KR930014904A - Bubble removal method in adhesive and die attach equipment (Die Attach M / C) - Google Patents

Bubble removal method in adhesive and die attach equipment (Die Attach M / C) Download PDF

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Publication number
KR930014904A
KR930014904A KR1019910023182A KR910023182A KR930014904A KR 930014904 A KR930014904 A KR 930014904A KR 1019910023182 A KR1019910023182 A KR 1019910023182A KR 910023182 A KR910023182 A KR 910023182A KR 930014904 A KR930014904 A KR 930014904A
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KR
South Korea
Prior art keywords
adhesive
pad
die
heating
pads
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Application number
KR1019910023182A
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Korean (ko)
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KR950000094B1 (en
Inventor
변광유
Original Assignee
정몽헌
현대전자산업 주식회사
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Application filed by 정몽헌, 현대전자산업 주식회사 filed Critical 정몽헌
Priority to KR1019910023182A priority Critical patent/KR950000094B1/en
Publication of KR930014904A publication Critical patent/KR930014904A/en
Application granted granted Critical
Publication of KR950000094B1 publication Critical patent/KR950000094B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

본 발명은 패드표면에 다이를 접착할때 사용되는 접착제내의 기포를 제거하기 위한 것으로서, 접착제가 묻어있는 패드를 가열함과 동시에 패드표면에 부착된 다이를 가압하여 기포를 터트려 제거함으로서, 접착제내에 잔류하는 기포로 인하여 야기되는 제품의 신뢰성 문제를 효과적으로 해결할수 있다.The present invention is to remove the bubbles in the adhesive used to adhere the die on the pad surface, while heating the pad with the adhesive and at the same time by pressing the die attached to the pad surface by popping bubbles to remove the residual in the adhesive It can effectively solve the reliability problem of the product caused by bubbles.

Description

접착제내의 기포제거방법 및 이를 이용한 다이접착장비(Die Attach M/C)Bubble removal method in adhesive and die attach equipment (Die Attach M / C)

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명을 이용하여 리드프레임의 각 패드표면에 다이를 접착시키는 과정을 설명하기 위한 개략적인 구성도.Figure 2 is a schematic diagram illustrating the process of bonding the die to each pad surface of the lead frame using the present invention.

Claims (3)

패드표면에 다이를 접착시키는 접착제내의 기포를 제거하는 방법에 있어서, 패드 표면상에 접착제를 묻히는 단계와, 표면에 접착제가 묻은 패드의 저면을 1차 가열하는 단계와, 패드의 저면을 2차 가열함과 동시에 접착제가 묻어있는 패드표면에 다이를 접착시키는 단계와, 패드의 저면을 3차 가열함과 동시에 다이를 가압하여 다이와 패드간의 접착제내에 잔류하는 기포를 터트려 제거하는 단계로 이루어진 접착제내의 기포제거방법.A method of removing air bubbles in an adhesive that bonds a die to a pad surface, the method comprising: applying an adhesive on the pad surface, first heating the bottom of the pad with the adhesive on the surface, and heating the bottom of the pad to the secondary heating And adhering the die to the pad surface on which the adhesive is deposited; removing the air bubbles in the adhesive by heating the bottom surface of the pad in a third manner and pressing the die to burst bubbles remaining in the adhesive between the die and the pad. Way. 스트립 형태의 리드프레임 각 패드상에 다이를 접착시키는 다이접착장비에 있어서, 리드프레임(10)이 이송하는 경로상에 접착제를 토출하는 접착제 기구(21)를 설치하고, 상기 접착기구(21)와 상기 리드프레임(10)의 패드중심간의 간격과 동일한 거리(P2)를 유지하는 위치에 상기 각 패드(11,12,13,14)의 저면과 밀착하는 제1히터(31)를 설치하며, 상기 제1히터(31)와 상기 각 패드(11,12,13,14)중심간의 간격과 동일한 거리를 유지하는 위치에 상기 각 패드(11,12,13,14)의 저면과 밀착하는 제2히터(32)와 각 패드(11,12,13,14)표면에 다이(3)를 부착하는, 진공픽-염기구(22)는 각각 설치하며, 상기 제2히터(32)와 상기 각 패드(11,12,13,14)중심각의 간격(P2)과 동일한 거리를 유지하는 위치에 상기 패드(11,12,13,14)의 저면과 밀착하는 제3히터(33)와 각 패드(11,12,13,14)표면에 부착된 다이(3)를 가압하는 가압기구(23)를 순차적으로 설치하여, 이송되는 리드프레임(10)의 각 패드(11,12,13,14)가 각 부재를 경유하는 단계에서 접착제 토출, 1차 가열, 2차 가열 및 다이접착, 3차 가열 및 접착제내의 기포제거과정이 순차적으로 이루어질 수 있도록 구성한 다이접착장비.In the die bonding apparatus for bonding a die on each pad of the lead frame in the form of a strip, an adhesive mechanism 21 for discharging the adhesive on the path transported by the lead frame 10 is provided, and the adhesive mechanism 21 and The first heater 31 is installed in close contact with the bottom of each of the pads 11, 12, 13, and 14 at a position maintaining the same distance P2 as the distance between the pad centers of the lead frame 10. A second heater in close contact with the bottom surface of each of the pads 11, 12, 13, and 14 at a position that maintains the same distance as the distance between the first heater 31 and the center of the pads 11, 12, 13, and 14; (32) and the vacuum pick-up salt mechanism (22) for attaching the die (3) to the surfaces of the pads (11, 12, 13, 14), respectively, and the second heater (32) and each pad ( The third heater 33 and each pad 11 closely contacting the bottom surface of the pads 11, 12, 13, and 14 at a position that maintains the same distance as the interval P2 of the central angle. Dies attached to the surface (3) The pressurizing mechanism 23 for pressurizing is sequentially installed, and each of the pads 11, 12, 13, 14 of the lead frame 10 to be conveyed passes through each member to discharge adhesive, primary heating and secondary heating. And die bonding equipment configured to sequentially perform die bonding, tertiary heating, and bubble removal in the adhesive. 제2항에 있어서, 상기 가압기구(23)는 상기 각 다이(3)표면과 밀착하여 가압하는 저면부에 다이(3)의 파손을 방지하기 위한 완충부재가 부착된 것을 특징으로 하는 다이접착장비.3. The die attaching apparatus according to claim 2, wherein the pressurizing mechanism (23) is provided with a cushioning member for preventing the die (3) from being damaged at the bottom of the pressing mechanism (3) in close contact with the surfaces of the dies (3). . ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910023182A 1991-12-17 1991-12-17 Method of void remove in adhesives and die attach machine using such KR950000094B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910023182A KR950000094B1 (en) 1991-12-17 1991-12-17 Method of void remove in adhesives and die attach machine using such

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910023182A KR950000094B1 (en) 1991-12-17 1991-12-17 Method of void remove in adhesives and die attach machine using such

Publications (2)

Publication Number Publication Date
KR930014904A true KR930014904A (en) 1993-07-23
KR950000094B1 KR950000094B1 (en) 1995-01-09

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170116624A (en) * 2016-04-11 2017-10-20 주식회사 잉크테크 Conductive Paste Composition and method for Bonding Structures Using the same

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KR950000094B1 (en) 1995-01-09

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