KR950028671U - Dual Mold Package - Google Patents

Dual Mold Package

Info

Publication number
KR950028671U
KR950028671U KR2019940006015U KR19940006015U KR950028671U KR 950028671 U KR950028671 U KR 950028671U KR 2019940006015 U KR2019940006015 U KR 2019940006015U KR 19940006015 U KR19940006015 U KR 19940006015U KR 950028671 U KR950028671 U KR 950028671U
Authority
KR
South Korea
Prior art keywords
mold package
dual mold
dual
package
mold
Prior art date
Application number
KR2019940006015U
Other languages
Korean (ko)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR2019940006015U priority Critical patent/KR950028671U/en
Publication of KR950028671U publication Critical patent/KR950028671U/en
Priority to KR1019970002462A priority patent/KR100206982B1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
KR2019940006015U 1994-03-24 1994-03-24 Dual Mold Package KR950028671U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR2019940006015U KR950028671U (en) 1994-03-24 1994-03-24 Dual Mold Package
KR1019970002462A KR100206982B1 (en) 1994-03-24 1997-01-28 Double mold package and its molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940006015U KR950028671U (en) 1994-03-24 1994-03-24 Dual Mold Package

Publications (1)

Publication Number Publication Date
KR950028671U true KR950028671U (en) 1995-10-20

Family

ID=60882928

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940006015U KR950028671U (en) 1994-03-24 1994-03-24 Dual Mold Package

Country Status (1)

Country Link
KR (1) KR950028671U (en)

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
U125 Withdrawal of application by converted application