KR940008293Y1 - Damp pack bag of semiconductor package - Google Patents
Damp pack bag of semiconductor package Download PDFInfo
- Publication number
- KR940008293Y1 KR940008293Y1 KR92000775U KR920000775U KR940008293Y1 KR 940008293 Y1 KR940008293 Y1 KR 940008293Y1 KR 92000775 U KR92000775 U KR 92000775U KR 920000775 U KR920000775 U KR 920000775U KR 940008293 Y1 KR940008293 Y1 KR 940008293Y1
- Authority
- KR
- South Korea
- Prior art keywords
- moisture
- packaging bag
- proof packaging
- semiconductor package
- absorbing member
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/03—Wrappers or envelopes with shock-absorbing properties, e.g. bubble films
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
Abstract
내용 없음.No content.
Description
제1도는 종래의 포장용 트레이에 반도체 패키지가 탑재된 상태를 나타낸 일부 단면도.1 is a partial cross-sectional view showing a state in which a semiconductor package is mounted on a conventional packaging tray.
제2도의 (a)는 종래의 트레이들을 적층하여 포장된 상태를 나타낸 단면도, (b)는 포장백의 단면구조도.Figure 2 (a) is a cross-sectional view showing a state of packing the conventional trays stacked, (b) is a cross-sectional structure of the packaging bag.
제3도의 (a)는 이 고안에 따른 방습포장백을 설명하기 위한 단면도, (b)는 (a)의 "A"부 상세도.(A) of FIG. 3 is sectional drawing for demonstrating the moisture proof packaging bag which concerns on this invention, (b) is the detail of the "A" part of (a).
제4도의 (a)는 이 고안에 따른 방습포장백의 단면구조도, (b)는 방습포장백에 사용되는 충격흡수부재의 단면구조도이다.Figure 4 (a) is a cross-sectional structure diagram of the moisture-proof packaging bag according to the present invention, (b) is a cross-sectional structure diagram of the shock absorbing member used in the moisture-proof packaging bag.
이 고안은 각 제작공정이 완료된 반도체 패키지들을 트레이(Tray)에 일정배열로 탑재시킨 후 포장하여 출하할 수 있도록 된 반도체 패키지의 방습포장백에 관한 것이다.The present invention relates to a moisture-proof packaging bag of a semiconductor package that can be shipped after the semiconductor packages each manufacturing process is mounted in a tray in a predetermined arrangement.
일반적으로, 제1도에 나타낸 바와같이 각 제작공정이 완료된 반도체 패키지(11)는 트레이(10)의 평면부(10a)상에 일정간격으로 배열되는 안착홈(10b)내에 탑재시킨후, 이 트레이(10)들을 필요로하는 수량만큼 적층하여 제2의 (a)에서와 같이 외부로부터 습기가 스머드는 것을 방지하기 위하여 방습포장백(20)내에 넣어 출하시킬 수 있게된다.In general, as shown in FIG. 1, the semiconductor package 11 in which each fabrication process is completed is mounted in a seating groove 10b arranged at a predetermined interval on the flat portion 10a of the tray 10, and then the tray. The number of layers (10) can be stacked and shipped in the moisture-proof packaging bag 20 to prevent moisture from smudging from the outside as in the second (a).
이와같은 방습포장백(20)은 각 제조업체마다 약간의 차이는 있으나 통상적으로는 제2도의 (b)에서와 같이 바깥표면과 내측면에 형성되는 정전기 방지재(20a),(20c)의 사이에 알루미늄층(20b)이 형성되고, 상기 정전기 방지재(20c)의 내측에는 시일재(20d)가 형성되며, 이들 각각은 접착제를 이용하여 적층되도록 제조된다.Such a moisture-proof packaging bag 20 is slightly different for each manufacturer, but usually between the antistatic material 20a, 20c formed on the outer surface and the inner surface as shown in (b) of FIG. An aluminum layer 20b is formed, and a sealing material 20d is formed inside the antistatic material 20c, each of which is manufactured to be laminated using an adhesive.
따라서, 상기한 바와같이 제조된 방습포장백(20)에 적층된 트레이(10)들을 끼워넣은후 시일링부(20e)에 일정한 열을 가해줌으로써 트레이(10)들을 포장할 수 있게된다.Therefore, the trays 10 may be packed by inserting the stacked trays 10 in the moisture-proof packaging bag 20 manufactured as described above and applying a predetermined heat to the sealing portion 20e.
그러나, 상기와 같은 방습포장백(20)은 운반도중에 취급부주의나 또는 외부충격으로 인하여 쉽게 손상을 입게되므로 충분한 방습효과를 얻기가 곤란한 문제점이 있었다.However, the moisture-proof packaging bag 20 as described above has a problem that it is difficult to obtain a sufficient moisture-proof effect because it is easily damaged due to careless handling or external shock during transportation.
이 고안은 상기와 바와같은 종래의 문제점을 해결하기 위한 것으로서, 이 고안의 목적은 방습포장백의 내부에 충격흡수부재를 부착하여 외부로부터의 충격을 흡수할 수 있도록 한 반도체 패키지의 방습포장백을 제공함에 있다.This invention is to solve the conventional problems as described above, the object of this invention is to provide a moisture-proof packaging bag of a semiconductor package to attach a shock absorbing member to the inside of the moisture-proof packaging bag to absorb shock from the outside. Is in.
상기와 같은 목적을 달성하기 위한 이 고안의 특징은, 각 제작공정이 완료된 반도체 패키지가 탑재되는 트레이를 포장할 수 있도록 된 방습포장백에 있어서, 방습포장백의 내면에 충격흡수부재를 부착하여 외부의 충격을 흡수할 수 있도록 한 것에 있다.A feature of this invention for achieving the above object is, in the moisture-proof packaging bag to be able to package the tray on which the semiconductor package is completed each manufacturing process, by attaching a shock absorbing member to the inner surface of the moisture-proof packaging bag It's designed to absorb shocks.
이하, 이 고안의 실시예를 첨부도면에 따라 상세히 설명한다.Hereinafter, embodiments of this invention will be described in detail with reference to the accompanying drawings.
제3도 및 제4도의 (a), (b)는 이 고안에 따른 반도체 패키지의 방습포장백을 설명하기 위한 도면으로서, 제3도의 (a), (b)에서와 같이 이 고안에 따른 방습포장백(30)은 종래와 마찬가지로 각 반도체 패키지가 탑재되어 필요수량만큼 적층된 트레이(10)들을 상기 방습포장백(30)내에 넣고 시일링부(30e)에 일정한 열을 가하여 밀봉시킴으로써, 외부로부터 습기가 스며드는 것을 방지할 수 있게된다.(A) and (b) of FIG. 3 and FIG. 4 are diagrams for explaining the moisture-proof packaging bag of the semiconductor package according to the present invention. As shown in (a) and (b) of FIG. The packaging bag 30 is placed in the moisture-proof packaging bag 30 and the sealing tray 30e by applying a predetermined heat to each of the semiconductor package is mounted and stacked as required amount of the semiconductor package 30 as in the conventional, moisture from the outside It is possible to prevent the infiltration.
이때, 상기 방습포장백(30)의 내면에는 충격흡수부재(40)가 부착되어 제품포장후 이동이나 운반시에 외부로부터의 충격을 흡수하여 제품을 보호할 수 있게된다.At this time, the shock-absorbing member 40 is attached to the inner surface of the moisture-proof packaging bag 30 to protect the product by absorbing the impact from the outside during movement or transport after packaging the product.
여기에서, 상기 방습포장백(30)은 제4도의 (a), (b)에 나타낸 바와같이 종래와 마찬가지로 바깥표면과 내측면에 형성된 정전기 방지재(30a), (30c)의 사이에 알루미늄층(30b)이 형성되고, 상기 정전기 방지재(30c)상에는 시일재(30d)가 형성된다.Here, the moisture-proof packaging bag 30 is an aluminum layer between the antistatic materials 30a, 30c formed on the outer surface and the inner surface as in the prior art as shown in (a) and (b) of FIG. 30b is formed, and a sealing material 30d is formed on the antistatic material 30c.
그리고, 상기 시일재(30d)상에 총격흡수부재(40)가 부착되는데, 이 충격흡수부재(40)의 외측면에는 전체면에 걸쳐 정전기 방지재(40a)가 코팅되어 있으며, 그 일측에 접착층(40b)이 형성되어 있다.In addition, a shooting absorbing member 40 is attached on the seal member 30d, and an outer surface of the shock absorbing member 40 is coated with an antistatic material 40a over its entire surface, and an adhesive layer on one side thereof. 40b is formed.
따라서, 상기와 같은 충격흡수부재(40)를 방습포장백(30)내면의 시일재(30d)상에 부착한 후 그 내측으로 트레이(10)들을 넣어 포장함으로써, 외부충격으로부터 제품을 보호할 수 있게되며, 상기 충격흡수부재(40)는 방습포장백(30)의 외측면에 부착시킬수도 있다.Therefore, by attaching the shock absorbing member 40 as described above on the sealing material 30d on the inner surface of the moisture-proof packaging bag 30 and putting the trays 10 inside thereof, the product can be protected from external shock. And, the shock absorbing member 40 may be attached to the outer surface of the moisture-proof packaging bag (30).
이상에서와 같이 이 고안에 따른 반도체 패키지의 방습포장백에 의하면, 트레이들을 넣어 포장할 수 있도록 함으로써, 외부환경으로부터 습기가 스며드는 것을 방지할 수 있음은 물론 이동이나 운반시에 발생할 수 있는 외부충격을 흡수하여 제품을 보호할 수 있는 것이다.As described above, according to the moisture-proof packaging bag of the semiconductor package according to the present invention, by packaging the trays, it is possible to prevent moisture from permeating from the external environment, as well as to prevent external shocks that may occur during transportation or transportation. It can be absorbed to protect the product.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92000775U KR940008293Y1 (en) | 1992-01-20 | 1992-01-20 | Damp pack bag of semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92000775U KR940008293Y1 (en) | 1992-01-20 | 1992-01-20 | Damp pack bag of semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930018790U KR930018790U (en) | 1993-08-21 |
| KR940008293Y1 true KR940008293Y1 (en) | 1994-12-08 |
Family
ID=19328132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR92000775U KR940008293Y1 (en) | 1992-01-20 | 1992-01-20 | Damp pack bag of semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR940008293Y1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100618178B1 (en) * | 2004-08-25 | 2006-08-29 | 주식회사 우성팩 | Packing film manufacturing method for electronic parts protection and Packing film manufactured thereby |
-
1992
- 1992-01-20 KR KR92000775U patent/KR940008293Y1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100618178B1 (en) * | 2004-08-25 | 2006-08-29 | 주식회사 우성팩 | Packing film manufacturing method for electronic parts protection and Packing film manufactured thereby |
Also Published As
| Publication number | Publication date |
|---|---|
| KR930018790U (en) | 1993-08-21 |
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