KR950013603B1 - Test soket for semiconductor - Google Patents

Abstract

a pair of first pressurizing members moved in left and right directions by a toothed screw mounted in the center of lower surface of a cover; and a pair of second pressurizing members moved in forward and downward directions by an adjusting screw mounted in the outer side of the cover, the second pressurizing members installed perpendicularly to the first pressurizing members. The first pressurizing members are composed of a moving plate moved by the toothed screw and a pressurizing plate integrated with the moving plate.

Description

Characteristics test socket of semiconductor package

1 is a cross-sectional view for explaining the configuration of a conventional semiconductor package characteristic test socket.

2 is a main view for explaining the relationship between the conventional test socket pressing portion and the semiconductor package lead.

3 is a cross-sectional view showing a first embodiment of a semiconductor package characteristic test socket according to the present invention;

4 shows the inside of the cover of the test socket of FIG.

5 (a), (b) and (c) are views for explaining the operating states of the first and second pressing members applied to FIG.

6 is a sectional view showing a second embodiment of a semiconductor package characteristic test socket according to the present invention;

7 shows the inside of the cover of the test socket of FIG.

8 (a), (b) is a view for explaining the operating state of the pressing member applied to FIG.

9 is a sectional view showing a third embodiment of a semiconductor package characteristic test socket according to the present invention;

10 (a) and 10 (b) are views showing the inside of the cover of the test socket of FIG.

The present invention relates to a semiconductor device, and more particularly, in a test process for inspecting various electrical characteristics of a surface mount semiconductor package, even if the lead length of the semiconductor package is different from each other so that the pressing part can be adjusted according to the lead length. A semiconductor package relates to a characteristic test socket.

In general, in testing various electrical characteristics such as a quality assurance test, a shipment inspection, and a storage inspection of a semiconductor package, a characteristic test socket 10 as shown in FIG. 1 is used. The socket 10 has a cover 11a and a body 11b connected by a hinge 12 so that the cover 11a is rotatably installed around the hinge 12, and a center of the inside of the cover 11a is provided. The pressing piece 13 is installed in a flowable manner around the hinge 13a.

In addition, the leads 14a of the semiconductor package 14 may be seated inside the body 11b below the pressing piece 13, and one end of the contact terminals 15 may be exposed to the outside of the socket 10. It is.

Therefore, when the test socket 10 is used as described above, the contact terminals 15 of the socket 10 are connected to a separate test apparatus (not shown), and then one side of the cover 11a is pressed. The leads 14a of the semiconductor package 14 come into contact with the contact terminal 15 to test various electrical characteristics.

By the way, in the conventional characteristic test socket 10 as described above, the width C of the pressing piece 13 provided inside the lid 11a is fixed constantly, as shown in FIG. If the lead length L1 is changed in the group 14), there is a problem that the test socket 10 should be selected or used according to the lead length L1 or a separate test socket 10 should be used.

The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to freely adjust the width of the pressing members installed inside the cover of the test socket even when the lead length is changed in the same semiconductor package group. The purpose of the present invention is to provide a test socket for a characteristic of a semiconductor package that can greatly increase the utilization rate of the test socket.

Another object of the present invention is to provide a test socket characteristic test socket of a semiconductor package that can be used as a single test socket regardless of the lead length, so that a separate socket is not required and the cost can be easily reduced.

It is still another object of the present invention to provide a characteristic test socket of a semiconductor package in which the pressing member is manufactured integrally and then the height thereof is simply adjustable so that the shoulder portion can be pressed regardless of the lead length of the package.

A feature of the present invention for achieving the above object is, in the test socket of the semiconductor package for inspecting the electrical characteristics by mounting the semiconductor package inside the socket consisting of the cover and the body, mounted on the center of the lower surface of the cover And a pair of second pressing members moved back and forth by an adjustment screw mounted on the outer surface so as to be installed at right angles to the first pressing member and covered at right angles to the first pressing member. The characteristics of the semiconductor package are in the test sockets.

Another feature of the present invention is a characteristic test socket of a semiconductor package for inspecting electrical characteristics by mounting a semiconductor package inside a socket composed of a cover and a body, wherein the cover is formed by a data screw mounted at the center of the lower side of the cover. It is a characteristic test socket of a semiconductor package that allows the mounted pressing members to be elastically moved back and forth, left and right at the same time.

In another aspect of the present invention, in the characteristic test socket of the semiconductor package for mounting the semiconductor package inside the socket consisting of the cover and the body to inspect the electrical characteristics, the pressing members assembled in the cover are integrally formed, It is in the characteristic test socket of the semiconductor package which height adjustment is made freely by the fixing screw attached to the outer surface of this cover.

Hereinafter, embodiments of the characteristic test socket of the semiconductor package according to the present invention will be described in detail with reference to the accompanying drawings.

3A through 5B are diagrams for explaining the first embodiment of the present invention. The characteristic test socket 20 has a lid 21a and a body 21b as in the prior art. It is connected to the hinge 22, the cover 21a is installed so as to be rotatable about the hinge 22.

In addition, as shown in FIGS. 3 and 4, a toothed screw 23 having a toothed portion 23a is mounted inside the cover 21a, and the toothed screw 23 moves left and right. A pair of 1st pressing member 24 is provided, respectively.

The first pressing member 24 has a moving piece 24a which meshes with the toothed portion 23a of the toothed screw 23 as shown in FIG. 5 (a) and one end of the moving piece 24a. It consists of a pressing piece 24b formed integrally with the guide piece, and in the long hole 24c formed in the moving piece 24a, a guide screw 25 mounted below the cover 21a is fitted to each other to move the moving piece 24a. It can be guided and fixed at the same time.

On the other hand, the pair of second pressing member 26 is installed at right angles to the first pressing member 24 and moved back and forth to the outside of the cover 21a as shown in FIGS. 4 and 5 (b). A pair of exposed and mounted adjusting screws 27 are provided to face each other, and the pressing pieces 26a screwed to the adjusting screws 27 can move back and forth, and are formed on both shafts of the pressing pieces 26a. Springs 29a and 29b are respectively mounted between the grooves 26b and 26c and the grooves 28a and 28b formed opposite to the cover 21a to impart elasticity, thereby providing a shock absorbing effect.

In the case of using the test socket 20 configured as described above, first, after recognizing the lead length of the semiconductor package to be tested, the toothed screw 23 mounted inside the cover 21a is turned clockwise or counterclockwise. As it rotates, the moving piece 24a of the first pressing member 24 engaged with the toothed portion 23a of the toothed screw 23 is guided by the guide screw 25 to move left and right. After setting the position according to the lead length by tightening the guide screw 25 it is possible to freely adjust the width of the first pressing member (24).

In addition, when adjusting the width of the second pressing member 26, as shown in Fig. 5 (b) by loosening or tightening the adjusting screw 27 exposed on the outer surface of the cover (21a). The width of the second pressing member 26 can be adjusted by moving the spring 26a and 29b elastically back and forth by the springs 29a and 29b. In this case, the adjusting screw 27 and the pressing piece 26a directly The screw assembly eliminates the need for a separate fixing guide screw.

After adjusting the widths of the first and second pressing members 24 and 26 as described above, the semiconductor package is placed on the contact terminals installed in the body 21b as shown in FIG. The first and second pressing members 24 and 26 press the leads of the semiconductor package to close the contact terminals so that various electrical characteristics can be tested.

6 to 9 (a) and (b) are diagrams for explaining the second embodiment of the present invention, and this characteristic test socket 30 has a cover 31a similarly to the above-described second embodiment. And the body 31b are connected to the hinge 32 so that the cover 31a is rotatable about the hinge 32.

In addition, as shown in Figs. 6 and 7, a taper screw 33 having a taper portion 33a is mounted in the center of the lid 31a, and the front and rear sides of the taper screw 33 are mounted. Four pressing members 34 moving simultaneously in the left and right directions are provided, respectively.

The pressing members 34 are in contact with the tapered portion 33a of the tapered screw 33 as shown in FIG. 8 (a) and move in the front, rear, left and right directions, and the movable piece 34a. It consists of a pressing piece (34b) integrally formed at one end of the side), and in the long hole (34c) formed in the moving piece (34a), the guide screw (35) mounted below the cover (31a) is fitted to move The piece 24a can be guided and the position can be fixed.

In addition, grooves 34c and 34d formed in the pressing piece 34b and guide screws 35 mounted below the cover 31a are fitted to each other to guide the moving piece 34a and at the same time fix the position. You can do it.

In addition, springs 37a and 37b are mounted between the grooves 34c and 34d formed in the pressing piece 34b and the grooves 36a and 36b formed opposite to the side surface of the cover 31a, respectively. By imparting a buffer function can be performed.

In the case of using the test socket 30 configured as described above, first, after recognizing the lead length of the semiconductor package to be tested, the taper screw 33 mounted inside the cover 31a is rotated clockwise or counterclockwise. Since the moving pieces 34a of the pressing member 34 in contact with the tapered portion 33a of the tapered screw 33 are guided by the guide screw 35 as they are rotated, they move simultaneously back and forth and from side to side. After the position is set according to the lead length of the semiconductor package, the width of the pressing member 34 can be freely adjusted by tightening the guide screw 35.

After adjusting the width of the pressing member 34 as described above, it is possible to test various electrical characteristics of the semiconductor package in the same manner as in the first embodiment.

9 to 10 (a) and (b) are diagrams for explaining the third embodiment of the present invention, and this characteristic test socket 40 is similar to the above-described first and second embodiments. The cover 41a and the body 41b are connected to the hinge 42 so that the cover 41a is rotatable about the hinge 42.

In addition, as shown in FIGS. 10 (a) and 10 (b), the pressing member 43 in which the pressing pieces 43a are integrally formed inside the cover 41a is assembled. The height of the cover 41a is exposed to the outside by a pair of adjustment screws 44 which are installed to face each other.

In the case of using the characteristic test socket 40 as described above, the height of the integral pressing member 43 is first adjusted by the adjusting screw 44 on the side of the cover 41a, and then, as described in the first embodiment. In the same way, the electrical characteristics of the semiconductor package can be tested.

In this case, the characteristic test socket 40 is capable of adjusting the height of the pressing member 43 while the pressing pieces 43a are not adjustable in width, so that the contact pressing portion becomes a shoulder surface or leads as in the prior art. By using the terminal portion, all of the body sizes are the same regardless of the lead length of the semiconductor package, and even if the lead length is changed, if only the pressing member 43 is manufactured separately and assembled into the cover 41a, the characteristic test is performed. It becomes possible.

Meanwhile, in each of the above-described embodiments, the products mainly formed with the leads of the semiconductor package in the four-row direction have been described. However, the lids of the semiconductor packages may be applied to the products formed in the two-row direction. It can also be easily applied to the body part.

As described above, according to the characteristic test socket of the semiconductor package according to the present invention, the utilization rate of the test socket can be further increased by allowing the width of the pressing members to be freely adjusted even when the lead length is changed in the same semiconductor package group. This eliminates the need for a separate socket, reducing costs and making it easier to use.

Claims (10)

A characteristic test socket of a semiconductor package for inspecting electrical characteristics by mounting a semiconductor package inside a socket composed of a cover and a body, wherein the pair of first pressurizations moved left and right by a toothed screw mounted to the center of the lower surface of the cover; A characteristic test socket of a semiconductor package comprising a member and a pair of second pressing members installed at right angles to the first pressing member and moved back and forth by an adjusting screw mounted on an outer surface of the cover. 2. The test socket for characteristics of a semiconductor package according to claim 1, wherein the first pressing member comprises a moving piece moved by a toothed screw having a toothed portion, and a pressing piece integrally formed on the moving piece. The semiconductor device characteristic test socket of claim 2, wherein a long hole is formed in the movable piece to be guided and fixed at the same time by the guide screw protruding from the lower side of the cover. The test socket of claim 1, wherein a spring is mounted between the second pressing member and the side surface of the cover to provide elasticity. A characteristic test socket of a semiconductor package for inspecting electrical characteristics by mounting a semiconductor package inside a socket composed of a cover and a body, wherein the pressure members mounted in the cover are simultaneously held by a taper screw mounted at the center of the lower side of the cover. Characteristic test socket of semiconductor package which allows elasticity to move back and forth, right and left. 6. The test socket for characteristics of a semiconductor package according to claim 5, wherein the pressing members move by a taper screw having a tapered portion, and a pressing piece formed integrally with the moving piece. The semiconductor device characteristic test socket of claim 6, wherein a long hole is formed in the movable piece to be guided and fixed at the same time by a guide screw protruding under the cover. The test socket according to any one of claims 5 to 7, wherein a spring is mounted between the pressing members and the side surface of the cover to impart elasticity. A characteristic test socket of a semiconductor package for inspecting electrical characteristics by mounting a semiconductor package inside a socket composed of a cover and a body, wherein the pressing members assembled in the cover are integrally formed and fixed to the outer surface of the cover. By screw. Characteristic test socket of semiconductor package for height adjustment freely. 10. The test socket of claim 9, wherein the pressing member is capable of pressing the shoulder portion irrespective of the lead length of the semiconductor package.