KR950005132A - Chip part position recognition device of chip mounter - Google Patents

Chip part position recognition device of chip mounter Download PDF

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Publication number
KR950005132A
KR950005132A KR1019930013993A KR930013993A KR950005132A KR 950005132 A KR950005132 A KR 950005132A KR 1019930013993 A KR1019930013993 A KR 1019930013993A KR 930013993 A KR930013993 A KR 930013993A KR 950005132 A KR950005132 A KR 950005132A
Authority
KR
South Korea
Prior art keywords
chip
mirror
chip component
suction
mounter
Prior art date
Application number
KR1019930013993A
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Korean (ko)
Other versions
KR960014482B1 (en
Inventor
백성규
Original Assignee
배순훈
대우전자 주식회사
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Application filed by 배순훈, 대우전자 주식회사 filed Critical 배순훈
Priority to KR1019930013993A priority Critical patent/KR960014482B1/en
Publication of KR950005132A publication Critical patent/KR950005132A/en
Application granted granted Critical
Publication of KR960014482B1 publication Critical patent/KR960014482B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
    • H05K13/0038—Placing of components on belts holding the terminals placing the components in a predetermined order
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

본발명은 흡착노즐로 칩을 흡착한뒤 장착위치에서 정확하게 장착하도록 위치를 조정할때 칩부품에 외력을 가하지 않고 2개의 CCD카메라를 이용하여 잘못 흡착된 칩부품의 위치를 인식 및 계산하여 이를 보정하고자 한 칩마운터의 칩부품위치인식장치에 관한 것으로, 즉, 내부 양측에 유도거울(42)과 반사거울(43)을 각각 설치한뒤 그 사이에 반투명반사거울(44)을 설치한 거울통(41)을 헤드구동부베이스(60)에 설치하며, 상기 거울통(41)의 반투명반사거울(44)과 반사거울(43)의 상부에 위치되게 고, 저배율 CCD카메라(45)(46)를 각각 설치하여 광원(50)에 의해 칩부품의 반사체를 인식하도록 구성한뒤 흡착위치부(A)와 보정위치부(B) 사이의 칩부품위치인식부(D)에 설치한 것이다.The present invention is intended to correct and correct the position of the wrongly adsorbed chip parts using two CCD cameras without applying external force to the chip parts when adjusting the position so that the chip is adsorbed with the adsorption nozzle and mounted correctly at the mounting position. It relates to a chip component position recognition device of one chip mounter, that is, a mirror barrel 41 having a guide mirror 42 and a reflection mirror 43 on both sides of the inside, and a translucent mirror 44 therebetween. ) Is installed in the head driving unit base (60), and positioned above the semi-transparent reflecting mirror (44) and the reflecting mirror (43) of the mirror barrel (41), and the low magnification CCD cameras (45) and (46), respectively, are installed. After the light source 50 is configured to recognize the reflector of the chip component, it is provided in the chip component position recognition portion D between the suction position portion A and the correction position portion B.

Description

칩마운터의 칩부품위치인식장치Chip part position recognition device of chip mounter

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제 1 도는 본발명이 설치되는 위치를 나타낸 칩마운터의 개략적인 평면도, 제 2 도 (가)(나)는 본발명이 설치된 정면도 및 측면도, 제 3 도는 본발명의 작동상태도.1 is a schematic plan view of a chip mounter showing a position where the present invention is installed, FIG. 2 (a) (b) is a front view and a side view of the present invention, and FIG. 3 is an operating state diagram of the present invention.

Claims (3)

흡착위치부(A)로 회동된 헤드(10)의 흡착노즐(11)이 칩부품(1)을 흡착하여 보정위치부(B)로 회동되게 한뒤 칩부품(1)의 위치를 보정하여 장착위치부(C)로 회동시켜서 X-Y테이블(20)에 의해 이동된 PCB기판(30)에 칩부품(1)을 장착하도록 한 칩마운터에 있어서, 내부 양측에 유도거울(42)과 반사거울(43)을 각각 설치한뒤 그 사이에 반투명반사거울(44)을 설치한 거울통(41)을 헤드구동부베이스(60)에 설치하며, 상기 거울통(41)의 반투명반사거울(44)과 반사거울(43)의 상부에 위치되게, 고, 저배율 CCD카메라(45)(46)를 각각 설치하여 광원(50)에 의해 칩부품의 반사체를 인식하도록 구성한뒤 흡착위치부(A)와 보정위치부(B) 사이의 칩부품위치인식부(D)에 설치한 것을 특징으로 하는 칩마운터의 칩부품위치인식장치.The suction nozzle 11 of the head 10 rotated to the suction position portion A causes the suction of the chip component 1 to be rotated to the correction position portion B, and then the position of the chip component 1 is corrected. In a chip mounter in which the chip component 1 is mounted on the PCB board 30 moved by the XY table 20 by rotating to the part C, the induction mirror 42 and the reflection mirror 43 on both sides of the inside. After installing each of the mirror tube 41, the translucent mirror 44 is installed between the head drive unit base 60, and the translucent mirror 44 and the reflective mirror of the mirror cylinder 41 The high and low magnification CCD cameras 45 and 46 are disposed so as to be positioned above 43, and configured to recognize the reflector of the chip component by the light source 50, and then the suction position A and correction position B A chip part position recognition device for a chip mounter, wherein the chip part position recognition unit (D) is installed between the two sides. 제 1 항에 있어서, 광원(50)에 의해 반사되는 칩부품(1)의 그림자와 후방배경을 명확하게 구분하도록 흡착노즐(11)의 상단에 반사판(12)을 설치한 것을 특징으로 하는 칩마운터의 칩부품위치인식장치.The chip mounter according to claim 1, wherein a reflector plate (12) is provided on the upper end of the suction nozzle (11) so as to clearly distinguish the shadow of the chip component (1) reflected by the light source (50) and the back background. Chip part position recognition device. 제 1 항에 있어서, 상기 헤드구동부베이스(60)에 설치된 모타베이스(61)에 펄스모타(62)를 고정설치한뒤 그 구동축(63)에 볼스크류우(64)를 연결하고, 상기 볼스크류우(64)를 거울통(41)에 고정설치된 볼스크류우너트(47)에 나사결합하고, 상기 모타베이스(61)와 거울통(41)에 LM가이드(80)를 설치하여 칩부품위치인식장치(40)를 상, 하강시켜 촛점을 조정하도록 한 것을 특징으로 하는 칩마운터의 칩부품위치인식장치.The method according to claim 1, wherein the pulse motor 62 is fixed to the motor base 61 installed on the head driving unit base 60, and then the ball screw 64 is connected to the drive shaft 63. The right 64 is screwed into the ball screw nut 47 fixed to the mirror barrel 41, and the LM guide 80 is installed in the motor base 61 and the mirror barrel 41 to recognize the chip part position. A device for recognizing the position of a chip part of a chip mounter, characterized in that the device 40 is moved up and down to adjust the focus. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930013993A 1993-07-23 1993-07-23 Mount system of chip parts KR960014482B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019930013993A KR960014482B1 (en) 1993-07-23 1993-07-23 Mount system of chip parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930013993A KR960014482B1 (en) 1993-07-23 1993-07-23 Mount system of chip parts

Publications (2)

Publication Number Publication Date
KR950005132A true KR950005132A (en) 1995-02-18
KR960014482B1 KR960014482B1 (en) 1996-10-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930013993A KR960014482B1 (en) 1993-07-23 1993-07-23 Mount system of chip parts

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101146318B1 (en) * 2006-04-06 2012-05-21 삼성테크윈 주식회사 Identification method for that chip mounter adsorbs parts

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009111642A1 (en) * 2008-03-05 2009-09-11 Contrast Optical Design & Engineering, Inc. Multiple image camera and lens system
KR101594091B1 (en) * 2010-02-22 2016-02-16 한화테크윈 주식회사 Method for checking the last mounted point at the chip mounter and apparatus thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101146318B1 (en) * 2006-04-06 2012-05-21 삼성테크윈 주식회사 Identification method for that chip mounter adsorbs parts

Also Published As

Publication number Publication date
KR960014482B1 (en) 1996-10-15

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