KR930013051A - Adhesive composition for flexible printed circuit board - Google Patents

Adhesive composition for flexible printed circuit board Download PDF

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Publication number
KR930013051A
KR930013051A KR1019910022660A KR910022660A KR930013051A KR 930013051 A KR930013051 A KR 930013051A KR 1019910022660 A KR1019910022660 A KR 1019910022660A KR 910022660 A KR910022660 A KR 910022660A KR 930013051 A KR930013051 A KR 930013051A
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KR
South Korea
Prior art keywords
water
weight
dispersible
soluble
adhesive
Prior art date
Application number
KR1019910022660A
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Korean (ko)
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KR950006914B1 (en
Inventor
윤영주
노무학
유상현
Original Assignee
하기주
주식회사 코오롱
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Publication date
Application filed by 하기주, 주식회사 코오롱 filed Critical 하기주
Priority to KR1019910022660A priority Critical patent/KR950006914B1/en
Publication of KR930013051A publication Critical patent/KR930013051A/en
Application granted granted Critical
Publication of KR950006914B1 publication Critical patent/KR950006914B1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers

Abstract

본 발명은 유연한 인쇄회로 기판용 접착제 조성물로서 특별히 말단기 또는 측쇄기에 아크릴기를 도입한 수분산성 또는 수용성의 폴리우레탄 접착제 70~90중량%, 수용성 또는 수분산성 에폭시 화합물 10~30중량%로 이루어진 유연한 인쇄회로 기판용 접착제 조성물이다.The present invention is a flexible printed circuit board adhesive composition, particularly flexible printing consisting of 70 to 90% by weight of water-dispersible or water-soluble polyurethane adhesive, 10 to 30% by weight of water-soluble or water-dispersible epoxy compound in which acrylic groups are introduced into end groups or side chains. Adhesive composition for circuit boards.

수분산성 또는 수용성 폴리우레탄 접착제는 아크릴 폴리올의 함량이 전체 폴리올에 대하여 70중량% 이상인(또는 부타디앤 중합체가 더욱 첨가될 때에는 20중량% 이상인) 분자량 500~5000의 폴리올과 말단에 아미노기를 가는 부타디엔 중합체와 지방족 또는 방향족의 폴리 이소시아네이트를 중합하여 얻을 수 있으며 수분산성 또는 수용성 에폭시 유화물, 크레졸형 에폭시 유화물 등을 일종 또는 그 이상 선택하여 사용할 수 있다. 본 발명의 접착제로 제조된 유연한 인쇄회로기판은 화학적, 기계적 성질이 종래 우기성 접착제로 제조된 기판에 비하여 매우 우수 하였다.Water-dispersible or water-soluble polyurethane adhesives are polybutes having a molecular weight of 500-5000 with an acrylic polyol content of at least 70% by weight relative to the total polyol (or at least 20% by weight when the butadiene polymer is further added) and a butadiene polymer having an amino group at the end. It can be obtained by polymerizing the aliphatic or aromatic polyisocyanate, and may be used by selecting one or more of water dispersible or water-soluble epoxy emulsion, cresol type epoxy emulsion and the like. The flexible printed circuit board made of the adhesive of the present invention has excellent chemical and mechanical properties compared to the substrate made of a conventional wet adhesive.

Description

유연한 인쇄회로 기판용 접착제 조성물Adhesive composition for flexible printed circuit board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (6)

수용성 또는 수분산성 폴리우레판 접착제 70~90중량부와 수용성 또는 수분산성 에폭시 화합물 10~30중량부로 이루어지는 것을 특징으로 하는 유연한 인쇄회로 기판용 접착제 조성물.Adhesive composition for a flexible printed circuit board comprising 70 to 90 parts by weight of a water-soluble or water-dispersible polyurethane adhesive and 10 to 30 parts by weight of a water-soluble or water-dispersible epoxy compound. 제1항에 있어서, 수용성 또는 수분산성 폴리우레판 접착제는 아크릴 폴리올의 함량이 전체 폴리올에 대하여 70중량% 이상이고 분자량이 500~5000인 폴리올과 지방족 또는 지방족 폴리이소시아네이트의 중합체인 것을 특징으로 하는 조성물.The composition according to claim 1, wherein the water-soluble or water-dispersible polyurepan adhesive is a polymer of an aliphatic or aliphatic polyisocyanate with a polyol having an acrylic polyol content of at least 70% by weight relative to the total polyol and a molecular weight of 500 to 5000. . 제1항에 있어서, 수용성 또는 수분산성 폴리우레탄 접착제는 아크릴 폴리올의 함량이 전체 폴리올에 대하여 20중량% 이상이고 분자량이 500~5000인 폴리올과 말단에 아미노기를 갖는 부타디엔 중합체와 지방족 또는 방향족 폴리이소시아네이트의 중합체인 것을 특징으로 하는 조성물.The method of claim 1, wherein the water-soluble or water-dispersible polyurethane adhesive is a polyol having an acrylic polyol content of at least 20% by weight based on the total polyols and a molecular weight of 500 to 5000, and a butadiene polymer having an amino group at the end and an aliphatic or aromatic polyisocyanate. Composition comprising a polymer. 제3항에 있어서, 아미노기를 갖는 부타디엔 중합체는 전체 폴리올 100중량부에 대하여 5 내지 10중량부를 첨가함을 특징으로 하는 조성물.The composition of claim 3, wherein the butadiene polymer having an amino group is added in an amount of 5 to 10 parts by weight based on 100 parts by weight of the total polyol. 제1항에 있어서, 수용성 에폭시 화합물은 지방족 글리시딜에테르, 함질소 헤테로 고리 에폭시, 카르본산 글리시딜 에티르 중에서 1종 이상 선택되어짐을 특징으로 하는 조성물.The composition according to claim 1, wherein the water-soluble epoxy compound is selected from at least one of aliphatic glycidyl ether, nitrogen-containing heterocyclic epoxy, and glycidyl ethyl carboxylate. 제1항에 있어서, 수분산성 에폭시 화합물은 노블락형 에폭시 유화물, 크레졸형 에폭시 유화물, 비스-페놀 A형 에폭시 유화물 중에서 1종 이상 선택되어 짐을 특징으로 하는 조성물.The composition of claim 1, wherein the water dispersible epoxy compound is selected from at least one of a noblock type epoxy emulsion, a cresol type epoxy emulsion, and a bis-phenol A type epoxy emulsion. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910022660A 1991-12-11 1991-12-11 Adhesive composition for flexible pcb KR950006914B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910022660A KR950006914B1 (en) 1991-12-11 1991-12-11 Adhesive composition for flexible pcb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910022660A KR950006914B1 (en) 1991-12-11 1991-12-11 Adhesive composition for flexible pcb

Publications (2)

Publication Number Publication Date
KR930013051A true KR930013051A (en) 1993-07-21
KR950006914B1 KR950006914B1 (en) 1995-06-26

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Application Number Title Priority Date Filing Date
KR1019910022660A KR950006914B1 (en) 1991-12-11 1991-12-11 Adhesive composition for flexible pcb

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100395281C (en) * 2005-04-01 2008-06-18 合肥工业大学 Aqucous polyurethane modified from vinyl resin possessing structure of bisphenol A and its preparing process

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KR950006914B1 (en) 1995-06-26

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