KR930006046A - 신물질 20(R)-진세노사이드 Rh₂ - Google Patents

신물질 20(R)-진세노사이드 Rh₂ Download PDF

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Publication number
KR930006046A
KR930006046A KR1019910016456A KR910016456A KR930006046A KR 930006046 A KR930006046 A KR 930006046A KR 1019910016456 A KR1019910016456 A KR 1019910016456A KR 910016456 A KR910016456 A KR 910016456A KR 930006046 A KR930006046 A KR 930006046A
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South Korea
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product
glucopyranoside
ginsenoside
die
separation
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KR1019910016456A
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English (en)
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KR940008291B1 (ko
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유광근
김신일
백남인
박종대
이유희
강규상
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유광근
재단법인 한국인삼연초연구소
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Publication of KR940008291B1 publication Critical patent/KR940008291B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07J—STEROIDS
    • C07J3/00—Normal steroids containing carbon, hydrogen, halogen or oxygen, substituted in position 17 beta by one carbon atom
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Steroid Compounds (AREA)

Abstract

20(S)-프로파낙사다이올-3-[O-B-D-글루코피라노사이드]는 인삼성분으로부터 분리되는 20(S)-진세노사이드 Rh2의20(R)이성체로서 신규물질임. 이물질은 프로토파낙사다이올계 사포닌을 산처리한 다음 생성물을 아세틸화하고 알카리 가수분해하여 제조함.

Description

신물질 20(R)-진세노사이드 Rh2
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 적외분광 스펙트럼(브롬화칼륨정제)을 보인 도표,
제2도는 수소핵자기 공명스펙트럼(300메가헬츠, 중수소화피리딘)을 보인 도표,
제3도는 탄소 핵자기공명 스펙트럼(75메가헬츠, 중수소화피리딘)을 보인 도표.

Claims (4)

  1. 일반식(Ⅰ)로 표시되는 20(R)-프로토파낙사다이로-3-[O-B-D-글루코피라노사이드]
    식중 R1은 OH이고 R3은 CH3기이다.
  2. 인삼의 프로토파낙사다이올계 사포닌을 산으로 가수분해시켜 20(R&S)-진세노사이드-Rg3를 얻고 아세틸화시킨 다음 생성물을 알카리로 4℃에서 가수분해시켜 20(R)-프로토파낙사다이올-3-[O-B-D-글루코피라노사이드]를 분리함을 특징으로 하는 방법.
  3. 청구범위 2항에서, 최종 생성품의 분리가 세미 분취용 고속 액체 크로마토그라피에 의함을 특징으로 하는 방법.
  4. 청구범위 2항에서, 생성물의 분리가 실리카겔 칼람크로마토그라피에 의함을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910016456A 1991-09-20 1991-09-20 신물질 20(R)-전세노사이드 Rh₂ KR940008291B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910016456A KR940008291B1 (ko) 1991-09-20 1991-09-20 신물질 20(R)-전세노사이드 Rh₂

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910016456A KR940008291B1 (ko) 1991-09-20 1991-09-20 신물질 20(R)-전세노사이드 Rh₂

Publications (2)

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KR930006046A true KR930006046A (ko) 1993-04-20
KR940008291B1 KR940008291B1 (ko) 1994-09-10

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KR1019910016456A KR940008291B1 (ko) 1991-09-20 1991-09-20 신물질 20(R)-전세노사이드 Rh₂

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100650318B1 (ko) * 2005-11-16 2006-11-27 학교법인 함주학원 용해도 차이를 이용한 진세노사이드 이성질체 분리 방법
KR100913010B1 (ko) * 2004-07-29 2009-08-20 상하이 이노베티브 리서치 센터 오브 트레디셔날 차이니스 메디슨 20〔Ｓ〕-진세노사이드 Ｒｈ２의 합성 방법

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100343270C (zh) * 2000-11-15 2007-10-17 山东绿叶天然药物研究开发有限公司 一种从天然植物中提取治疗恶性肿瘤产品的生产工艺
CN108152319A (zh) * 2018-02-07 2018-06-12 山东省分析测试中心 一种基于氢核磁定量分析技术测定人参皂苷Rd对照品含量的方法
CN108398452A (zh) * 2018-02-07 2018-08-14 山东省分析测试中心 一种基于氢核磁定量分析技术测定人参皂苷Re对照品含量的方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100913010B1 (ko) * 2004-07-29 2009-08-20 상하이 이노베티브 리서치 센터 오브 트레디셔날 차이니스 메디슨 20〔Ｓ〕-진세노사이드 Ｒｈ２의 합성 방법
KR100650318B1 (ko) * 2005-11-16 2006-11-27 학교법인 함주학원 용해도 차이를 이용한 진세노사이드 이성질체 분리 방법

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