KR960006134Y1 - Apparatus for drying expandable resin chip - Google Patents
Apparatus for drying expandable resin chip Download PDFInfo
- Publication number
- KR960006134Y1 KR960006134Y1 KR2019930009212U KR930009212U KR960006134Y1 KR 960006134 Y1 KR960006134 Y1 KR 960006134Y1 KR 2019930009212 U KR2019930009212 U KR 2019930009212U KR 930009212 U KR930009212 U KR 930009212U KR 960006134 Y1 KR960006134 Y1 KR 960006134Y1
- Authority
- KR
- South Korea
- Prior art keywords
- chip
- screen
- dryer
- expandable resin
- air
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B13/00—Conditioning or physical treatment of the material to be shaped
- B29B13/06—Conditioning or physical treatment of the material to be shaped by drying
- B29B13/065—Conditioning or physical treatment of the material to be shaped by drying of powder or pellets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B13/00—Conditioning or physical treatment of the material to be shaped
- B29B13/10—Conditioning or physical treatment of the material to be shaped by grinding, e.g. by triturating; by sieving; by filtering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
내용없음.None.
Description
제1도는 본 고안의 사용상태를 나타낸 도면도.1 is a view showing a state of use of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 상부본체 2 : 하부본체1: upper body 2: lower body
3 : 내부스크린 4 : 칩 탈출 방지턱3: Internal screen 4: Chip escape bump
5 : 외부스크린 6 : 상부공기와류실5: External screen 6: Upper airflow chamber
7 : 하부공기와류실 8 : 칩 투입구7: lower air flow chamber 8: chip slot
9 : 초음파레벨측정장치 10 : 습공기배출관9: ultrasonic level measuring device 10: wet air discharge pipe
11, 12 : 내부관측용유리 13 : 상부건조공기 주입관11, 12: inner observation glass 13: upper dry air injection pipe
14 : 하부건조공기 주입관 15 : 칩 배출구14: lower dry air inlet tube 15: chip outlet
16 : 칩16: chip
본 고안은 모든 발포성수지류 칩의 표면 및 내부에 포함되어 있는 수분을 제거하는 드라이어에 관한 것으로 특히 발포성수지(E.P.S)를 생산하는 과정에서 비이드 속 및 외부에 1.0-1.2% 정도 함유되어 있는 발포저해성 수분을 제거하는 장치이다.The present invention relates to a dryer for removing moisture contained in the surface and the inside of all the foamable resin chips. In particular, in the process of producing the foamed resin (EPS), about 1.0-1.2% of the foam is contained in and inside the beads. It is a device that removes inhibitory water.
이에 본 고안은 저온의 건조 공기를 균일하게 드라이어 내부로 공급함으로써 비이드에 포함되어 있는 수분을 0.3-0.5%이내까지 제거하여 발포과정에서 수분에 의한 제품불량률을 극소화하여 품질의 고급화를 얻기 위함이 목적이다.Therefore, the present invention is to supply high quality dry air uniformly into the dryer to remove the water contained in the beads to within 0.3-0.5% to minimize the product defect rate caused by moisture in the foaming process to obtain the quality of the quality. Purpose.
저온 건조식을 사용하는 이유는 비이드 내외의 미반응물과 불완전 반응물등에 펜탄이 존재함으로 높은 온도에서 건조하면 팬탄이 증발하여 불량이 발생키 때문에 이를 해소키 위해 저온(30℃-35℃)에서 3시간정도 공기로 블로잉시켜 건조하는 것이 본 고안의 기술구성이다.The reason for using low temperature drying type is that pentane is present in unreacted and incomplete reactants inside and behind the beads, and when it is dried at high temperature, the pentane evaporates and defects are generated. Blowing with air about time to dry is the technical configuration of the present invention.
종래의 건조기인 회전식은 드럼 드라이어식으로(로타리식) 드럼을 회전 시키면서 내부를 진공으로 유지하여 칩을 건조하는데 이는 수입되는 고가품으로서 일부 대기업을 제외하고는 실제로 건조기를 설치하지 않기 때문에 불량품을 생산하고 있는 실정이다.The conventional dryer rotary is a drum dryer (rotary) while rotating the drum to keep the inside vacuum to dry the chip, which is imported expensive, except in some large enterprises, because it does not actually install a dryer, produces defective products There is a situation.
생산제품의 고급화의 다양화를 절실히 요구하는 현실적인 입장에서 볼 때 회전식 드럼드라이어는 고가품(1∼2억)으로서 투자의 어려움을 안고 있다.In view of the real demand for diversification of the quality of production products, rotary drum dryers are difficult to invest as expensive products (100 to 200 million).
또한 독일에서 수입설치되는 롱-텀 드라이어는 특수스크린망을 설치하여 이를 관통하게 공기를 불어 넣도록 되어 있는데 이는 내측 스크린이 120메쉬로 되어 있어 건조공기 투입시 방해를 받고 칩 탈출 방지턱 미부착으로 일부 칩이 공기 와류실로 세어나와 이로 인해 자주 수리를 해주어야 하는 번거로움을 발생 시키며 침, 레벨 측정을 접촉식(11개소) 레벨 감지기를 채택하여서 제작 작업이 매우 복잡하게 되어있는 등의 문제점이 있다.In addition, the long-term dryer imported from Germany is installed with a special screen net to blow air through it. This is because the inner screen is made of 120 mesh. This air vortex chamber is counted as a problem, which causes troublesome repairs, and there is a problem that the production work is very complicated by adopting a contact (level 11) level sensor for needle and level measurement.
이에 본 고안의 고정식 롱-타임 드라이어는 회전식에 비해 제작 비용이 30%이하로서 간단히 제작하여 모든 수지류 칩의 건조를 충분히 해결할 수 있는 잇점이 있으며 또한 독일식 롱-텀 드라이어에 비해 특수스크린망의 상, 하부에 칩 탈출 방지턱(4)을 부착하여 칩리-크를 막아주고 초음파 레벨 측정장치(9)를 설치하여 간단하게 칩레벨(칩의 량)을 측정할 수 있도록 하였다.Therefore, the fixed long-time dryer of the present invention has an advantage that the manufacturing cost is less than 30% compared to the rotary type, so that the drying of all resin chips can be sufficiently solved, and compared to the German long-term dryer, The chip escape prevention jaw (4) is attached to the upper and lower portions to prevent chip leakage and to install the ultrasonic level measuring device (9) so that the chip level (amount of chip) can be easily measured.
상부본체(1)와 하부본체(2)를 분리시켜 제작이 용이하고 청소 및 보수가 편리하도록 하였으며 내부스크린(3)을 80메쉬로 하여 공기 투입시 방해를 없앴으며 내부스크린(3)의 상하부에 칩 탈출 방지턱(4)을 부착하여 칩(16)이 공기와류실(6), (7)로 토출되는 폐단을 없애고 외부스크린(5)은 13∼18메쉬를 적용하여 강도를 보강하였다.The upper body (1) and the lower body (2) is separated to make it easy to manufacture, and to be easy to clean and repair, and the inner screen (3) to 80 mesh to remove the interference when the air input and the upper and lower parts of the inner screen (3) The chip escape preventing jaw 4 was attached to remove the closed end from which the chip 16 was discharged to the air vortex chambers 6 and 7, and the external screen 5 was reinforced with strength by applying 13 to 18 mesh.
또한 외부스크린(5)을 지지하는 미도시된 서포터의 폭을 줄여 공기와류 저해도를 대폭 낮추었으며 상부본체(1)의 상단부를 콘 타입으로 제작하여 내압성을 향상시킨 본 고안의 칩 투입구(8)로 칩(16)을 투입하면서 하부로부터 저온(30℃∼35℃)의 공기를 상부건조공기주입관(13)과 하부건조공기주입관(14)을 통해(0.3∼0.5kg/M2G)주입시킴으로서 상부공기와류실(6)과 하부공기와류실(7)로 들어온 공기는 외부스크린(5)과 7단으로 구성된 내부스크린(3)을 통해 고르게 분배되어 건조공기가 칩(16)속을 통과하면서 칩(16)의 표면 및 내부에 포함되어 있는 수분을 탈취하여 습공기 배출관(10)으로 방출하도록 되어 있어 충분히 습기가 제거된 칩(16)만이 칩 배출구(15)로 배출이 되는 본 고안은 수분에 의한 칩(16)의 불량발생을 극소화하여 원가절감 및 생산성향상의 효과와 더불어 설치, 수리 및 사용이 용이하도록 한 특징이 있다.In addition, by reducing the width of the supporter not shown to support the outer screen (5) significantly reduced the air vortex inhibition degree, the upper end of the upper body (1) by making a cone type of the chip inlet of the present invention improved the pressure resistance By injecting the low temperature (30 ° C to 35 ° C) air from the bottom through the upper dry air injection pipe 13 and the lower dry air injection pipe 14 (0.3 to 0.5 kg / M2G) while the furnace chip 16 is introduced. The air entering the upper airflow chamber (6) and the lower airflow chamber (7) is distributed evenly through the outer screen (5) and the inner screen (3) consisting of seven stages so that dry air passes through the chip (16). The present invention is to deodorize the moisture contained in the surface and the inside of the (16) to be discharged to the wet air discharge pipe (10), so that only the chip (16) from which moisture is sufficiently removed is discharged to the chip outlet (15). Cost reduction and productivity improvement by minimizing defect of chip 16 In addition, there is a feature to facilitate installation, repair and use.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019930009212U KR960006134Y1 (en) | 1993-05-26 | 1993-05-26 | Apparatus for drying expandable resin chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019930009212U KR960006134Y1 (en) | 1993-05-26 | 1993-05-26 | Apparatus for drying expandable resin chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR940026430U KR940026430U (en) | 1994-12-08 |
| KR960006134Y1 true KR960006134Y1 (en) | 1996-07-22 |
Family
ID=19356104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019930009212U KR960006134Y1 (en) | 1993-05-26 | 1993-05-26 | Apparatus for drying expandable resin chip |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR960006134Y1 (en) |
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1993
- 1993-05-26 KR KR2019930009212U patent/KR960006134Y1/en active Search and Examination
Also Published As
| Publication number | Publication date |
|---|---|
| KR940026430U (en) | 1994-12-08 |
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