KR950028669U - 픽 업 헤드 - Google Patents
픽 업 헤드Info
- Publication number
- KR950028669U KR950028669U KR2019940005356U KR19940005356U KR950028669U KR 950028669 U KR950028669 U KR 950028669U KR 2019940005356 U KR2019940005356 U KR 2019940005356U KR 19940005356 U KR19940005356 U KR 19940005356U KR 950028669 U KR950028669 U KR 950028669U
- Authority
- KR
- South Korea
- Prior art keywords
- pick
- head
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940005356U KR200161953Y1 (ko) | 1994-03-17 | 1994-03-17 | 픽 업 헤드 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940005356U KR200161953Y1 (ko) | 1994-03-17 | 1994-03-17 | 픽 업 헤드 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950028669U true KR950028669U (ko) | 1995-10-20 |
KR200161953Y1 KR200161953Y1 (ko) | 1999-12-01 |
Family
ID=19379094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940005356U KR200161953Y1 (ko) | 1994-03-17 | 1994-03-17 | 픽 업 헤드 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200161953Y1 (ko) |
-
1994
- 1994-03-17 KR KR2019940005356U patent/KR200161953Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR200161953Y1 (ko) | 1999-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20080820 Year of fee payment: 10 |
|
EXPY | Expiration of term |