KR930016189U - I.c 패캐이지 - Google Patents

I.c 패캐이지

Info

Publication number
KR930016189U
KR930016189U KR2019910022193U KR910022193U KR930016189U KR 930016189 U KR930016189 U KR 930016189U KR 2019910022193 U KR2019910022193 U KR 2019910022193U KR 910022193 U KR910022193 U KR 910022193U KR 930016189 U KR930016189 U KR 930016189U
Authority
KR
South Korea
Prior art keywords
package
Prior art date
Application number
KR2019910022193U
Other languages
English (en)
Other versions
KR0129132Y1 (ko
Inventor
김강산
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019910022193U priority Critical patent/KR0129132Y1/ko
Publication of KR930016189U publication Critical patent/KR930016189U/ko
Application granted granted Critical
Publication of KR0129132Y1 publication Critical patent/KR0129132Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Credit Cards Or The Like (AREA)
KR2019910022193U 1991-12-13 1991-12-13 I.c 패캐이지 KR0129132Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910022193U KR0129132Y1 (ko) 1991-12-13 1991-12-13 I.c 패캐이지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910022193U KR0129132Y1 (ko) 1991-12-13 1991-12-13 I.c 패캐이지

Publications (2)

Publication Number Publication Date
KR930016189U true KR930016189U (ko) 1993-07-28
KR0129132Y1 KR0129132Y1 (ko) 1999-02-01

Family

ID=19324181

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910022193U KR0129132Y1 (ko) 1991-12-13 1991-12-13 I.c 패캐이지

Country Status (1)

Country Link
KR (1) KR0129132Y1 (ko)

Also Published As

Publication number Publication date
KR0129132Y1 (ko) 1999-02-01

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Legal Events

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Payment date: 20050721

Year of fee payment: 8

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