KR930022499A - Semiconductor package device - Google Patents
Semiconductor package deviceInfo
- Publication number
- KR930022499A KR930022499A KR1019920006625A KR920006625A KR930022499A KR 930022499 A KR930022499 A KR 930022499A KR 1019920006625 A KR1019920006625 A KR 1019920006625A KR 920006625 A KR920006625 A KR 920006625A KR 930022499 A KR930022499 A KR 930022499A
- Authority
- KR
- South Korea
- Prior art keywords
- package
- semiconductor
- package device
- semiconductor package
- lead frame
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 230000035515 penetration Effects 0.000 claims abstract 3
- 210000001736 Capillaries Anatomy 0.000 claims abstract 2
- 238000004519 manufacturing process Methods 0.000 claims abstract 2
- 238000000465 moulding Methods 0.000 claims abstract 2
- 206010063829 Device malfunction Diseases 0.000 abstract 1
Abstract
이 발명은 모세관 현상을 최소화하여 반도체 IC패키지의 습기침투를 방지하기 위하여 리드 프레임 혹은 패키지 제작용 몰딩(Molding)에 복수개의 습기 방지용 홈 또는 일정공간이 형성된 패키지 장치체 관한 것이다.The present invention relates to a package device body in which a plurality of moisture preventing grooves or a predetermined space is formed in a lead frame or a molding for manufacturing a package in order to minimize the capillary phenomenon and prevent moisture penetration of the semiconductor IC package.
또한 이와같이 구성된 반도체 패키지장치는 고습도 상태에서 동작하는 디바이스에 적용할 수 있고 습기에 의한 디바이스 오동작을 줄일 수있다.In addition, the semiconductor package device configured as described above can be applied to a device operating in a high humidity state and can reduce device malfunction due to moisture.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제3도의 (a) 및 (b)는 이 발명의 일 실시예에 따른 반도체 패키지장치의 요부발췌 단면도.3 (a) and 3 (b) are cross-sectional views of main parts of a semiconductor package device according to an embodiment of the present invention.
제4도의 (a) 및 (b)는 이 발명의 다른 실시예를 나타내는 요부발췌 단면도.(A) and (b) of FIG. 4 are excerpts sectional views showing another embodiment of the present invention.
제5도의 (a) 및 (b)는 이 발명의 또 다른 실시예를 나타내는 요부발췌 단면도.(A) and (b) of FIG. 5 are excerpts sectional views showing still another embodiment of the present invention.
Claims (4)
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR930022499A true KR930022499A (en) | 1993-11-24 |
Family
ID=
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990034731A (en) * | 1997-10-30 | 1999-05-15 | 윤종용 | Lead-on chip lead frames and packages using them |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990034731A (en) * | 1997-10-30 | 1999-05-15 | 윤종용 | Lead-on chip lead frames and packages using them |
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