KR930010116A - Epoxy Resin Composition for Semiconductor Device Sealing - Google Patents

Epoxy Resin Composition for Semiconductor Device Sealing Download PDF

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Publication number
KR930010116A
KR930010116A KR1019910021871A KR910021871A KR930010116A KR 930010116 A KR930010116 A KR 930010116A KR 1019910021871 A KR1019910021871 A KR 1019910021871A KR 910021871 A KR910021871 A KR 910021871A KR 930010116 A KR930010116 A KR 930010116A
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
semiconductor device
sealing
dissolved
Prior art date
Application number
KR1019910021871A
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Korean (ko)
Other versions
KR960010306B1 (en
Inventor
김환건
이병원
이지윤
Original Assignee
이대원
제일모직 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 이대원, 제일모직 주식회사 filed Critical 이대원
Priority to KR1019910021871A priority Critical patent/KR960010306B1/en
Priority to JP4278866A priority patent/JPH0794535B2/en
Priority to US07/964,457 priority patent/US5254605A/en
Publication of KR930010116A publication Critical patent/KR930010116A/en
Priority to KR1019960010883A priority patent/KR0172662B1/en
Application granted granted Critical
Publication of KR960010306B1 publication Critical patent/KR960010306B1/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

본 발명은 반도체소자 밀봉용 에폭시 수지조성물에 관한 것으로서, 크레졸노블락형 에폭시 수지와 경화제, 경화촉진제, 가소성부여제 및 고기능 에폭시수지를 함유함에 있어 상기 고기능에폭시수지 성분으로 하기 일반식(I)의 에폭시수지를 조성물 전체에 대하여 0.1 내지 20중량%로 함유하여 내열성 내습성이 향상된 반도체소자 밀봉용 에폭시 수지조성물을 얻는 것이다.The present invention relates to an epoxy resin composition for sealing a semiconductor device, comprising a cresol noblock type epoxy resin, a curing agent, a curing accelerator, a plasticizer, and a high functional epoxy resin. The resin is contained in an amount of 0.1 to 20% by weight based on the whole composition to obtain an epoxy resin composition for sealing semiconductor elements with improved heat resistance and moisture resistance.

(여기에서, R1, R2는 H 또는 (CH2)nCH3기이고, n은 0 또는 1이상의 정수이다).Wherein R 1 and R 2 are H or (CH 2 ) n CH 3 groups and n is 0 or an integer of 1 or greater).

Description

반도체소자 밀봉용 에폭시 수지조성물Epoxy Resin Composition for Semiconductor Device Sealing

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (3)

크레졸노블락형 에폭시 수지와 경화제, 경화촉진제, 가소성부여제 및 고기능 에폭시주지를 함유하는 반도체 소자 밀봉용 에폭시 수지조성물에 있어서, 상기 고기능에폭시 수지로서 하기일반식(I)로 표시되는 에폭시수지를 함유하는 것을 특징으로 하는 반도체소자 밀봉용 에폭시 수지조성물.An epoxy resin composition for sealing a semiconductor device containing a cresol noblock-type epoxy resin, a curing agent, a curing accelerator, a plasticizer, and a high-performance epoxy resin, wherein the high-functional epoxy resin contains an epoxy resin represented by the following general formula (I): Epoxy resin composition for sealing a semiconductor device, characterized in that. (여기에서, R1, R2는 H 또는 (CH2)nCH3기이고, n은 0 또는 1이상의 정수이다).Wherein R 1 and R 2 are H or (CH 2 ) n CH 3 groups and n is 0 or an integer of 1 or greater). 제1항에 있어, 상기 고기능 에폭시수지가 전체 수지조성물에 대하여 0.1 내지 20.0중량%만큼 함유되어 있는 것을 특징으로 하는 반도체소자 밀봉용 에폭시 수지 조성물.The epoxy resin composition for sealing a semiconductor device according to claim 1, wherein the high-performance epoxy resin is contained in an amount of 0.1 to 20.0% by weight based on the total resin composition. 하기 구조식(II)의 에폭시 수지를 비극성 유기용매에 녹이고 소량의 벤조일피록사이드 촉매를 가하여 교반하면서 1-보로모-2,5-피톨리딘디완(C4H4BrNO2)을 적하하여 하기 구조식(III)의 브롬이 치환된 에폭시 수지를 수득하고, 이것을 디에틸에테르 또는 테트라하이드로푸란에 마그네슘과 함께 녹이고 0-메틸하이드록실아민을 넣고 교반하여 아민그룹이 치환된 하기 구조식(IV)의 에폭시수지를 수득한 후, 하기구조식(V)의 말레이미드와 함께 DMF에 녹여 수시간 반응시켜 수득하는 것을 특징으로 한 일반식(I)의 고기능 에폭시수지의 제조방법.Epoxy resin of the following structural formula (II) was dissolved in a nonpolar organic solvent, and a small amount of benzoylpyoxide catalyst was added thereto to stir 1-boromo-2,5-phytolidinediwan (C 4 H 4 BrNO 2 ), followed by dropwise addition. A bromine-substituted epoxy resin of III) was obtained, and this was dissolved with magnesium in diethyl ether or tetrahydrofuran, and 0-methylhydroxylamine was added thereto, followed by stirring to replace the epoxy resin of formula (IV) having an amine group substituted therein. After the obtained, dissolved in DMF with the maleimide of the following structural formula (V) and reacted for several hours. (여기에서 기에 대한 정의는 제1항과 같다.)(Here, the definition of group is the same as in paragraph 1.) (여기에서 R1, R2에 대한 기의 정의는 상기 일반식(I)와 같다).(Herein, the definition of the group for R 1 , R 2 is the same as the general formula (I).) ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.※ Note: This is to be disclosed by the original application.
KR1019910021871A 1991-11-30 1991-11-30 Epoxy resin composition for encapsulating semiconductor elements KR960010306B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019910021871A KR960010306B1 (en) 1991-11-30 1991-11-30 Epoxy resin composition for encapsulating semiconductor elements
JP4278866A JPH0794535B2 (en) 1991-11-30 1992-10-16 Epoxy resin composition for semiconductor device sealing
US07/964,457 US5254605A (en) 1991-11-30 1992-10-21 Imide epoxy resin composition for sealing semiconductor elements
KR1019960010883A KR0172662B1 (en) 1991-11-30 1996-04-08 Method of manufacturing epoxy resin for sealing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910021871A KR960010306B1 (en) 1991-11-30 1991-11-30 Epoxy resin composition for encapsulating semiconductor elements

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1019960010883A Division KR0172662B1 (en) 1991-11-30 1996-04-08 Method of manufacturing epoxy resin for sealing semiconductor device

Publications (2)

Publication Number Publication Date
KR930010116A true KR930010116A (en) 1993-06-22
KR960010306B1 KR960010306B1 (en) 1996-07-30

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KR1019910021871A KR960010306B1 (en) 1991-11-30 1991-11-30 Epoxy resin composition for encapsulating semiconductor elements
KR1019960010883A KR0172662B1 (en) 1991-11-30 1996-04-08 Method of manufacturing epoxy resin for sealing semiconductor device

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Application Number Title Priority Date Filing Date
KR1019960010883A KR0172662B1 (en) 1991-11-30 1996-04-08 Method of manufacturing epoxy resin for sealing semiconductor device

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Also Published As

Publication number Publication date
KR960010306B1 (en) 1996-07-30
KR0172662B1 (en) 1999-03-30

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