KR930009483A - 기판 소성 방법 - Google Patents
기판 소성 방법 Download PDFInfo
- Publication number
- KR930009483A KR930009483A KR1019920018315A KR920018315A KR930009483A KR 930009483 A KR930009483 A KR 930009483A KR 1019920018315 A KR1019920018315 A KR 1019920018315A KR 920018315 A KR920018315 A KR 920018315A KR 930009483 A KR930009483 A KR 930009483A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- lid
- firing
- shape
- firing method
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 title claims abstract description 9
- 238000010304 firing Methods 0.000 title claims abstract 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000004458 analytical method Methods 0.000 claims abstract 2
- 238000005336 cracking Methods 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1828—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIBVI compounds, e.g. CdS, ZnS, CdTe
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/543—Solar cells from Group II-VI materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Photovoltaic Devices (AREA)
Abstract
본 발명은 태양전지의 소성공정에 있어서, 대면적 기판상의 온도차이를 최소로하고, 균열화하기 위한 뚜껑을 사용한 기판소성방법을 제공하는 것을 목적으로 하는 것으로서, 구성에 있어서는 열역학법칙에 의거한 전열해석수법을 사용해서, 균열가열을 실현하는 뚜껑형상을 정량적으로 결정하는 해석적 설계수법에 의해 구멍피치 및 구멍의 배치를 설정한 뚜껑을 사용하므로서, 기판의 균열화를 실현할 수 있는 것을 특징으로 하는 기판소성방법이다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 발명의 일실시예에 있어서 유리기판 가열방법의 소성용기 뚜껑형상설계 순서도.
제2도는 본 발명의 숫법에 의해 구해진 최적 뚜껑구멍분포도.
Claims (1)
- 두께가 얇은 평판형상의 기판을 수납하는 소성용기에 대하여, 평판형상인 상기 소성용기의 뚜껑이 상기 기판의 법선방향으로 위치하고, 또한 복사열선을 발생하는 열원과 평행이고, 직경이 똑같은 단일 또는 복수개의 구멍을 가지거나, 개구부 면적이 똑같은 단일 또는 복수개의 형상을 가진 상기 뚜껑을 개재해서 가열하는 소성방법에 있어서, 열역학법칙에 의거한 전열해석숫법을 사용하여, 균열가열을 실현하는 뚜껑형상을 정량적으로 결정하는 해석적 설계숫법에 의해, 구멍피치 및 구멍의 배치를 설정한 뚜껑을 사용하는 것을 특징으로 하는 기판소성방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP91-260003 | 1991-10-08 | ||
JP3260003A JP2924361B2 (ja) | 1991-10-08 | 1991-10-08 | 基板焼成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930009483A true KR930009483A (ko) | 1993-05-22 |
KR970005735B1 KR970005735B1 (ko) | 1997-04-19 |
Family
ID=17341951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920018315A KR970005735B1 (ko) | 1991-10-08 | 1992-10-07 | 기판소성방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US5379228A (ko) |
JP (1) | JP2924361B2 (ko) |
KR (1) | KR970005735B1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2756375B1 (fr) * | 1996-11-22 | 1999-01-22 | Sagem | Procede et dispositif de mesure d'inclinaison d'un axe lie a un porteur |
JP4248389B2 (ja) * | 2003-12-25 | 2009-04-02 | シャープ株式会社 | 太陽電池モジュールの製造方法と太陽電池モジュールの製造装置 |
US20120060758A1 (en) * | 2011-03-24 | 2012-03-15 | Primestar Solar, Inc. | Dynamic system for variable heating or cooling of linearly conveyed substrates |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4338078A (en) * | 1980-11-24 | 1982-07-06 | Photon Power, Inc. | Heated conveyor system |
US4736304A (en) * | 1986-04-07 | 1988-04-05 | Energy Conversion Devices, Inc. | Method and apparatus for operating one or more deposition systems |
JPH0677830B2 (ja) * | 1987-12-25 | 1994-10-05 | 松下電器産業株式会社 | 基板加熱方法 |
JPH07106333B2 (ja) * | 1989-11-28 | 1995-11-15 | 松下電器産業株式会社 | 塗布装置 |
US5154810A (en) * | 1991-01-29 | 1992-10-13 | Optical Coating Laboratory, Inc. | Thin film coating and method |
-
1991
- 1991-10-08 JP JP3260003A patent/JP2924361B2/ja not_active Expired - Fee Related
-
1992
- 1992-10-07 KR KR1019920018315A patent/KR970005735B1/ko not_active IP Right Cessation
- 1992-10-08 US US07/957,790 patent/US5379228A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5379228A (en) | 1995-01-03 |
JPH05102508A (ja) | 1993-04-23 |
JP2924361B2 (ja) | 1999-07-26 |
KR970005735B1 (ko) | 1997-04-19 |
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