KR930011264B1 - Method for forming molded articles used with light weight - Google Patents

Method for forming molded articles used with light weight Download PDF

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KR930011264B1
KR930011264B1 KR1019910005501A KR910005501A KR930011264B1 KR 930011264 B1 KR930011264 B1 KR 930011264B1 KR 1019910005501 A KR1019910005501 A KR 1019910005501A KR 910005501 A KR910005501 A KR 910005501A KR 930011264 B1 KR930011264 B1 KR 930011264B1
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composition
forming
minutes
surface layer
curing
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KR920019697A (en
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김택곤
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주식회사 케미텍스
김택곤
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/06Coating with compositions not containing macromolecular substances
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5006Amines aliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5046Amines heterocyclic
    • C08G59/5053Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/506Amines heterocyclic containing only nitrogen as a heteroatom having one nitrogen atom in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00Characterised by the use of epoxy resins; Derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

A method for molding a body using a light aggregate comprises (1) making a composition by adding 1˜100 wt% a setting accelerator having piperazin:alkanol amine at 1:(1˜8) to a mixture of polyoxyalkylene polyamine R?(OA)xNH2?y (R: hydrocarbon radical, A:C2-C4 alkylene radical, x:1˜10 constant, y:2˜4 constant) with poluglycidylether of multi-valence hydogen phenol, (2) forming a surface layer by charging the composition into the bottom of a mold, (3) covering on the surface layer with some thickness by mixing light aggregate/molded body at (3.5˜ 5):1, (4) removing foams by vibrating the mold, (5) flatizing with a roller, and (6) after maintain for 30 minutes, thermal setting in the temperature range of 60˜80≰C for about 20 minutes.

Description

경량골재를 이용한 성형체의 성형방법Molding method of molded body using lightweight aggregate

이 발명은 경량골재를 이용한 성형체의 성형방법에 관한 것이다. 특히 본 발명은 성형에 이용한 에폭시 성형체와 이와함께 경량골재를 사용하여 성형체를 성형하는 방법에 관한 것이다.The present invention relates to a molding method of a molded body using a lightweight aggregate. In particular, the present invention relates to an epoxy molded article used for molding and a method for molding a molded article using lightweight aggregate together with it.

에폭시수지는 여러 수지중 그 용도가 매우 다양한 것으로, 그 한 예로는 자갈과 같은 경량골재를 이용한 성형체의 성형방법에 이용되기도 한다. 이와같은 성형체에서는 균열성이 없어야 하고 내약품성이 있어야 하며 인장 및 인열강도 등 제반 물성이 우수해야 한다는 점이 무엇보다도 중요하다. 이 중에서도 특히 성형후의 성형체 표면에 균열이 나타나지 않아야 한다는 점이 매우 중요하다.Epoxy resins are very versatile among various resins. For example, epoxy resins may be used for molding molded articles using lightweight aggregates such as gravel. In such a molded article, it is important to have no cracking resistance, chemical resistance, and excellent physical properties such as tensile and tear strength. Among these, it is particularly important that no crack appears on the surface of the molded body after molding.

따라서, 이와같은 문제점을 중시하여 여러 성형체 조성물이 제안되었지만, 성형체로 성형하였을 경우 수축성으로 인한 표면 균열성을 방지하기에는 만족스럽지 못하였다. 또한 경량골재를 이용해 성형하였을때에도 표면 평탄성이 균일하지 못한 것으로 나타났다. 이러한 이유는 에폭시수지에 사용하는 경화제, 경화방법 및 그 밖의 첨가제 선택에 문제가 있고, 이러한 여러가지가 서로 상승적으로 작용하지 못한데에 있는 것으로 나타났다. 이 중에서도 가장 중요한 문제는 적절한 경화제의 선택과 경화방법이다. 따라서 이러한 경화에 관한 문제를 해결하고자 하는 여러 방법이 제안되었다.Therefore, although various molded compositions have been proposed in view of such a problem, it was not satisfactory to prevent surface cracking due to shrinkage when molded into molded bodies. In addition, the surface flatness was not uniform even when molded using lightweight aggregate. This is because there is a problem in the selection of a curing agent, a curing method and other additives used in the epoxy resin, it appears that these several do not work synergistically with each other. Among them, the most important problem is the selection and curing method of the appropriate curing agent. Therefore, several methods have been proposed to solve the problem of curing.

미합중국 특허 제 3,462,393호에는 다가수소페놀의 폴리글리시딜 에테르를 경화시키는데 폴리옥시알킬렌 폴리아민을 사용함이 기술되어 있다. 또한, 미합중국 특허 제 2,783,214호에는 가장 많이 사용되는 에피클로로하이드린-비스페놀 성형체를 주위온도에서 트리에틸렌테트라민과 트리에탄올아민의 아민 경화제를 사용해 경화시키는 방법이 기술되어 있다. 그러나, 이들 특허의 경우에는 에폭시 수지를 주위온도에서 경화시키고 있는데, 이러한 저온경화 에폭시수지의 경우 물리적 특성이 떨어지는 단점이 있다. 또한, 이러한 성형체를 이용해 경량골재와 함께 성형할 때에도 벨트식을 주로 이용하지만 손실이 너무나 많고 품질이 조악한 단점이 있다.U.S. Patent No. 3,462,393 describes the use of polyoxyalkylene polyamines to cure polyglycidyl ethers of polyhydrogenphenols. In addition, US Pat. No. 2,783,214 describes a method of curing the most commonly used epichlorohydrin-bisphenol moldings using an amine curing agent of triethylenetetramine and triethanolamine at ambient temperature. However, in the case of these patents, the epoxy resin is cured at ambient temperature. In the case of such a low-temperature curing epoxy resin, physical properties are inferior. In addition, even when using the molded body with a lightweight aggregate using the belt type is mainly used, but the loss is too much and has the disadvantage of poor quality.

그 밖에도 몰드를 이용한 방법이 있기는 하지만 이 방법에서도 성형체에 기포가 들어가거나 표면이 매끄럽지 못한 단점이 있다.In addition, there is a method using a mold, but this method also has a drawback in that bubbles are formed in the molded body or the surface is not smooth.

따라서, 이 발명의 목적은 상술한 종래기술의 문제점을 해결하기 위한 것으로, 폴리옥시알킬렌폴리아민과 다가수소페놀형의 폴리글리시딜에테르의 혼합물에 피페라진과 알칸올아민의 경화촉진제를 첨가하여 성형체조성물을 제공하고, 이러한 성형체 조성물을 이용한 성형체를 성형하는 개량된 방법을 제공하는 것이다.Accordingly, an object of the present invention is to solve the above problems of the prior art, by adding a curing accelerator of piperazine and alkanolamine to a mixture of polyoxyalkylene polyamine and polyglycidyl ether of polyhydric phenol type. It is to provide a molded body composition, and to provide an improved method of molding a molded body using such a molded body composition.

본 발명은 폴리옥시알킬렌폴리아민으로 경화된 다가수소페놀의 폴리글리시딜에테르를 경화촉진시키는 방법에 관한 것으로, 이 방법은 피페라진 : 알칸올아민의 조성비가 1 : (1-8)인 경화촉진제의 폴리옥시알킬렌폴리아민을 다가수소페놀의 폴리글리시딜에테르와 화학 양론적으로 혼합한 다음, 생성된 성형체 조성물을 경화시키는 단계를 포함한다.The present invention relates to a method of curing and promoting a polyglycidyl ether of a polyhydric phenol cured with a polyoxyalkylene polyamine, which method comprises a composition in which the composition ratio of piperazine: alkanolamine is 1: 1 (1-8). Stoichiometrically mixing the polyoxyalkylenepolyamine of the promoter with the polyglycidyl ether of the polyhydrogenphenol, and then curing the resulting molded body composition.

본 발명에서 사용한 다가수소페놀의 폴리글리시딜에테르는 이소프로필리덴페놀의 디글리시딜에테르가 바람직하다.As for the polyglycidyl ether of the polyhydric phenol used by this invention, the diglycidyl ether of isopropylidene phenol is preferable.

또한, 본 발명에서 사용한 폴리옥시알킬렌폴리아민은 다음과 같은 일반식을 가진다.In addition, the polyoxyalkylene polyamine used by this invention has the following general formula.

R[(OA)yNH2]y R [(OA) y NH 2 ] y

상기 식에서, R은 탄화수소 라디칼이고, A는 C2-C4알킬렌 라디칼이고, x는 1 내지 10의 수이고, y는 R의 원자가를 나타내는 2에서 4의 수이다.Wherein R is a hydrocarbon radical, A is a C 2 -C 4 alkylene radical, x is a number from 1 to 10 and y is a number from 2 to 4 representing the valence of R.

위의 일반식으로 표시되는 폴리옥시알킬렌폴리아민은 다음의 일반식(I),(II) 또는 (III)을 가진 아민화합물이 바람직하게 사용된다.As the polyoxyalkylene polyamine represented by the above general formula, an amine compound having the following general formula (I), (II) or (III) is preferably used.

Figure kpo00001
Figure kpo00001

Figure kpo00002
Figure kpo00002

Figure kpo00003
Figure kpo00003

또한, 이 발명에서 사용할 수 있는 알칸올 아민류는 모노-, 디- 또는 트리에탄올아민, 하이드록시 에톡시에틸아민, N-아미노에탄올아민, N,N-비스-(하이드록시프로필), N-하이드록시에틸아민 등이 바람직하다.In addition, alkanol amines that can be used in the present invention are mono-, di- or triethanolamine, hydroxy ethoxyethylamine, N-aminoethanolamine, N, N-bis- (hydroxypropyl), N-hydroxy Ethylamine and the like are preferred.

지금까지 언급한 위의 성분들을 혼합함에는 특별한 순서가 없지만, 폴리옥시 알킬렌폴리아민, 피페라진 및 알칸올아민 성분을 혼합하여 균일한 경화 촉진제 혼합물을 얻은 다음, 생성 혼합물을 앞서 설명한 수지성분과 혼합해 주위온도에서 자기 경화하는 수지를 제조한다.There is no particular order for mixing the above mentioned components, but the polyoxy alkylenepolyamine, piperazine and alkanolamine components are mixed to obtain a uniform curing accelerator mixture, and then the resulting mixture is mixed with the resin components described above. The resin is prepared by self curing at ambient temperature.

본 발명에서는 피페라진과 알칸올 아민 성분을 먼저 혼합한 다음, 생성 혼합물을 폴리옥시알킬렌폴리아민 성분에 가하고, 마지막으로 전체 혼합물을 앞서 설명한 경화 수지성분과 혼합하는 것이 바람직하다. 여기서 혼합한 피페라진과 알칸올아민 성분은 장시간 보관해서 사용할 수 있다.In the present invention, it is preferable to first mix the piperazine and the alkanol amine component, then add the resulting mixture to the polyoxyalkylene polyamine component, and finally mix the entire mixture with the cured resin component described above. The piperazine and alkanolamine components mixed here can be stored and used for a long time.

본 발명을 실시할 때에는 피페라진과 알칸올아민 성분의 조합물은 피페라진 : 알칸올아민의 조성비를 약 1 : (1-8)로 하는 것이 바람직하다. 본 발명에서는 상기의 비율로 조합하는 것이 주위온도에서 폴리옥시알킬렌폴리아민으로 경화된 상기 에폭시수지의 자기 경화를 촉진하는데 커다란 상승효과를 나타내는 것으로 밝혀졌다. 따라서, 피페라진이나 알칸올 아민을 홀로 사용할 경우, 또는 위의 혼합 비율을 벗어나서 상기 성분들을 사용할 경우에는 주위온도에서의 경화속도가 매우 감소하는 것으로 밝혀졌다.In carrying out the present invention, it is preferable that the combination of piperazine and alkanolamine components has a composition ratio of piperazine: alkanolamine of about 1: (1-8). In the present invention, it has been found that the combination of the above ratios exhibits a great synergistic effect in promoting self curing of the epoxy resin cured with polyoxyalkylenepolyamine at ambient temperature. Accordingly, it has been found that the rate of cure at ambient temperature is greatly reduced when piperazine or alkanol amines are used alone, or when the components are used outside of the above mixing ratio.

피페라진과 알칸올 아민의 경화촉진제는 폴리옥시알킬렌폴리아민 100 중량부에 대해 약 1 내지 100 중량부 사용하는 것이 바람직하다. 여기서는 최적량은 에폭시수지, 폴리옥시알킬렌폴리아민에 따르는 주어진 적용조건에 따라 변한다.The curing accelerator of piperazine and alkanol amines is preferably used in an amount of about 1 to 100 parts by weight based on 100 parts by weight of polyoxyalkylenepolyamine. The optimum amount here varies with the given application conditions according to the epoxy resin, polyoxyalkylenepolyamine.

에폭시수지를 경화할 때에는 에폭시수지 성분에서 에폭시 그룹당 하나의 반응성 -NH를 제공할 수 있는 양으로 경화촉진제를 사용함이 바람직하다. 피페라진과 알칸올아민의 경화촉진제를 이용하여 에폭시수지를 폴리옥시알킬렌폴리아민으로 경화시킨 에폭시수지 생성물은 바닥재, 성형제, 캡슐화제, 점착제, 보호코팅제 등 다양하게 이용할 수 있다.When curing the epoxy resin, it is preferable to use a curing accelerator in an amount capable of providing one reactive -NH per epoxy group in the epoxy resin component. Epoxy resin products obtained by curing epoxy resins with polyoxyalkylene polyamines using a curing accelerator of piperazine and alkanolamine can be used in various ways such as flooring materials, molding agents, encapsulating agents, pressure-sensitive adhesives, protective coating agents, and the like.

상기 언급된 성분 외에도 난연제를 사용함이 좋은데, 이러한 난연제로는 피페라진 포스페이트를 포함하여 할로겐화 화합물 및 포스페이트 화합물이 있으며, 이들은 알칸올 아민과 피페라진의 경화촉진에 악영향을 미치지 않을 정도로 사용해야 한다.In addition to the above-mentioned components, it is preferable to use flame retardants, which include halogenated compounds and phosphate compounds including piperazine phosphate, which should be used to such an extent that they do not adversely affect the hardening of alkanol amines and piperazine.

지금까지의 에폭시수지, 폴리옥시알킬렌폴리아민 및 피페라진과 알칸올 아민의 촉진제로 이루어진 성형제 조합물은 0 내지 45℃의 온도범위에서 자기-경화시키는 것이 바람직하다. 한편으로는 위의 혼합물을 175℃의 온도에서 필요에 따라 후경화시킬 수 있다.The molding agent combinations thus far consisting of epoxy resins, polyoxyalkylenepolyamines and accelerators of piperazine and alkanol amines are preferably self-curing in the temperature range of 0 to 45 ° C. On the one hand, the above mixture can be post-cured as needed at a temperature of 175 ° C.

이 발명에 따르면 위의 성형제 조성물을 몰드바닥에 투여해 표면층을 형성하고, 자갈과 같은 경량골재/성형제 조성물을 (3.5-5) : 1의 비율로 배합해서 소정 두께로 표면층 위에 덮고, 몰드에 진동을 가하여 기포를 제거하고, 로울러를 사용해 평탄성을 부여하고, 약 30분간 방치한 다음, 60 내지 80℃의 온도로 약 20분간 가열 경화시킨다. 성형시에는 일정한 모양이 성형체로 성형할 수 있으며, 그 외에는 지금까지의 경화방법과 같다.According to this invention, the above molding agent composition is administered to the mold bottom to form a surface layer, and a light aggregate / molding agent composition such as gravel is mixed at a ratio of (3.5-5): 1 to cover the surface layer with a predetermined thickness, and the mold Vibration was applied to remove the bubbles, flattened using a roller, left for about 30 minutes, and then heat-cured at a temperature of 60 to 80 ° C for about 20 minutes. At the time of shaping | molding, a certain shape can be shape | molded with a molded object, and the other hardening methods are the same as before.

이하, 실시예를 통해서 본 발명을 더 자세히 설명한다.Hereinafter, the present invention will be described in more detail with reference to Examples.

[실시예 1 내지 4][Examples 1 to 4]

다음의 표 1과 같은 에폭시수지 조성물을 약 25℃의 온도에서 제조한다. 그리고는 부가적인 촉진제 성분을 사용하거나 사용하지 않고 폴리옥시알킬렌디아민으로 이루어진 경화제의 화학양론적으로 같은 양의 에폭시수지를 각 실시예에서 혼합한다. 각 조성물의 일부를 스틸 테스트 페널상에 6mil의 두께로 도포하고 실온에서 경화한다. 실시예 4의 겔시간 및 건조시간에서 보는 바와같이 피페라진과 알칸올 아민을 경화촉진제로 사용한 경우 폴리옥시알킬렌-폴리아민으로 경화된 에폭시 수지의 경화속도를 촉진하는데 강한 상승효과를 나타냄을 알 수 있다.To prepare an epoxy resin composition as shown in Table 1 at a temperature of about 25 ℃. The stoichiometrically equivalent amount of the epoxy resin of the curing agent consisting of polyoxyalkylenediamine, with or without additional promoter components, is then mixed in each example. A portion of each composition is applied to a steel test panel at a thickness of 6 mils and cured at room temperature. As shown in the gel time and drying time of Example 4, the use of piperazine and alkanol amines as curing accelerators showed a strong synergistic effect in promoting the curing rate of epoxy resins cured with polyoxyalkylene-polyamines. have.

[표 1]TABLE 1

Figure kpo00004
Figure kpo00004

1. 이소프로필리덴디페놀의 디글리시딜 에테르.1.Diglycidyl ether of isopropylidenediphenol.

2. Jefferson chemical사의 Jeffamine(상품명).2. Jeffamine (brand name) of Jefferson chemical.

3. 트리에탄올 아민.3. Triethanol amine.

4. 피페라딘.4. Piperadine.

5. STT(Set-to-touch)에 도달하는 시간(지촉 건조시간).5. Time to reach set-to-touch (touch-to-touch time).

6. TD(through dry).6. TD (through dry).

상기표에서 STT(指觸乾燥)는 도포막에 손가락으로 가볍게 터치하여도 지문이 묻지 않을 정도의 건조상태를 말하며, TD는 완전경화 즉, 반응이 완료되어 완전하게 경화된 상태를 의미한다.In the above table, STT (指 觸 乾燥) refers to a dry state in which the fingerprint is not touched even if a finger lightly touches the coating film, and TD means a state that is completely cured, that is, the reaction is completely cured.

[실시예 5 내지 8][Examples 5 to 8]

실시예 1 내지 4와 동일하게 다음 표 2의 에폭시수지 조성물을 제조한다. 피페라진과 트리에탄올아민을 혼합사용한 실시예 8에서 강력한 상승효과를 나타냄을 알 수 있다.In the same manner as in Examples 1 to 4 to prepare an epoxy resin composition of Table 2. It can be seen that the strong synergistic effect is shown in Example 8 in which piperazine and triethanolamine are mixed.

[표 2]TABLE 2

Figure kpo00005
Figure kpo00005

1. 표 1과 같음1. Same as Table 1

2. 평균분자량 400인 폴리옥시프로필렌디아민, Jeffamine(상품명).2. Polyoxypropylenediamine, Jeffamine (trade name) with an average molecular weight of 400.

3. 트리에탄올 아민.3. Triethanol amine.

4. 피페라진.4. Piperazine.

[실시예 9]Example 9

실시예 1 내지 8에서 제조한 에폭시수지 조성물을 경량골재와 혼합해 성형체를 만든다. 먼저 몰드 바닥에 실시예 1-8의 에폭시수지 조성물을 투여해 표면층을 형성한 다음, 경량골재/에폭시 수지를(3.5-5) : 1의 비율로 배합해서 일정한 두께로 표면층 위에 붓는다. 그리고는 로울러를 사용해 평탄성을 부여하고 30분간 방치하여 내부의 기포를 제거한다. 이 때에 경화가 진행되지만, 자연경화는 오래 걸리기 때문에 60-80℃로 가열하면서 20분간 경화한다.The epoxy resin composition prepared in Examples 1 to 8 is mixed with the lightweight aggregate to form a molded body. First, the epoxy resin composition of Example 1-8 is administered to the bottom of the mold to form a surface layer, and then the lightweight aggregate / epoxy resin (3.5-5): 1 is mixed and poured on the surface layer at a constant thickness. Then, the rollers are used to give flatness and to stand for 30 minutes to remove bubbles from the inside. Although hardening progresses at this time, since hardening takes long, it hardens for 20 minutes, heating at 60-80 degreeC.

여기서 제조한 성형체는 연마가 불필요한 정도로 표면이 매끄러웠고 손실도 전혀 없었다.The molded article produced here had a smooth surface and no loss at all.

Claims (4)

화학양론적으로 혼합된 다가수소페놀의 폴리글리시딜에테르의 하기 일반식을 가진 폴리옥시알킬렌폴리아민의 혼합물에 피페라진 : 알칸올아민의 조성비가 1 : (1-8)인 경화촉진제를 폴리옥시알킬렌폴리아민 100중량부당 1 내지 100 중량부 첨가하여 성형제 조성물을 만들고, 이 성형제 조성물을 몰드바닥에 투여해 표면층을 형성하고, 경량골재/성형제 조성물을(3.5-5) : 1의 비율로 배합해서 소정 두께로 표면층 위에 덮고, 상기 몰드에 진동을 가하여 기포를 제거하고, 로울러를 사용해 평탄성을 부여하고 약 30분간 방치한 다음, 60-80℃의 온도로 약 20분간 가열경화하는 단계로 이루어진 경량골재를 이용한 성형체의 성형방법.To a mixture of polyoxyalkylene polyamines having the following general formula of polyglycidyl ethers of stoichiometric mixed polyhydric phenols, a curing accelerator having a composition ratio of piperazine: alkanolamine of 1: (1-8) Add 1 to 100 parts by weight per 100 parts by weight of the oxyalkylene polyamine to make a molding composition, administer the molding composition to the mold floor to form a surface layer, and the lightweight aggregate / molding composition (3.5-5): Mixing at a ratio and covering the surface layer with a predetermined thickness, applying vibration to the mold to remove bubbles, giving flatness using a roller, leaving it for about 30 minutes, and heat curing at a temperature of 60-80 ° C. for about 20 minutes. Forming method of the molded body using a lightweight aggregate consisting of. R[(OA)yNH2]y R [(OA) y NH 2 ] y 상기 식에서, R은 탄화수소 라디칼이고, A는 C2-C4알킬렌 라디칼이고, x는 1 내지 10의 정수이고, y는 R의 원자기를 나타내는 2에서 4의 정수이다.Wherein R is a hydrocarbon radical, A is a C 2 -C 4 alkylene radical, x is an integer from 1 to 10 and y is an integer from 2 to 4 representing an atomic group of R. 제1항에 있어서, 다가수소페놀의 폴리글리시딜에테르가 이소프로필리덴 페놀의 디글리시딜에테르임을 특징으로 하는 성형체의 성형방법.2. The method for forming a molded product according to claim 1, wherein the polyglycidyl ether of polyhydric phenol is diglycidyl ether of isopropylidene phenol. 제1항에 있어서, 폴리옥시알킬렌폴리아민이 다음 일반식(I), (II) 또는 (III)의 아민화합물임을 특징으로 하는 성형체의 성형방법.The method for forming a molded product according to claim 1, wherein the polyoxyalkylene polyamine is an amine compound represented by the following general formula (I), (II) or (III).
Figure kpo00006
Figure kpo00006
Figure kpo00007
Figure kpo00007
Figure kpo00008
Figure kpo00008
제1항에 있어서, 알칸올아민이 모노-, 디- 또는 트리에탄올아민, 하이드록시에톡시에틸아민, N- 아미노에탄올아민, N,N-비스-(하이드록시프로필) 또는 N-하이드록시아민임을 특징으로 하는 성형체의 성형방법.The compound of claim 1, wherein the alkanolamine is mono-, di- or triethanolamine, hydroxyethoxyethylamine, N-aminoethanolamine, N, N-bis- (hydroxypropyl) or N-hydroxyamine. Forming method of a molded body characterized by.
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