KR940002878A - 적층형 세라믹 커패시터의 제조방법 - Google Patents

적층형 세라믹 커패시터의 제조방법 Download PDF

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KR940002878A
KR940002878A KR1019920013705A KR920013705A KR940002878A KR 940002878 A KR940002878 A KR 940002878A KR 1019920013705 A KR1019920013705 A KR 1019920013705A KR 920013705 A KR920013705 A KR 920013705A KR 940002878 A KR940002878 A KR 940002878A
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South Korea
Prior art keywords
multilayer ceramic
ceramic capacitor
manufacturing
mlcc
product
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KR1019920013705A
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English (en)
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KR100237294B1 (ko
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정승교
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황선두
삼성전기주식회사
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Priority to KR1019920013705A priority Critical patent/KR100237294B1/ko
Publication of KR940002878A publication Critical patent/KR940002878A/ko
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Publication of KR100237294B1 publication Critical patent/KR100237294B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

본 발명은 적층형 세라믹 커패시터(Multi-layer Ceramic Capacitor, MLCC)의 제조방법에 관한 것으로, 좀 더 구체적으로는 상기 MLCC의 최상부 및 최하부층을 제외한 내부층은 일반적인 {Pb(Mg1/3Nb2/3)O3}x-{Pb(Zn1/3Nb2/3)O3}y-{BaTiO3}z의 조성물로 구성하고 (상기 조성식에서 0.625≤x≤0.875, 0≤y≤0.375, 0≤z≤0.04) 최상부 및 최하부층은 상기 조성물에 대하여 2~6wt%의 Pb0를 첨가한 물질로 구성하여 적층형 세라믹 커패시터를 제조하는 방법에 관한 것이다.
본 발명에 의핸 만들어진 제품은 1100℃이하의 저온에서 소결할 수 있기 때문에 적층형 세라믹 커패시터로 사용할 경우 내부전극의 가격을 크게 낮출수 있고 유전율이 12,000이상이고 유전손실이 낮을 뿐 아니라 치밀한 구조를 갖기 때문에 높은 신뢰성을 얻게 된다. 또한 소결과정에서 생기는 Pb0의 휘발에 의한 제품의 휨이나 제품내의 특성불균질을 억제하는 효과가 크기 때문에 수율 및 특성의 안정화에 크게 기여할 것이다. 또한 Pb0 분압조절을 위한 분위기 분말 및 밀폐소결의 필요성이 없어짐으로 작업공수를 줄여 생산성을 향상시키는 장점이 있다.

Description

적층형 세라믹 커패시터의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 종래 기술에 의한 적층형 세라믹 커패시터의 단면도이고,
제2도는 본 발명의 방법에 의한 적층형 세라믹 커패시터의 단면도이다.
* 도면의 주요부분에 대한 부호의 설명
1 : 종래의 자기조성 유전체 2 : 내부전극
3 : Pb0가 함유된 자기조성 유전체 4 : 외부전극

Claims (1)

  1. 적층형 세라믹 커패시터(MLCC)를 제조하는데 있어서, 상기 MLCC의 최상부 및 최하부층을 제외한 내부층은 일반적인 {Pb(Mg1/3Nb2/3)O3}x-{Pb(Zn1/3Nb2/3)O3}y-{BaTiO3}z의 조성물로 구성하고 (상기 조성식에서 0.625≤x≤0.875, 0≤y≤0.375, 0≤z≤0.04) 최상부 및 최하부층은 상기 조성물에 대하여 2~6wt%의 Pb0를 첨가한 물질로 구성하는 것을 특징으로 하는 적층형 세라믹 커패시터의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920013705A 1992-07-30 1992-07-30 적층형 세라믹 커패시터의 제조방법 KR100237294B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019920013705A KR100237294B1 (ko) 1992-07-30 1992-07-30 적층형 세라믹 커패시터의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920013705A KR100237294B1 (ko) 1992-07-30 1992-07-30 적층형 세라믹 커패시터의 제조방법

Publications (2)

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KR940002878A true KR940002878A (ko) 1994-02-19
KR100237294B1 KR100237294B1 (ko) 2000-01-15

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KR1019920013705A KR100237294B1 (ko) 1992-07-30 1992-07-30 적층형 세라믹 커패시터의 제조방법

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KR (1) KR100237294B1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10403436B2 (en) 2016-12-19 2019-09-03 Samsung Electro-Mechanics Co., Ltd. Acrylic binder and multilayer electronic component using the same
US10892092B2 (en) 2016-11-21 2021-01-12 Samsung Electro-Mechanics Co., Ltd. Conductive powder for inner electrode and capacitor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10910551B2 (en) 2017-11-06 2021-02-02 Samsung Electronics Co., Ltd. Piezoelectric material, piezoelectric device including the piezoelectric material, and method of manufacturing the piezoelectric material

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10892092B2 (en) 2016-11-21 2021-01-12 Samsung Electro-Mechanics Co., Ltd. Conductive powder for inner electrode and capacitor
US10403436B2 (en) 2016-12-19 2019-09-03 Samsung Electro-Mechanics Co., Ltd. Acrylic binder and multilayer electronic component using the same
US10763044B2 (en) 2016-12-19 2020-09-01 Samsung Electro-Mechanics Co., Ltd. Acrylic binder and multilayer electronic component using the same
US11004611B2 (en) 2016-12-19 2021-05-11 Samsung Electro-Mechanics Co., Ltd. Acrylic binder and multilayer electronic component using the same

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