KR930016200U - 자동용액 충진시스템 - Google Patents
자동용액 충진시스템Info
- Publication number
- KR930016200U KR930016200U KR2019910025434U KR910025434U KR930016200U KR 930016200 U KR930016200 U KR 930016200U KR 2019910025434 U KR2019910025434 U KR 2019910025434U KR 910025434 U KR910025434 U KR 910025434U KR 930016200 U KR930016200 U KR 930016200U
- Authority
- KR
- South Korea
- Prior art keywords
- filling system
- solution filling
- automatic solution
- automatic
- solution
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910025434U KR0134582Y1 (ko) | 1991-12-31 | 1991-12-31 | 자동용액 충진시스템 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910025434U KR0134582Y1 (ko) | 1991-12-31 | 1991-12-31 | 자동용액 충진시스템 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930016200U true KR930016200U (ko) | 1993-07-28 |
| KR0134582Y1 KR0134582Y1 (ko) | 1999-03-20 |
Family
ID=19326952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019910025434U KR0134582Y1 (ko) | 1991-12-31 | 1991-12-31 | 자동용액 충진시스템 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0134582Y1 (ko) |
-
1991
- 1991-12-31 KR KR2019910025434U patent/KR0134582Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR0134582Y1 (ko) | 1999-03-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20040920 Year of fee payment: 7 |
|
| LAPS | Lapse due to unpaid annual fee |