KR940019076U - Wrench's Socket - Google Patents

Wrench's Socket

Info

Publication number
KR940019076U
KR940019076U KR2019930000349U KR930000349U KR940019076U KR 940019076 U KR940019076 U KR 940019076U KR 2019930000349 U KR2019930000349 U KR 2019930000349U KR 930000349 U KR930000349 U KR 930000349U KR 940019076 U KR940019076 U KR 940019076U
Authority
KR
South Korea
Prior art keywords
wrench
socket
Prior art date
Application number
KR2019930000349U
Other languages
Korean (ko)
Inventor
김광무
Original Assignee
김광무
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광무 filed Critical 김광무
Priority to KR2019930000349U priority Critical patent/KR940019076U/en
Priority to MYPI93001401A priority patent/MY108999A/en
Priority to US08/092,526 priority patent/US5386749A/en
Priority to AU42009/93A priority patent/AU4200993A/en
Priority to CA002100824A priority patent/CA2100824A1/en
Priority to EP93112178A priority patent/EP0606523A1/en
Priority to BR7301716U priority patent/BR7301716U/en
Priority to JP5264709A priority patent/JP2872548B2/en
Publication of KR940019076U publication Critical patent/KR940019076U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B13/00—Spanners; Wrenches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01072—Hafnium [Hf]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR2019930000349U 1993-01-12 1993-01-12 Wrench's Socket KR940019076U (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR2019930000349U KR940019076U (en) 1993-01-12 1993-01-12 Wrench's Socket
MYPI93001401A MY108999A (en) 1993-01-12 1993-07-16 Socket for wrench
US08/092,526 US5386749A (en) 1993-01-12 1993-07-16 Socket for wrench
AU42009/93A AU4200993A (en) 1993-01-12 1993-07-19 Socket for wrench
CA002100824A CA2100824A1 (en) 1993-01-12 1993-07-19 Socket for wrench
EP93112178A EP0606523A1 (en) 1993-01-12 1993-07-29 Socket for wrench
BR7301716U BR7301716U (en) 1993-01-12 1993-09-10 Arrangement inserted in socket for wrench
JP5264709A JP2872548B2 (en) 1993-01-12 1993-10-22 Method for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930000349U KR940019076U (en) 1993-01-12 1993-01-12 Wrench's Socket

Publications (1)

Publication Number Publication Date
KR940019076U true KR940019076U (en) 1994-08-16

Family

ID=19349591

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930000349U KR940019076U (en) 1993-01-12 1993-01-12 Wrench's Socket

Country Status (2)

Country Link
JP (1) JP2872548B2 (en)
KR (1) KR940019076U (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6881611B1 (en) 1996-07-12 2005-04-19 Fujitsu Limited Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
EP0922300B1 (en) * 1996-08-27 2007-11-28 Nippon Steel Corporation Process for producing semiconductor device provided with low melting point metal bumps
JP4058198B2 (en) 1999-07-02 2008-03-05 富士通株式会社 Manufacturing method of semiconductor device
US11393698B2 (en) 2020-12-18 2022-07-19 STATS ChipPAC Pte. Ltd. Mask design for improved attach position

Also Published As

Publication number Publication date
JPH06236887A (en) 1994-08-23
JP2872548B2 (en) 1999-03-17

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Legal Events

Date Code Title Description
A201 Request for examination
N231 Notification of change of applicant
E902 Notification of reason for refusal
E601 Decision to refuse application