면의 도체(16)와 전압조정기 하우징(10)의 리드프레임(12)과의 연결에 니켈와이어(22)를 사용하며 리드 프레임(12)과 니켈와이어(22)에 용접점(20)를 형성하고 용접판(24)과 니켈와이어(22)에 용접점(20)을 형성하여 니켈와이어(22)를 연결하는 방법에 있어서, 상기 기판(14)의 상면에 형성한 도체(16)의 상측부에 땜납으로 구성한 솔더부(18)를 형성하며 상기 솔더부(18)에 전압조정기 하우징(10)의리드 프레임(12)을 접촉시켜 레이저 솔더링을 실시하여 기판(14)의 도체(16)와 전압 조정기 하우징(10)의 리드 프레임(12)을 연결하는 것을 특징으로 하는 레이저 솔더링을 이용한 리드 프레임 연결방법.Nickel wire 22 is used to connect the conductor 16 on the upper surface of the substrate 14 with the lead frame 12 of the voltage regulator housing 10, and a welding point is formed on the lead frame 12 and the nickel wire 22. In the method of forming the welding plate 20 and the nickel wire 22 to form a welding point 20 to connect the nickel wire 22, the conductor 16 formed on the upper surface of the substrate 14 A solder portion 18 composed of solder is formed on the upper side of the upper side of the circuit board, and the lead frame 12 of the voltage regulator housing 10 is brought into contact with the solder portion 18 to perform laser soldering. 16) and the lead frame connection method using laser soldering, characterized in that for connecting the lead frame 12 of the voltage regulator housing (10). ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940020902A 1994-08-24 1994-08-24 Lead frame connection method using laser soldering KR960009138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940020902A KR960009138A (en) 1994-08-24 1994-08-24 Lead frame connection method using laser soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940020902A KR960009138A (en) 1994-08-24 1994-08-24 Lead frame connection method using laser soldering

Publications (1)

Publication Number Publication Date
KR960009138A true KR960009138A (en) 1996-03-22

Family

ID=66697961

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940020902A KR960009138A (en) 1994-08-24 1994-08-24 Lead frame connection method using laser soldering

Country Status (1)

Country Link
KR (1) KR960009138A (en)

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