KR930022529A - Epoxy Resin Compositions for Semiconductor Device Sealing - Google Patents

Epoxy Resin Compositions for Semiconductor Device Sealing Download PDF

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Publication number
KR930022529A
KR930022529A KR1019920006535A KR920006535A KR930022529A KR 930022529 A KR930022529 A KR 930022529A KR 1019920006535 A KR1019920006535 A KR 1019920006535A KR 920006535 A KR920006535 A KR 920006535A KR 930022529 A KR930022529 A KR 930022529A
Authority
KR
South Korea
Prior art keywords
epoxy resin
semiconductor device
resin composition
sealing
noblock type
Prior art date
Application number
KR1019920006535A
Other languages
Korean (ko)
Other versions
KR950010106B1 (en
Inventor
안혁준
Original Assignee
채오병
제일모직 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 채오병, 제일모직 주식회사 filed Critical 채오병
Priority to KR1019920006535A priority Critical patent/KR950010106B1/en
Publication of KR930022529A publication Critical patent/KR930022529A/en
Application granted granted Critical
Publication of KR950010106B1 publication Critical patent/KR950010106B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device

Abstract

본 발명은 크레졸 노블락형 에폭수지와, 페놀노블락형 경화제, 경화촉진제, 무기충전제, 표면처리제, 가소성부여제, 이형제, 착색제, 난연제 등으로 이루어지는 반도체소자 밀봉용 에폭시수지 조성물에 있어서, 하기 일반식(I)로 표시되는 고기능 에폭시수지를 함유한 것이며, 내열특성 및 내습성, 저탄성율을 가지고 있어, 내크랙성을 크게 향상시킨다.The present invention relates to an epoxy resin composition for sealing semiconductor elements comprising a cresol noblock type epoxy resin, a phenol noblock type hardener, a curing accelerator, an inorganic filler, a surface treatment agent, a plasticizer, a mold release agent, a colorant, a flame retardant, and the like. It contains a high-performance epoxy resin represented by I), has heat resistance, moisture resistance and low elastic modulus, and greatly improves crack resistance.

Description

반도체 소자 밀봉용 에폭시 수지 조성물Epoxy Resin Compositions for Semiconductor Device Sealing

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (2)

크레졸 노블락형 에폭수지와, 페놀노블락형 경화제, 경화촉진제, 무기충진제, 표면처리제, 가소성부여제, 이형제, 착색제, 난연제등으로 이루어지는 반도체소자 밀봉용 에폭시수지 조성물에 있어서, 다음의 일반식(I)로 표시되는 고기능 에폭시수지를 함유하는 것을 특징으로 하는 반도체소자 밀봉용 에폭시 수지 조성물.In the epoxy resin composition for sealing a semiconductor device comprising the cresol noblock type epoxy resin, a phenol noblock type hardener, a curing accelerator, an inorganic filler, a surface treatment agent, a plasticizer, a mold release agent, a colorant, a flame retardant, etc., the following general formula (I) Epoxy resin composition for sealing a semiconductor device, characterized by containing a high-performance epoxy resin represented by. 제1항에 있어서, 고기능 에폭시수지는 전체수지조성물에 대해 3-10중량%만큼 첨가되는 것을 특징으로 하는 밀봉용 에폭시수지조성물.The epoxy resin composition for sealing according to claim 1, wherein the high-performance epoxy resin is added by 3-10% by weight based on the total resin composition. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920006535A 1992-04-18 1992-04-18 Semiconductor device encapsulaton epovy resin component KR950010106B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019920006535A KR950010106B1 (en) 1992-04-18 1992-04-18 Semiconductor device encapsulaton epovy resin component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920006535A KR950010106B1 (en) 1992-04-18 1992-04-18 Semiconductor device encapsulaton epovy resin component

Publications (2)

Publication Number Publication Date
KR930022529A true KR930022529A (en) 1993-11-24
KR950010106B1 KR950010106B1 (en) 1995-09-07

Family

ID=19331982

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920006535A KR950010106B1 (en) 1992-04-18 1992-04-18 Semiconductor device encapsulaton epovy resin component

Country Status (1)

Country Link
KR (1) KR950010106B1 (en)

Also Published As

Publication number Publication date
KR950010106B1 (en) 1995-09-07

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