KR960009138A - Lead frame connection method using laser soldering - Google Patents
Lead frame connection method using laser soldering Download PDFInfo
- Publication number
- KR960009138A KR960009138A KR1019940020902A KR19940020902A KR960009138A KR 960009138 A KR960009138 A KR 960009138A KR 1019940020902 A KR1019940020902 A KR 1019940020902A KR 19940020902 A KR19940020902 A KR 19940020902A KR 960009138 A KR960009138 A KR 960009138A
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- voltage regulator
- laser soldering
- substrate
- regulator housing
- Prior art date
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
본 발명은 전압조정기의 리드 프레임 연결방법에 관한 것으로, 전압조정기 하우징과 기판의 연결시 저항용접이 필요치 않으며 니켈 와이어를 사용하지 않고 연결하는 구조를 갖는 리드 프레임 연결방법을 제공함이 목적이다.The present invention relates to a method of connecting a lead frame of a voltage regulator, and an object of the present invention is to provide a lead frame connecting method having a structure in which resistance welding is not required when connecting the voltage regulator housing and a substrate and connecting without using a nickel wire.
본 발명은 기판의 상면에 형성한 도체의 상측부에 땜납으로 구성한 솔더부를 형성하여 상기 솔더부에 전압조정기 하우징의 리드 프레임을 접촉시켜 레이저 솔더링을 실시하여 기판의 도체와 전압조정기 하우징의 리드 프레임을 연결한다.The present invention forms a solder portion composed of solder on the upper side of the conductor formed on the upper surface of the substrate, and the lead frame of the voltage regulator housing is brought into contact with the solder portion to perform laser soldering to form a lead frame of the conductor of the substrate and the voltage regulator housing. Connect.
상기의 본 발명은 종래의 저항용접에 비해 안전성이 향상되며 작업의 편리성이 증가하는 효과가 있다.The present invention has the effect of improving the safety and convenience of operation compared to the conventional resistance welding.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1도는 종래의 저항용접을 이용한 연결을 도시하는 도면,1 is a view showing a connection using a conventional resistance welding,
제2도의 (가)도는 본 발명에 의한 리드 프레임의 연결을 도시하는 도면이고, (나)도는 (가)도의 연결부위의 단면도이다.(A) of FIG. 2 is a figure which shows the connection of the lead frame by this invention, (b) is sectional drawing of the connection part of (a) figure.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940020902A KR960009138A (en) | 1994-08-24 | 1994-08-24 | Lead frame connection method using laser soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940020902A KR960009138A (en) | 1994-08-24 | 1994-08-24 | Lead frame connection method using laser soldering |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960009138A true KR960009138A (en) | 1996-03-22 |
Family
ID=66697961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940020902A KR960009138A (en) | 1994-08-24 | 1994-08-24 | Lead frame connection method using laser soldering |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960009138A (en) |
-
1994
- 1994-08-24 KR KR1019940020902A patent/KR960009138A/en not_active Application Discontinuation
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR840000080A (en) | Hybrid Integrated Circuit Components and Attachment Method | |
KR870006824A (en) | Safe lead structure for surface mounting electrode components | |
KR870003681A (en) | Electrical components with leads | |
CA2139330A1 (en) | Electrical devices | |
KR960024759A (en) | Assembly structure and assembly method of display device | |
SE0100562L (en) | ||
KR950002104A (en) | Strip line filter | |
SE8702441D0 (en) | STICK WHICH IS FIXED BY A CIRCUIT THROUGH WELDING | |
KR960009138A (en) | Lead frame connection method using laser soldering | |
MY116882A (en) | Electronic component having contact integrated type terminal | |
KR880001046A (en) | Electrical connection method inside the semiconductor component | |
KR940004785A (en) | Semiconductor package | |
KR960002956A (en) | Terminal connection structure | |
KR970007386A (en) | Testing board for electronic device contact and electronic device testing method | |
JPS6421876A (en) | Electrical structural component with contact pin | |
KR910007214A (en) | Electrical circuit board | |
GB2014792A (en) | Electrical circuit element | |
KR0122951Y1 (en) | Printed circuit board structure of double faced forms terminal | |
JPH0124857Y2 (en) | ||
EP0303370A3 (en) | Circuit board component spacer | |
KR930001381A (en) | Manufacturing method of ceramic package | |
JPH0945394A (en) | Pressure contact terminal to eliminate soldering in wiring of base board | |
KR910005431A (en) | Integrated circuit device and its manufacturing method | |
JPS6012748A (en) | Method for connection of thick film conductor | |
JPH06132448A (en) | External terminal of semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |