KR950021415U - Ic 카드 패키지 - Google Patents

Ic 카드 패키지

Info

Publication number
KR950021415U
KR950021415U KR2019930031738U KR930031738U KR950021415U KR 950021415 U KR950021415 U KR 950021415U KR 2019930031738 U KR2019930031738 U KR 2019930031738U KR 930031738 U KR930031738 U KR 930031738U KR 950021415 U KR950021415 U KR 950021415U
Authority
KR
South Korea
Prior art keywords
card package
package
card
Prior art date
Application number
KR2019930031738U
Other languages
English (en)
Other versions
KR200164522Y1 (ko
Inventor
홍성학
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019930031738U priority Critical patent/KR200164522Y1/ko
Publication of KR950021415U publication Critical patent/KR950021415U/ko
Application granted granted Critical
Publication of KR200164522Y1 publication Critical patent/KR200164522Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
KR2019930031738U 1993-12-31 1993-12-31 Ic 카드 패키지 KR200164522Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930031738U KR200164522Y1 (ko) 1993-12-31 1993-12-31 Ic 카드 패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930031738U KR200164522Y1 (ko) 1993-12-31 1993-12-31 Ic 카드 패키지

Publications (2)

Publication Number Publication Date
KR950021415U true KR950021415U (ko) 1995-07-28
KR200164522Y1 KR200164522Y1 (ko) 2000-01-15

Family

ID=19374688

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930031738U KR200164522Y1 (ko) 1993-12-31 1993-12-31 Ic 카드 패키지

Country Status (1)

Country Link
KR (1) KR200164522Y1 (ko)

Also Published As

Publication number Publication date
KR200164522Y1 (ko) 2000-01-15

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