KR950018686A - How to remove sludge in plating solution - Google Patents

How to remove sludge in plating solution Download PDF

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Publication number
KR950018686A
KR950018686A KR1019930027047A KR930027047A KR950018686A KR 950018686 A KR950018686 A KR 950018686A KR 1019930027047 A KR1019930027047 A KR 1019930027047A KR 930027047 A KR930027047 A KR 930027047A KR 950018686 A KR950018686 A KR 950018686A
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KR
South Korea
Prior art keywords
plating liquid
sludge
plating
filtering
sludge treatment
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Application number
KR1019930027047A
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Korean (ko)
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KR960007779B1 (en
Inventor
이재영
손진군
김병원
Original Assignee
조말수
포항종합제철주식회사
백덕현
재단법인산업과학기술연구소
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Priority to KR1019930027047A priority Critical patent/KR960007779B1/en
Publication of KR950018686A publication Critical patent/KR950018686A/en
Application granted granted Critical
Publication of KR960007779B1 publication Critical patent/KR960007779B1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/06—Filtering particles other than ions

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Treatment Of Sludge (AREA)

Abstract

본 발명의 도금성분의 유실을 방지하고, 스러지 제거효율을 높이고자 제안된 것으로서, 종래의 스러지 여과공정에 스러지 처리공정을 추가하고, 조업조건을 변경시킴으로서, 효과적인 도금액내의 스러지를 제거하는 방법을 제공하고자 하는데 그 목적이 있다.It is proposed to prevent the loss of the plating component of the present invention, and to improve the sludge removal efficiency, by adding a sludge treatment process to the conventional sludge filtration process, by changing the operating conditions, to remove the sludge in the effective plating solution The purpose is to provide a method.

본 발명은 도금조에서 도금액의 pH와 스러지 처리시 도금액의 pH를 다르게 조절하는 단계 ; 및 상기 pH가 조절된 도금액중의 스러지를 여과하는 단계로 이루어진 도금액내의 스러지 제거방법에 있어서, 상기 pH 조절단계에서 도금액의 pH를 1.5-3.0으로 조절하고 ; 상기 pH 조절단계 및 여과단계 사이에 스러지 처리단계를 추가하고 ; 그리고 상기 스러지 처리단계에서 도금액의 pH를 3.0-4.5로 조절하고, 공기, 산소 및 과산화수소수로 이루어진 산화매체 그룹중에서 선택된 1종을 도금액내에 유입하여 도금액을 산화시킨 다음 여과하는 것을 특징으로 하는 도금액내의 스러지 제거방법을 그 요지로 한다.The present invention comprises the steps of differently adjusting the pH of the plating solution and the pH of the plating solution during the sludge treatment in the plating bath; And a sludge removal method in the plating liquid, comprising: filtering sludge in the pH-controlled plating liquid, wherein the pH of the plating liquid is adjusted to 1.5-3.0 in the pH adjusting step; Adding a sludge treatment step between the pH adjustment step and the filtration step; In the sludge treatment step, the pH of the plating liquid is adjusted to 3.0-4.5, and the plating liquid is oxidized after filtering the plating liquid by introducing one selected from the group of oxidizing media consisting of air, oxygen, and hydrogen peroxide solution into the plating liquid and filtering The sludge removal method of the inside is made into the summary.

Description

도금액내의 스러지 제거방법How to remove sludge in plating solution

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 종래의 전기도금액내의 스러지 제거장치의 일례를 개략적으로 나타내는 개략도,1 is a schematic diagram schematically showing an example of a sludge removing apparatus in a conventional electroplating solution,

제2도는 본 발명을 적용하기 위한 전기도금액내의 스러지 제거자치의 일례를 개략적으로 나타내는 개략도Figure 2 is a schematic diagram schematically showing an example of the autonomous sludge removal in the electroplating solution for applying the present invention

Claims (3)

도금조에서 도금액의 pH와 스러지 처리시 도금액의 pH를 조절하는 단계 ; 및 상기 pH가 조절된 도금액 중의 스러지를 여과하는 단계로 이루어진 도금액내의 스러지 제거방법에 있어서, 상기 pH 조절단계에서 도금액의 pH를 1.5-3.0으로 조절하고 ; 상기 pH 조절단계 및 여과단계 사이에 스러지 처리단계를 추가하고 ; 그리고 상기 스러지 처리단계에서 도금액의 pH를 3.0-4.5로 조절하고, 공기, 산소 및 과산화수소수로 이루어진 산화매체 그룹중에서 선택된 1종을 도금액내에 유입하여 도금액을 산화시킨 다음 여과하는 것을 특징으로 하는 도금액내의 스러지 제거방법Adjusting the pH of the plating liquid in the plating bath and the pH of the plating liquid during sludge treatment; And a sludge removal method in the plating liquid, comprising: filtering sludge in the pH-controlled plating liquid, wherein the pH of the plating liquid is adjusted to 1.5-3.0 in the pH adjusting step; Adding a sludge treatment step between the pH adjustment step and the filtration step; In the sludge treatment step, the pH of the plating liquid is adjusted to 3.0-4.5, and the plating liquid is oxidized after filtering by injecting one selected from the group of oxidizing media consisting of air, oxygen, and hydrogen peroxide solution into the plating liquid, and then filtering the plating liquid. How to remove sludge inside 제1항에 있어서, 도금액이 Zn 또는 Zn-Ni 도금액인 것을 특징으로 하는 도금액내의 스러지 제거방법The method of claim 1, wherein the plating liquid is Zn or Zn-Ni plating liquid. 제1항 또는 제2항에 있어서, 산화매체가 공기의 경우 도금액 1ℓ당 1-5ℓ/분, 산소의 경우 도금액 1ℓ당 0.2-1ℓ분, 과산화수소수의 경우 도금액내의 Fe+2이온 몰수에 대해 1-10배의 몰수로 유입되는 것을 특징으로 하는 도금액내의 스러지 제거방법The method according to claim 1 or 2, wherein the oxidizing medium is 1-5 l / min per liter of plating liquid for air, 0.2-1 l per liter of plating liquid for oxygen, and 1 for moles of Fe +2 ions in the plating liquid for hydrogen peroxide. Sludge removal method in the plating liquid, characterized in that the flow in -10 times the number of moles ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930027047A 1993-12-09 1993-12-09 Method for removing a sludge of plating solution KR960007779B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019930027047A KR960007779B1 (en) 1993-12-09 1993-12-09 Method for removing a sludge of plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930027047A KR960007779B1 (en) 1993-12-09 1993-12-09 Method for removing a sludge of plating solution

Publications (2)

Publication Number Publication Date
KR950018686A true KR950018686A (en) 1995-07-22
KR960007779B1 KR960007779B1 (en) 1996-06-12

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110027585A (en) * 2009-09-08 2011-03-16 우에무라 고교 가부시키가이샤 Electroplating apparatus and electroplating method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102002342B1 (en) * 2018-06-28 2019-07-23 김대범 Device for agitating and supplying of plating solution

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110027585A (en) * 2009-09-08 2011-03-16 우에무라 고교 가부시키가이샤 Electroplating apparatus and electroplating method

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