KR950026790A - Semiconductor Package Transfer Device - Google Patents

Semiconductor Package Transfer Device Download PDF

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Publication number
KR950026790A
KR950026790A KR1019940005620A KR19940005620A KR950026790A KR 950026790 A KR950026790 A KR 950026790A KR 1019940005620 A KR1019940005620 A KR 1019940005620A KR 19940005620 A KR19940005620 A KR 19940005620A KR 950026790 A KR950026790 A KR 950026790A
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KR
South Korea
Prior art keywords
semiconductor package
loading
screw
transfer device
tray
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Application number
KR1019940005620A
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Korean (ko)
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KR0132389B1 (en
Inventor
곽노권
Original Assignee
곽노권
주식회사 한미금형
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Priority to KR1019940005620A priority Critical patent/KR0132389B1/en
Publication of KR950026790A publication Critical patent/KR950026790A/en
Application granted granted Critical
Publication of KR0132389B1 publication Critical patent/KR0132389B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

본 발명은 스트립 성형이 완료된 반도체 팩키지를 트레이에 일정한 간격으로 배열시켜 적재하는 반도체 패키지 이송장치에 관한 것으로, 종래의 방법은 제1도에서와 같이 리드프레임에서 분리(Singulation)된 팩키지를 하나씩 집어 이 팩키지를 트레이에 일정한 간격으로 배열시켜 적재하는 방법을 사용하고 있으며, 종래의 방법에 의하면 X-Y 로봇의 적재속도가 느리기 때문에 반도체 팩키지의 적재공정에서 있으며, 종래의 방법에 의하면 X-Y 로봇의 적재속도가 느리기 때문에 반도체 팩키지의 적재공정에서 생산성 저하의 커다란 요인으로 대두되었는데, 본 발명은 상기한 바와같은 폐단을 해소하기 위하여 안출된 것으로, 스트립성형기에서 성형이 완료된 반도체 팩키지를 한꺼번에 트레이의 가로줄 또는 세로줄의 갯수 또는 원하는 갯수만큼 신속하게 트레이에 일정간격으로 배열시켜 적재함으로써 반도체 팩키지의 적재공정에서 생산성을 향상시킬 수 있도록 제2도 내지 제9도에 도시한 바와같이 스트립 성형기(10)로부터 반도체 팩키지 푸셔(12)에 의해 이탈된 반도체 팩키지(14)를 적재용 트레이(16)의 가로줄 또는 세로줄의 팩키지 포켓수(17)와 동일한 갯수 또는 원하는 갯수만큼 적재할 수 있는 복수개의 적재수단(60)과, 상기 적재수단(60)을 X-Y 로봇(18)까지 교차로 이송시킬 수 있는 이송수단(80) 및 공급수단(40)으로 구성된 반도체 팩키지 이송장치(30)로써 멈춤 및 지체동작없이 반도체 팩키지를 트레이에 신속하게 적재하여 생산성을 향상시킬 수 있게 되는 것이다.The present invention relates to a semiconductor package transfer device for arranging stripped semiconductor packages arranged in a tray at regular intervals, and the conventional method is to pick up packages separated from a lead frame as shown in FIG. It uses a method of arranging and stacking packages on a tray at regular intervals. According to the conventional method, since the loading speed of the XY robot is slow, it is in the process of loading a semiconductor package. Therefore, the semiconductor package has emerged as a large factor of productivity decrease in the loading process, the present invention was devised to solve the above-described waste, the number of horizontal or vertical lines of the tray at the same time the completed semiconductor package in the strip molding machine or As fast as you want The semiconductor separated from the strip molding machine 10 by the semiconductor package pusher 12 as shown in FIGS. 2 to 9 so as to improve the productivity in the semiconductor package loading process by arranging and loading the wafer at a predetermined interval. A plurality of stacking means 60 capable of stacking the package 14 as many as the number or desired number of package pockets 17 in a horizontal row or a vertical row of the stacking tray 16; and the stacking means 60 as XY. The semiconductor package transfer device 30 composed of a transfer means 80 and a supply means 40 capable of transferring the robot 18 to the intersection 18 can be quickly loaded with a semiconductor package on a tray without stopping and delaying to improve productivity. Will be.

Description

반도체 팩키지 이송장치Semiconductor Package Transfer Device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명에 의한 반도체 팩키지 이송장치를 이루는 적재수단과 이송수단 및 공급수단의 조합상태 예시도,2 is a view illustrating a combined state of a loading means, a transfer means and a supply means constituting the semiconductor package transfer device according to the present invention;

제3도는 제2도에 도시된 공급수단의 평면도,3 is a plan view of the supply means shown in FIG.

제4도는 상기 공급수단의 정면도,4 is a front view of the supply means,

제6도는 제2도에 도시된 적재수단과 이송수단의 평면도.6 is a plan view of the stacking means and the conveying means shown in FIG.

Claims (6)

반도체 팩키지 이송장치에 있어서, 스트립 성형기(10)로부터 반도체 팩키지(14)를 공급하는 공급수단(40)과, 공급수단(40)에 의해 반도체 팩키지(14)를 적재하는 복수개의 적재수단(60) 및 복수개의 적재수단(60)을 이송시키는 이송수단(80)으로 구성된 것을 특징으로 하는 반도체 팩키지 이송장치.In the semiconductor package conveying apparatus, a supply means 40 for supplying the semiconductor package 14 from the strip molding machine 10 and a plurality of loading means 60 for loading the semiconductor package 14 by the supply means 40. And a conveying means (80) for conveying a plurality of loading means (60). 제1항에 있어서, 공급수단(40)은 공급실린더(42)에 의해 종방향으로 가설된 종향방 가이드레일(44)을 따라 왕복되는 진공패드(46)와 픽업실린더(47) 및 이송판(48)으로 구성된 종이동부(49)와, 종이동부(49)가 얹혀진 종방향 가이드레일(44)을 포함하며 연결블록(50)과 지지블록(51) 및 이동블록(52)으로 구성된 횡이동부(53)와 횡이동부(53)를 안내하는 횡방향 가이드레일(54) 및 횡이동부(53)를 횡방향 가이드레일(54)을 따라 왕복시키는 이동실린더(55)로 구성되는 것을 특징으로 하는 반도체 팩키지 이송장치.2. The supply means (40) according to claim 1, wherein the supply means (40) is a vacuum pad (46), a pickup cylinder (47), and a transfer plate (reciprocated along a longitudinal guide rail (44), which is arranged longitudinally by the supply cylinder (42). A horizontal moving part comprising a paper moving part 49 composed of 48 and a longitudinal guide rail 44 on which the paper moving part 49 is mounted and comprising a connecting block 50, a supporting block 51, and a moving block 52. (53) and the transverse guide rails (54) for guiding the lateral moving portion (53) and the transverse cylinder (53) reciprocating along the lateral guide rails (54). Semiconductor package transfer device. 제2항에 있어서, 공급수단(40)에는 종이동부(49)를 2단 스트로크(Stroke)되도록 하는 중간스톱퍼(56)와, 이를 구동시키기 위한 중간스톱퍼 실린더(58) 및 횡이동부(53)가 횡방향 가이드레일(54)에서 왕복운동시 양단에서의 완충을 위한 쇽업소버(57,57′)가 설치된 것을 특징으로 하는 반도체 팩키지 이송장치.3. The supply means (40) according to claim 2, wherein the supply means (40) has an intermediate stopper (56) for making the paper moving part (49) two strokes, an intermediate stopper cylinder (58) and a horizontal moving part (53) for driving it. And a shock absorber (57, 57 ') for cushioning at both ends during the reciprocating motion in the transverse guide rail (54). 제1항에 있어서, 복수개의 적재수단(60)에는 그 상부에 다수개의 적재부(62)가 형성되며 이 적재수단(60)의 외측면 하부에는 센서도그(64)가 설치된 것으로, 이 적재수단(60)은 이송수단(80)의 스크루(82)에 외설되어 스크루(82)의 좌우로 왕복운동을 하도록 구성시킨 것을 특징으로 하는 반도체 팩키지 이송장치.According to claim 1, wherein the plurality of loading means 60 is formed with a plurality of loading portion 62 on the upper portion of the loading means 60, the sensor dog 64 is installed on the lower side of the outer surface of the loading means 60, the loading means (60) is a semiconductor package transfer device, characterized in that it is installed on the screw 82 of the transfer means (80) to reciprocate from side to side of the screw (82). 제1항에 있어서, 이송수단(80)은 지지판(81)의 상면에 그 길이방향으로 복수개의 스크루(82)가 병설되며, 스크루(82)의 일단에는 타이밍 풀리(84)가 부착되어 두개의 타이밍 모터(86)에 각각 타이밍 벨트(85)로 연결되고, 스크루(82)의 타단에는 지지베어링(87)이 축설된 것이며, 각각의 스크루(82)에는 적재수단(60)이 외설되어 타이밍모터(86)의 정. 역회전에 의해 스크루(82)가 회전하면 적재수단(60)이 스크루(82)를 따라 왕복 가능하도록 구성시킨 것을 특징으로 하는 반도체 팩키지 이송장치.According to claim 1, The conveying means 80 is provided with a plurality of screws 82 in the longitudinal direction on the upper surface of the support plate 81, one end of the screw 82 is attached to the timing pulley 84 It is connected to the timing motor 86 by the timing belt 85, respectively, and the support bearing 87 is built in the other end of the screw 82, and the loading means 60 is attached to each screw 82, and the timing motor is attached. Tablets of 86. The semiconductor package transfer device, characterized in that the loading means 60 is configured to be reciprocated along the screw 82 when the screw 82 rotates by reverse rotation. 제5항에 있어서, 스크루(82)가 병설된 지지판(81)의 양단 양측면에는 적재수단(82)에 위치를 확인할 수 있는 센서(88)가 설치된 고정블럭(90)과 센서고정판(92)을 부착시킨 것을 특징으로 하는 반도체 팩키지 이송장치.6. The fixed block 90 and the sensor fixing plate 92 according to claim 5, wherein both sides of the support plate 81 having the screw 82 are provided with the fixing block 90 and the sensor fixing plate 92 provided with the sensor 88 capable of confirming the position on the loading means 82. A semiconductor package transfer device, characterized in that attached. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940005620A 1994-03-21 1994-03-21 Apparatus for semiconductor package transfer KR0132389B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940005620A KR0132389B1 (en) 1994-03-21 1994-03-21 Apparatus for semiconductor package transfer

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Application Number Priority Date Filing Date Title
KR1019940005620A KR0132389B1 (en) 1994-03-21 1994-03-21 Apparatus for semiconductor package transfer

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KR950026790A true KR950026790A (en) 1995-10-16
KR0132389B1 KR0132389B1 (en) 1998-04-20

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100321545B1 (en) * 1999-07-15 2002-01-23 김광교 Moving apparatus of wafer cassette

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100822995B1 (en) * 2007-06-27 2008-04-16 윤점채 Pick and place unit in singulation handler

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100321545B1 (en) * 1999-07-15 2002-01-23 김광교 Moving apparatus of wafer cassette

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