KR930700695A - Metallization - Google Patents
MetallizationInfo
- Publication number
- KR930700695A KR930700695A KR1019920703166A KR920703166A KR930700695A KR 930700695 A KR930700695 A KR 930700695A KR 1019920703166 A KR1019920703166 A KR 1019920703166A KR 920703166 A KR920703166 A KR 920703166A KR 930700695 A KR930700695 A KR 930700695A
- Authority
- KR
- South Korea
- Prior art keywords
- target
- machine
- curved
- magnet
- constitutes
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
내용 없음.No content.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1도는 스퍼터링 장치가 끼워맞춰진 웨브감는 기계의 개략적 횡단면도,1 is a schematic cross-sectional view of a web winding machine fitted with a sputtering device,
제2도는 제1도의 스퍼터링 장치의 일부를 형성하는 표적의 개략적 사시도,FIG. 2 is a schematic perspective view of a target forming part of the sputtering apparatus of FIG.
제3도는 제1도의 스퍼터링 장치의 일부를 형성하는 자석의 부분적인 개략적 횡단면도,3 is a partial schematic cross-sectional view of a magnet forming part of the sputtering apparatus of FIG.
제4도는 제1도의 만곡된 회전표면과 스퍼터링 장치의 부분적인 개략적 횡단면도.4 is a partial schematic cross-sectional view of the curved rotating surface and sputtering apparatus of FIG.
Claims (11)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9013498.2 | 1990-06-16 | ||
GB909013498A GB9013498D0 (en) | 1990-06-16 | 1990-06-16 | Metallizing apparatus |
GB9018624.8 | 1990-08-24 | ||
GB909018624A GB9018624D0 (en) | 1990-08-24 | 1990-08-24 | Mettalizing apparatus |
PCT/GB1991/000955 WO1991020091A1 (en) | 1990-06-16 | 1991-06-13 | Metallizing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
KR930700695A true KR930700695A (en) | 1993-03-15 |
Family
ID=26297212
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920703166A KR930700695A (en) | 1990-06-16 | 1991-06-13 | Metallization |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0535054A1 (en) |
JP (1) | JPH05507765A (en) |
KR (1) | KR930700695A (en) |
WO (1) | WO1991020091A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0805880A4 (en) * | 1995-01-12 | 1998-05-06 | Boc Group Inc | Rotatable magnetron with curved or segmented end magnets |
GB2318127B (en) * | 1996-10-10 | 2001-03-07 | Gen Vacuum Equipment Ltd | A vacuum process and apparatus for depositing lithium/lithium nitride coating on flexiible moving web |
US6093290A (en) * | 1997-05-14 | 2000-07-25 | Canon Kabushiki Kaisha | Method of generating a reciprocating plurality of magnetic fluxes on a target |
US20030183518A1 (en) * | 2002-03-27 | 2003-10-02 | Glocker David A. | Concave sputtering apparatus |
JP4796549B2 (en) * | 2007-07-27 | 2011-10-19 | 株式会社アルバック | Film forming apparatus and film forming method |
CN101805889B (en) | 2009-02-13 | 2012-01-11 | 北京京东方光电科技有限公司 | Magnetic target and magnetron sputtering device having same |
KR101794586B1 (en) * | 2011-05-23 | 2017-11-08 | 삼성디스플레이 주식회사 | Separated target apparatus for sputtering and sputtering method using the same |
JP5915580B2 (en) * | 2013-03-29 | 2016-05-11 | 住友金属鉱山株式会社 | Magnetron sputtering cathode, sputtering apparatus provided with the same, and sputtering film forming method using the sputtering apparatus |
CN103334086B (en) * | 2013-07-01 | 2016-05-25 | 南昌欧菲光科技有限公司 | Plated film chamber dividing plate |
CN107406972A (en) * | 2015-03-02 | 2017-11-28 | 东曹Smd有限公司 | Sputtering target with back-flexing target geometry |
CN107815637B (en) * | 2017-10-31 | 2019-07-16 | 中国工程物理研究院材料研究所 | A kind of semiclosed curved-surface piece inner surface coating of axial symmetry uniformly enhances the method and its application of combination |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3829373A (en) * | 1973-01-12 | 1974-08-13 | Coulter Information Systems | Thin film deposition apparatus using segmented target means |
JPS51117933A (en) * | 1975-04-10 | 1976-10-16 | Tokuda Seisakusho | Spattering apparatus |
US4865710A (en) * | 1988-03-31 | 1989-09-12 | Wisconsin Alumni Research Foundation | Magnetron with flux switching cathode and method of operation |
-
1991
- 1991-06-13 WO PCT/GB1991/000955 patent/WO1991020091A1/en not_active Application Discontinuation
- 1991-06-13 JP JP91510569A patent/JPH05507765A/en active Pending
- 1991-06-13 EP EP91911103A patent/EP0535054A1/en not_active Withdrawn
- 1991-06-13 KR KR1019920703166A patent/KR930700695A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO1991020091A1 (en) | 1991-12-26 |
JPH05507765A (en) | 1993-11-04 |
EP0535054A1 (en) | 1993-04-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |