KR940013660U - Die Bonder Chip Mounting Sensing Device - Google Patents

Die Bonder Chip Mounting Sensing Device

Info

Publication number
KR940013660U
KR940013660U KR2019920022825U KR920022825U KR940013660U KR 940013660 U KR940013660 U KR 940013660U KR 2019920022825 U KR2019920022825 U KR 2019920022825U KR 920022825 U KR920022825 U KR 920022825U KR 940013660 U KR940013660 U KR 940013660U
Authority
KR
South Korea
Prior art keywords
sensing device
chip mounting
die bonder
mounting sensing
bonder chip
Prior art date
Application number
KR2019920022825U
Other languages
Korean (ko)
Other versions
KR960002548Y1 (en
Inventor
이창배
Original Assignee
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업 주식회사 filed Critical 삼성항공산업 주식회사
Priority to KR92022825U priority Critical patent/KR960002548Y1/en
Publication of KR940013660U publication Critical patent/KR940013660U/en
Application granted granted Critical
Publication of KR960002548Y1 publication Critical patent/KR960002548Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
KR92022825U 1992-11-19 1992-11-19 Chip attachment sensing apparatus of die-bonder KR960002548Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92022825U KR960002548Y1 (en) 1992-11-19 1992-11-19 Chip attachment sensing apparatus of die-bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92022825U KR960002548Y1 (en) 1992-11-19 1992-11-19 Chip attachment sensing apparatus of die-bonder

Publications (2)

Publication Number Publication Date
KR940013660U true KR940013660U (en) 1994-06-25
KR960002548Y1 KR960002548Y1 (en) 1996-03-27

Family

ID=19344293

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92022825U KR960002548Y1 (en) 1992-11-19 1992-11-19 Chip attachment sensing apparatus of die-bonder

Country Status (1)

Country Link
KR (1) KR960002548Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210000043A (en) * 2019-06-24 2021-01-04 삼성전자주식회사 Collet apparatus and method for fabricating semiconductor device using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210000043A (en) * 2019-06-24 2021-01-04 삼성전자주식회사 Collet apparatus and method for fabricating semiconductor device using the same

Also Published As

Publication number Publication date
KR960002548Y1 (en) 1996-03-27

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Legal Events

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