KR100206982B1 - Double mold package and its molding method - Google Patents

Double mold package and its molding method Download PDF

Info

Publication number
KR100206982B1
KR100206982B1 KR1019970002462A KR19970002462A KR100206982B1 KR 100206982 B1 KR100206982 B1 KR 100206982B1 KR 1019970002462 A KR1019970002462 A KR 1019970002462A KR 19970002462 A KR19970002462 A KR 19970002462A KR 100206982 B1 KR100206982 B1 KR 100206982B1
Authority
KR
South Korea
Prior art keywords
molding method
mold package
double mold
double
package
Prior art date
Application number
KR1019970002462A
Other languages
Korean (ko)
Inventor
Se-Jin Jang
Original Assignee
Hyundai Micro Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR2019940006015U external-priority patent/KR950028671U/en
Application filed by Hyundai Micro Electronics Co filed Critical Hyundai Micro Electronics Co
Priority to KR1019970002462A priority Critical patent/KR100206982B1/en
Application granted granted Critical
Publication of KR100206982B1 publication Critical patent/KR100206982B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
KR1019970002462A 1994-03-24 1997-01-28 Double mold package and its molding method KR100206982B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019970002462A KR100206982B1 (en) 1994-03-24 1997-01-28 Double mold package and its molding method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR2019940006015U KR950028671U (en) 1994-03-24 1994-03-24 Dual Mold Package
KR1019970002462A KR100206982B1 (en) 1994-03-24 1997-01-28 Double mold package and its molding method

Publications (1)

Publication Number Publication Date
KR100206982B1 true KR100206982B1 (en) 1999-07-01

Family

ID=26630262

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970002462A KR100206982B1 (en) 1994-03-24 1997-01-28 Double mold package and its molding method

Country Status (1)

Country Link
KR (1) KR100206982B1 (en)

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20050322

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee