KR930009720A - Punching device and punching method using the same - Google Patents

Punching device and punching method using the same Download PDF

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Publication number
KR930009720A
KR930009720A KR1019920019321A KR920019321A KR930009720A KR 930009720 A KR930009720 A KR 930009720A KR 1019920019321 A KR1019920019321 A KR 1019920019321A KR 920019321 A KR920019321 A KR 920019321A KR 930009720 A KR930009720 A KR 930009720A
Authority
KR
South Korea
Prior art keywords
mark
printed board
punch
punching
center
Prior art date
Application number
KR1019920019321A
Other languages
Korean (ko)
Other versions
KR960012098B1 (en
Inventor
기요시 오꾸다
Original Assignee
요시무라 시로우
가부시끼가이샤 세이꼬샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 요시무라 시로우, 가부시끼가이샤 세이꼬샤 filed Critical 요시무라 시로우
Publication of KR930009720A publication Critical patent/KR930009720A/en
Application granted granted Critical
Publication of KR960012098B1 publication Critical patent/KR960012098B1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Details Of Cutting Devices (AREA)

Abstract

본 발명은 화상 인식할 부분의 프린트 기판의 휘어짐을 확실하게 교정하여 극히 정도가 좋게 위치 검출을 할 수가 있다.Industrial Applicability The present invention can reliably correct the warpage of a printed board of a portion to be image-recognized and detect the position with an extremely high degree.

교정부재(15)에 의해 프린트 기판(W)의 위치 결정용 마크(M)의 부분을 눌러 프린트기판(W)의 휘어짐을 교정한 상태에서, 촬상 수단(21)에 의해 마크(M)를 촬영하고, 화상 처리 회로(26)에 의해 마크(M)의 중심 위치를 검출한다. 그래서 검출 결과에 기초하여 클램프 장치(22)에 의해 프린트 기판(W)을 이동시키고, 펀치(14)와 마크(M)의 중심을 일치시킨 후 가동측 금형(25)을 작동시켜 펀치(14)로써 마크(M)위치에 구멍내기를 한다.The mark M is photographed by the image pickup means 21 while the portion of the positioning mark M of the printed board W is pressed by the straightening member 15 to correct the warpage of the printed board W. FIG. Then, the center position of the mark M is detected by the image processing circuit 26. Thus, based on the detection result, the printed circuit board W is moved by the clamp device 22, the center of the punch 14 and the mark M are aligned, and then the movable side mold 25 is operated to punch the punch 14. To make a hole at the mark (M).

Description

펀칭 장치 및 이를 이용한 구멍내기 방법Punching device and punching method using the same

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 따른 펀칭 장치의 초기상태를 도시한 요부 단면도.1 is a sectional view showing the principal parts of an initial state of a punching apparatus according to the present invention;

제2도는 본 발명에 따른 펀칭 장치의 블럭도.2 is a block diagram of a punching apparatus according to the present invention.

제3도는 본 발명에 따른 펀칭 장치의 화상인식 공정을 도시한 요부 단면도.3 is a sectional view showing the principal parts of the image recognition process of the punching apparatus which concerns on this invention.

제4도는 본 발명에 따른 펀칭장치의 구멍내기 공정을 도시한 요부단면도.4 is a sectional view showing the main parts of a punching process of the punching device according to the present invention.

제5도는 본 발명에 따른 구멍내기 방법의 플로우챠트.5 is a flowchart of a perforation method according to the present invention.

Claims (2)

프린트 기판과 대향하도록 설치되어 있는 고정측 금형과, 상기 고정측 금형에 형성된 구멍부를 매개로 상기 프린트 기판에 미리 형성된 위치 결정용 마크를 촬영할 수 있는 촬상 수단과, 상기 찰상 수단으로부터의 촬상데이터를 기초로하여 상기 마크의 중심 위치를 검출하는 화성 처리 회로와, 상기 프린트 기판을 끼고 상기 고정측 금형과 대향되게 설치되며 상기 화상 처리 회로에 의해 검출된 상기 프린트 기판의 상기 마크 중심위치에 구멍을 뚫을 수 있는 원통형상의 펀치를 갖춘 가동축 금형과, 상기 펀치의 중심 구멍부에 상기 펀치와 독립해서 미끄럼 이동될 수 있게 끼워맞춰진 교정부재 및 상기 교정부재를 상기 프린트 기판에 맞닿을 수 있도록 구동하는 구동수단을 갖춘 것을 특징으로 하는 펀칭 장치.On the basis of the fixed side mold provided so as to face the printed board, the imaging means capable of photographing the positioning mark pre-formed on the printed board via the hole formed in the fixed side mold, and the imaging data from the scratch means. And a chemical conversion processing circuit for detecting the center position of the mark, and installed at the mark center position of the printed circuit board detected by the image processing circuit, provided to face the fixed side mold while sandwiching the printed board. A movable shaft mold having a cylindrical punch, a calibration member fitted to slide independently of the punch in a central hole of the punch, and driving means for driving the calibration member to abut the printed board. Punching device characterized in that equipped with. 상기 교정 부재에 의해 상기 프린트 기판을 눌러서 상기 프린트 기판의 휘어짐을 교정한 상태에서 상기 촬상수단에 의해 상기 마크를 촬영하고, 상기 촬상 수단으로부터의 촬상 데이터에 기초하여 상기 화상 처리 회로에의해 상기 마크의 중심 위치를 검출하고, 상기 검출 결과에 기초하여 상기 펀치의 중심과 상기 마크의 중심을 일치시키며, 그런후에 상기 가동축 금형을 작동시켜 상기 펀치로써 상기 마크위치에 구멍을 뚫는 것을 특징으로 하는 제1항 기재의 펀칭 장치를 이용한 구멍내기 방법.The mark is picked up by the imaging means in a state where the bending of the printed board is corrected by pressing the printed board by the calibration member, and the image processing circuit is used to photograph the mark based on the imaging data from the imaging means. Detecting a center position, and matching the center of the punch with the center of the mark based on the detection result, and then operating the movable shaft mold to drill a hole in the mark position with the punch. The punching method using the punching apparatus of an item | term description. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920019321A 1991-11-19 1992-10-21 Punching device and a method of perforating by using of the punching device KR960012098B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-303446 1991-11-19
JP3303446A JPH0811389B2 (en) 1991-11-19 1991-11-19 Punching device and drilling method using the same

Publications (2)

Publication Number Publication Date
KR930009720A true KR930009720A (en) 1993-06-21
KR960012098B1 KR960012098B1 (en) 1996-09-12

Family

ID=17921094

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920019321A KR960012098B1 (en) 1991-11-19 1992-10-21 Punching device and a method of perforating by using of the punching device

Country Status (3)

Country Link
JP (1) JPH0811389B2 (en)
KR (1) KR960012098B1 (en)
TW (1) TW247881B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100900574B1 (en) * 2007-07-25 2009-06-02 정삼용 Method for manufacturing wooden floor board made from pine

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6968763B2 (en) 2002-01-09 2005-11-29 International Business Machines Corporation Orienting and stacking parts
CN105458063B (en) * 2015-12-28 2018-08-17 东莞市准锐自动化设备有限公司 Punching of circuit board device
CN107138581A (en) * 2017-07-14 2017-09-08 陕西舜洋电子科技有限公司 Combined steel plate forming punching machine mold
JP6383506B1 (en) * 2018-01-22 2018-08-29 株式会社サンコー技研 Cutting device
CN111726942B (en) * 2019-03-22 2024-01-12 维亚机械株式会社 Drilling device and drilling method
CN111469205B (en) * 2020-04-22 2021-12-10 德清凌凯科技发展有限公司 A high-efficient environmental protection perforating device for leather sheath
CN114951864B (en) * 2022-07-13 2022-11-25 杭州爱新凯科技有限公司 Punching needle processing method of micro-punching machine and micro-punching machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100900574B1 (en) * 2007-07-25 2009-06-02 정삼용 Method for manufacturing wooden floor board made from pine

Also Published As

Publication number Publication date
TW247881B (en) 1995-05-21
KR960012098B1 (en) 1996-09-12
JPH05138595A (en) 1993-06-01
JPH0811389B2 (en) 1996-02-07

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