KR950028655U - Polysilicon etching device on the back of the wafer - Google Patents

Polysilicon etching device on the back of the wafer

Info

Publication number
KR950028655U
KR950028655U KR2019940004973U KR19940004973U KR950028655U KR 950028655 U KR950028655 U KR 950028655U KR 2019940004973 U KR2019940004973 U KR 2019940004973U KR 19940004973 U KR19940004973 U KR 19940004973U KR 950028655 U KR950028655 U KR 950028655U
Authority
KR
South Korea
Prior art keywords
wafer
etching device
polysilicon etching
polysilicon
etching
Prior art date
Application number
KR2019940004973U
Other languages
Korean (ko)
Other versions
KR970003598Y1 (en
Inventor
정연국
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019940004973U priority Critical patent/KR970003598Y1/en
Publication of KR950028655U publication Critical patent/KR950028655U/en
Application granted granted Critical
Publication of KR970003598Y1 publication Critical patent/KR970003598Y1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
KR2019940004973U 1994-03-11 1994-03-11 Polysilicon etcher of wafer rearface KR970003598Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940004973U KR970003598Y1 (en) 1994-03-11 1994-03-11 Polysilicon etcher of wafer rearface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940004973U KR970003598Y1 (en) 1994-03-11 1994-03-11 Polysilicon etcher of wafer rearface

Publications (2)

Publication Number Publication Date
KR950028655U true KR950028655U (en) 1995-10-20
KR970003598Y1 KR970003598Y1 (en) 1997-04-18

Family

ID=19378822

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940004973U KR970003598Y1 (en) 1994-03-11 1994-03-11 Polysilicon etcher of wafer rearface

Country Status (1)

Country Link
KR (1) KR970003598Y1 (en)

Also Published As

Publication number Publication date
KR970003598Y1 (en) 1997-04-18

Similar Documents

Publication Publication Date Title
DE69610457D1 (en) Semiconductor device
KR970004020A (en) Semiconductor device
DE69631940D1 (en) Semiconductor device
DE59607521D1 (en) Semiconductor device configuration
DE59508581D1 (en) Semiconductor device
DE69522789T2 (en) Semiconductor device
DE69501381T2 (en) SEMICONDUCTOR DEVICE
DE69513207D1 (en) Semiconductor device
DE69531121D1 (en) Integrated semiconductor device
KR960009084A (en) Semiconductor device
KR950028655U (en) Polysilicon etching device on the back of the wafer
DE69635334D1 (en) SEMICONDUCTOR DEVICE
KR950023953U (en) Semiconductor plasma etching device
KR970025802U (en) Wafer etching device
KR930026515U (en) Semiconductor etching device
KR960009225A (en) Semiconductor device
KR970015302U (en) Semiconductor wafer cleaning device
KR970046726U (en) Wafer backside etching device
KR950015160U (en) Semiconductor wet etching device
KR970003188U (en) Semiconductor wafer baking device
DE9417362U1 (en) Semiconductor device
KR940023546U (en) Wafer photoresist baking device
KR970003228U (en) Semiconductor device
KR960025322U (en) Thinner supply device for wafer etching
KR960019120U (en) Wafer Annealing Device

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050824

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee