KR940010260A - Solder Jig of Semiconductor Device - Google Patents

Solder Jig of Semiconductor Device Download PDF

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Publication number
KR940010260A
KR940010260A KR1019920018550A KR920018550A KR940010260A KR 940010260 A KR940010260 A KR 940010260A KR 1019920018550 A KR1019920018550 A KR 1019920018550A KR 920018550 A KR920018550 A KR 920018550A KR 940010260 A KR940010260 A KR 940010260A
Authority
KR
South Korea
Prior art keywords
semiconductor device
stopper
solder jig
jig
solder
Prior art date
Application number
KR1019920018550A
Other languages
Korean (ko)
Other versions
KR960004102B1 (en
Inventor
김국광
임치선
이점옥
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019920018550A priority Critical patent/KR960004102B1/en
Publication of KR940010260A publication Critical patent/KR940010260A/en
Application granted granted Critical
Publication of KR960004102B1 publication Critical patent/KR960004102B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

이 발명은 반도체 소자의 솔더지그에 관한 것으로 반도체 소자를 용융 납땜할 때 반도체 소자의 리드부위에만 납땜이 되게 하고 반도체 소자의 양측에 형성된 타이바에 납땜이 되는 것을 방지하기 위하여 종래에 일자형으로된 솔더지그의 스토퍼의 구조를 개선시켜 반도체 소자와 스토퍼의 접촉 부위를 서로 접촉되지 않도록 곡면을 이루며 단면이 삼각형태인 솔더지그의 스토퍼를 형성하였다. 따라서 이 발명에 의하면 반도체 소자가 스토퍼의 하부에 접촉되고 반도체 소자의 중앙 부위에 형성된 타이바와 솔더지그 스토퍼의 곡면은 소정거리만큼 이격됨으로써 납땜 공정시 발생되는 불량을 방지할 수 있게 됨으로 반도체 소자의 품질을 향상시킬 수 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder jig of a semiconductor device. When soldering a semiconductor device, the solder jig has a flat shape in order to be soldered only to lead portions of the semiconductor device and to prevent soldering to tie bars formed on both sides of the semiconductor device. The stopper of the solder jig having a triangular cross section was formed to form a curved surface so that the contact portion of the semiconductor device and the stopper did not contact each other by improving the structure of the stopper. Therefore, according to the present invention, the semiconductor device is in contact with the bottom of the stopper, and the curved surface of the tie bar and the solder jig stopper formed at the center portion of the semiconductor device is separated by a predetermined distance to prevent defects generated during the soldering process. Can improve.

Description

반도체 소자의 솔더지그Solder Jig of Semiconductor Device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 이 발명에 따른 반도체 소자의 솥더 지그의 일 실시예를 나타내는 측면도,3 is a side view showing an embodiment of a cooker jig of a semiconductor device according to the present invention,

제4도는 제3도의 요부 확대도.4 is an enlarged view illustrating main parts of FIG. 3.

Claims (3)

반도체 소자의 납땜용 솔더지그에 있어서, 복수개의 반도체 소자가 탑재되는 솔더지그와, 반도체 소자의 양측에 형성되어 있는 타이바에 납땜이 되지 않게 하기 위하여 그 솔더지그의 일측 끝단에 단면이 삼각형태인 스토퍼가 부착되어 있는 것을 특징으로 하는 반도체 소자의 솔더지그.In the solder jig for soldering a semiconductor element, a stopper having a triangular cross section at one end of the solder jig in order to prevent soldering on a solder jig on which a plurality of semiconductor elements are mounted, and tie bars formed on both sides of the semiconductor element. A solder jig of a semiconductor device, characterized in that attached. 제1항에 있어서, 상기 스토퍼는 타이바와 만나는 부위에 곡면이 형성된 반도체 소자의 솔더지그.The solder jig of claim 1, wherein the stopper has a curved surface formed at a portion where the stopper meets the tie bar. 제2항에 있어서, 상기 곡면이 형성된 스토퍼는 반도체 소자의 중앙에 형성된 타이바와 소정거리 이격된 반도체 소자의 솔더지그.The solder jig of claim 2, wherein the stopper having the curved surface is spaced apart from the tie bar formed at the center of the semiconductor device by a predetermined distance. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920018550A 1992-10-09 1992-10-09 Solder jig of semiconductor element KR960004102B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019920018550A KR960004102B1 (en) 1992-10-09 1992-10-09 Solder jig of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920018550A KR960004102B1 (en) 1992-10-09 1992-10-09 Solder jig of semiconductor element

Publications (2)

Publication Number Publication Date
KR940010260A true KR940010260A (en) 1994-05-24
KR960004102B1 KR960004102B1 (en) 1996-03-26

Family

ID=19340879

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920018550A KR960004102B1 (en) 1992-10-09 1992-10-09 Solder jig of semiconductor element

Country Status (1)

Country Link
KR (1) KR960004102B1 (en)

Also Published As

Publication number Publication date
KR960004102B1 (en) 1996-03-26

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