KR940022730A - Wafer cleaning device for wafer backside of wafer cleaning equipment - Google Patents

Wafer cleaning device for wafer backside of wafer cleaning equipment Download PDF

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Publication number
KR940022730A
KR940022730A KR1019930005009A KR930005009A KR940022730A KR 940022730 A KR940022730 A KR 940022730A KR 1019930005009 A KR1019930005009 A KR 1019930005009A KR 930005009 A KR930005009 A KR 930005009A KR 940022730 A KR940022730 A KR 940022730A
Authority
KR
South Korea
Prior art keywords
vacuum
wafer
brush
vacuum chuck
cleaning equipment
Prior art date
Application number
KR1019930005009A
Other languages
Korean (ko)
Other versions
KR960013144B1 (en
Inventor
강희순
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019930005009A priority Critical patent/KR960013144B1/en
Publication of KR940022730A publication Critical patent/KR940022730A/en
Application granted granted Critical
Publication of KR960013144B1 publication Critical patent/KR960013144B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

본 발명은 웨이퍼 세정장비의 웨이퍼 후면 이물제거장치에 관한 것으로, 웨이퍼 후면의 이물을 제거함으로써 반도체 제조공정 진행간의 제품 불량을 줄일 수 있도록 한 것인 바, 장비 본체의지지 플레이트(1) 상부에 설치되어 웨이퍼(2)를 상부에서 고정하는 진공척(21)과, 상기 진공척(21)을 구동시키는 진공 발생기(22) 및 그 진공 발생기(22)와 진공척(21)을 연결하는 진공 연결관(23)과, 상기 진공 연결관(23)에 설치되어 진공척(21)을 상, 하 또는 좌, 우로 이동시키는 진공척 이동수단(30)과, 상기 진공척(21) 하부에 설치된 다수개의 통공(41a)을 가지는 원판 형태의 브러쉬(41)을 포함하는 웨이퍼 후면 이물제거 수단(40)으로 구성되어 있다.The present invention relates to an apparatus for removing a foreign material on the back of a wafer of a wafer cleaning equipment, and to remove a foreign material on a back of a wafer, thereby reducing product defects during the progress of a semiconductor manufacturing process. And a vacuum chuck 21 for fixing the wafer 2 from the top, a vacuum generator 22 for driving the vacuum chuck 21, and a vacuum connecting tube connecting the vacuum generator 22 and the vacuum chuck 21. (23), a vacuum chuck moving means (30) installed in the vacuum connecting pipe (23) to move the vacuum chuck (21) up, down, left and right, and a plurality of vacuum chucks (21) It is comprised by the foreign material removal means 40 of the wafer back surface containing the brush 41 of disk shape which has the through-hole 41a.

Description

웨이퍼 세정장비의 웨이퍼 후면 이물제거 장치Wafer cleaning device for wafer backside of wafer cleaning equipment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 내지 제4도는 본 발명 웨이퍼 세정장비의 웨이퍼 후면 이물제거 장치를 설명하기 위한 도면으로서, 제2도는 본 발명 웨이퍼 후면 이물제거 장치의 구조도이고,2 to 4 are views for explaining a wafer back side foreign matter removal apparatus of the wafer cleaning apparatus of the present invention, Figure 2 is a structural diagram of the wafer back side foreign matter removal apparatus of the present invention,

제3도의 (가),(나)는 본 발명 웨이퍼척의 구조를 보인 단면도 및 (가)의 저면도이며, 제4도는 본 발명 브러쉬 및 브러쉬 조립상태를 보인 분해 사시도이다.(A) and (b) of FIG. 3 are sectional views showing the structure of the wafer chuck of the present invention, and a bottom view of (a), and FIG. 4 is an exploded perspective view showing the brush and brush assembly of the present invention.

Claims (6)

장비 본체의지지 플레이트(1) 상부에 설치되어 웨이퍼(2)를 상부에서 고정하는 진공척(21)과, 상기 진공척(21)을 구동시키는 진공 발생기(22) 및 그 진공 발생기(22)와 진공척(21)을 연결하는 진공 연결관(23)과, 상기 진공 연결관(23)에 설치되어 진공척(21)을 상, 하 또는 좌, 우로 이동시키는 진공척 이동수단(30)과, 상기 진공척(21) 하부에 설치된 다수개의 통공(41a)을 가지는 원판 형태의 브러쉬(41)를 포함하는 웨이퍼 후면 이물제거 수단(40)으로 구성함을 특징으로 하는 웨이퍼 세정장비의 웨이퍼 후면 이물제거 장치.A vacuum chuck 21 installed above the support plate 1 of the main body of the equipment to fix the wafer 2 thereon; a vacuum generator 22 for driving the vacuum chuck 21; and a vacuum generator 22 thereof; A vacuum connecting pipe 23 connecting the vacuum chuck 21, a vacuum chuck moving means 30 installed at the vacuum connecting pipe 23 to move the vacuum chuck 21 up, down, left, or right; Removing foreign material on the wafer back side of the wafer cleaning equipment, characterized in that it comprises a wafer back foreign matter removal means 40 including a disc-shaped brush 41 having a plurality of holes 41a installed under the vacuum chuck 21. Device. 제1항에 있어서, 상기 진공척(21)은 속이 비고 가장자리에 진공 통로(21a)가 형성된 원뿔형 몸체(21b)의 하면에 원주상으로 다수개의 진공홀(21c)이 형성되고 가장자리에는 충격 완화용 고무패킹(21d)이 부착되어 구성되는 웨이퍼 세정장비의 웨이퍼 후면 이물제거 장치.The vacuum chuck 21 is hollow and a plurality of vacuum holes 21c are formed circumferentially on the lower surface of the conical body 21b having the vacuum passage 21a formed at the edge thereof, and at the edge thereof, the vacuum chuck 21 is formed. Wafer rear debris removal device of the wafer cleaning equipment that is attached to the rubber packing (21d). 제1항에 있어서, 상기 진공척 이동수단(30)은 진공 연결관(23)에 개재되어 진공 연결관(23)이 임의의 방향으로 유동되게 하는 플렉시블 호스(31)와, 상기 진공 연결관(23)을 지지함과 아울러 상, 하 또는 좌, 우로 이동시키는 지지 로드(32a)가 구비된 상,하 이동용 에어실린더(32) 및 좌, 우 이동용 에어실린더(32')와, 상기 에어실린더(32),(32')의 내부에 장착되어 진공척(21)의 이동량을 감지하는 포토센서(33)와, 에어실린더 구동용 전자밸브(34)로 구성된 것을 특징으로 하는 웨이퍼 세정장비의 웨이퍼 후면 이물제거 장치.According to claim 1, The vacuum chuck movement means 30 is interposed in the vacuum connection pipe 23, the flexible hose 31 for allowing the vacuum connection pipe 23 to flow in any direction, and the vacuum connection pipe ( 23, the up and down movement air cylinder 32 and the left and right movement air cylinder 32 'and the air cylinder (32') provided with a support rod 32a for moving up, down or left and right, 32) Wafer rear surface of the wafer cleaning equipment, characterized in that the photo sensor 33 is mounted inside the 32, 32 'and detects the movement amount of the vacuum chuck 21, and the solenoid valve 34 for driving the air cylinder. Foreign body removal device. 제1항에 있어서, 상기 웨이퍼 후면 이물제거 수단(40)이 브러쉬(41)와, 그 브러쉬(41)를 회전 구동시키는 모터(42)와, 상기 모터(42)의 중심부를 관통하여 브러쉬(41)에 연결된 세정액 분사관(43) 및 이 분사관(43)의 단부가 삽입된 세정액 용기(44)와 세정액 가압용 질소공급라인(45)을 구비한 세정액 공급부로 구성된 것을 특징으로 하는 웨이퍼 세정장비의 웨이퍼 후면 이물제거 장치.2. The brush 41 according to claim 1, wherein the wafer back surface foreign matter removing means 40 passes through the brush 41, the motor 42 for driving the brush 41 to rotate, and the central portion of the motor 42. Wafer cleaning equipment comprising a cleaning liquid injection pipe (43) connected to the cleaning liquid supply pipe having a cleaning liquid container (44) and a cleaning liquid container (44) into which the end of the injection pipe (43) is inserted and the cleaning liquid pressurizing nitrogen supply line (45). Wafer rear debris removal device. 제1항에 있어서, 상기 웨이퍼 후면 이물제거 수단(40)이 브러쉬(41)와, 그 브러쉬(41)를 회전 구동시키는 모터(42)와, 상기 모터(42)의 중심부를 관통하여 브러쉬(41)에 연결된 진공관(48) 및 그 단부에 연결된 진공 발생기(49)로 구성된 것을 특징으로 하는 웨이퍼 세정장비의 웨이퍼 후면 이물제거 장치.2. The brush 41 according to claim 1, wherein the wafer back surface foreign matter removing means 40 passes through the brush 41, the motor 42 for driving the brush 41 to rotate, and the central portion of the motor 42. And a vacuum tube (48) connected to the vacuum generator and a vacuum generator (49) connected to an end thereof. 제4항 또는 제5항에 있어서, 상기 브러쉬(41)는 브러쉬 고정핀(46)에 의해 모터축(42a)에 고정되고, 그 하부에는 기밀 유지용 진공실(47)이 개재됨을 특징으로 하는 웨이퍼 세정장비의 웨이퍼 후면 이물제거 장치.The wafer (4) according to claim 4 or 5, wherein the brush (41) is fixed to the motor shaft (42a) by a brush fixing pin (46), and a lower portion of the wafer is characterized in that an airtight vacuum chamber (47) is interposed. Debris removal device on the back side of the cleaning equipment. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019930005009A 1993-03-29 1993-03-29 Particle removing apparatus of wafer rearface KR960013144B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019930005009A KR960013144B1 (en) 1993-03-29 1993-03-29 Particle removing apparatus of wafer rearface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019930005009A KR960013144B1 (en) 1993-03-29 1993-03-29 Particle removing apparatus of wafer rearface

Publications (2)

Publication Number Publication Date
KR940022730A true KR940022730A (en) 1994-10-21
KR960013144B1 KR960013144B1 (en) 1996-09-30

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100417648B1 (en) * 1996-12-28 2004-04-06 주식회사 하이닉스반도체 Wafer cleaning method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100417648B1 (en) * 1996-12-28 2004-04-06 주식회사 하이닉스반도체 Wafer cleaning method

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Publication number Publication date
KR960013144B1 (en) 1996-09-30

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