KR950028671U - Dual Mold Package - Google Patents
Dual Mold PackageInfo
- Publication number
- KR950028671U KR950028671U KR2019940006015U KR19940006015U KR950028671U KR 950028671 U KR950028671 U KR 950028671U KR 2019940006015 U KR2019940006015 U KR 2019940006015U KR 19940006015 U KR19940006015 U KR 19940006015U KR 950028671 U KR950028671 U KR 950028671U
- Authority
- KR
- South Korea
- Prior art keywords
- mold package
- dual mold
- dual
- package
- mold
- Prior art date
Links
- 230000009977 dual effect Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940006015U KR950028671U (en) | 1994-03-24 | 1994-03-24 | Dual Mold Package |
KR1019970002462A KR100206982B1 (en) | 1994-03-24 | 1997-01-28 | Double mold package and its molding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940006015U KR950028671U (en) | 1994-03-24 | 1994-03-24 | Dual Mold Package |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950028671U true KR950028671U (en) | 1995-10-20 |
Family
ID=60882928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940006015U KR950028671U (en) | 1994-03-24 | 1994-03-24 | Dual Mold Package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR950028671U (en) |
-
1994
- 1994-03-24 KR KR2019940006015U patent/KR950028671U/en not_active Application Discontinuation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
U125 | Withdrawal of application by converted application |