KR930002841Y1 - Wafer expansion apparatus - Google Patents
Wafer expansion apparatus Download PDFInfo
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- KR930002841Y1 KR930002841Y1 KR2019900010311U KR900010311U KR930002841Y1 KR 930002841 Y1 KR930002841 Y1 KR 930002841Y1 KR 2019900010311 U KR2019900010311 U KR 2019900010311U KR 900010311 U KR900010311 U KR 900010311U KR 930002841 Y1 KR930002841 Y1 KR 930002841Y1
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- guide shaft
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
내용 없음.No content.
Description
제1도는 본 고안의 웨이퍼 익스팬션장치의 구성을 나타내는 측단면도.1 is a side cross-sectional view showing the configuration of a wafer expansion device of the present invention.
제2a도는 본 고안의 웨이퍼 익스팬션장치의 동작 상태를 설명하기 위한 측단면도.Figure 2a is a side cross-sectional view for explaining the operating state of the wafer expansion device of the present invention.
(b)는 본 고안의 웨이퍼 익스팬션장치의 일실시예를 설명하기 위한 측단면도.(b) is a side cross-sectional view for explaining an embodiment of the wafer expansion device of the present invention.
제3도는 종래 기술의 웨이퍼 익스팬션장치의 구성을 나타내는 도면이다.3 is a diagram showing the configuration of a wafer expansion apparatus of the prior art.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 트레이 하판 4 : 이송나사1: Lower Tray 4: Feed Screw
5 : 가이드축 고정판 5′ : 홀5: Guide shaft fixing plate 5 ′: hole
6 : 이송부 고정대 7 : 트레이 상판6: transfer part holder 7: tray top plate
8 : 가이드축 9 : 볼부쉬8: guide shaft 9: ball bush
10 : 격판실린더10: plate cylinder
본 고안은 웨이퍼 익스팬션(Wafer Expansion)장치에 관한 것으로서, 보다 상세하게는 트레이 높이를 조정 가능하게 하여 웨이퍼 사이즈(4″,5″,6″등)에 따라 익스팬션량을 조절함으로서 작업성 향상을 도모할 수 있는 웨이퍼 익스팬션 장치에 관한 것이다.The present invention relates to a wafer expansion device. More specifically, the height of a tray can be adjusted, thereby improving workability by adjusting an expansion amount according to wafer size (4 ″, 5 ″, 6 ″, etc.). It is related with the wafer expansion apparatus which can be performed.
일반적으로 반도체 제조공정에는 리드프레임이라고 하는 기판 위에 칩을 올려 놓은 후 고정 결합시키는 본딩공정과 본딩된 칩과 리드프레임을 도선을 연결시켜주는 와이어 본딩 고정, 그리고 프래스틱 혹은 세라믹을 이용하여 상기 조립 완료된 조립체의 파손방지 및 충격보호를 위하여 행하는 팩키징 공정 등의 작업 공정으로 이루어지고 있다.In general, a semiconductor manufacturing process includes a bonding process in which a chip is placed on a substrate called a lead frame and then fixedly coupled, a wire bonding fixing for connecting the bonded chip and the lead frame with wires, and the assembly is completed using a plastic or ceramic. It consists of working processes, such as a packaging process, which are performed in order to prevent damage of an assembly and shock protection.
전기한 작업공정에서 리드프레임과 같은 반도체 부품을 위한 기판 혹은 반도체 칩이 리이드프레임상에 고착된 미완성 반도체 부품들은 리드프레임이 각각의 단계에 공급되고 그로부터 꺼내어 쓰거나 그들 사이에 운송하기 위해서 매거진이라 불리는 상자형 지그에 격납된다.Unfinished semiconductor components, in which the semiconductor chip, such as a leadframe, or a semiconductor chip is fixed on the leadframe in the above-described work process, are boxes called magazines for the leadframe to be supplied at each stage and taken out of or transported between them. It is stored in the mold jig.
상기한 공정 중에서 다이본딩이 행하여지기 위해서는 웨이퍼를 절단하여 익스팬딩시키는 작업을 하게 된다.In order to perform die bonding in the above process, the wafer is cut and expanded.
제3도는 종래 기술의 웨이퍼 익스팬션 장치의 구성을 나타내는 도면으로서, 무우빙 플레이트(Moving Plate)(A) 상측에 실린더(B)가 고정 설치되어 있으며, 상기한 실린더(B)는 후크형의 푸싱플레이트(Pushing Plate)(C)를 진퇴시키도록 되어 있다.3 is a view showing the configuration of a wafer expansion device of the prior art, in which a cylinder B is fixedly installed above a moving plate A, and the cylinder B is a hook-type pushing plate. Pushing plate (C) is made to advance and retreat.
상기한 무우빙 플레이트(A) 가장자리에는 돌기(D)가 일체로 형성됨과 아울러 길이방향으로 홀(E)이 형성된 트레이(Tray)(F)가 착탈 가능하게 설치되며, 상기한 홀(E)에는 척킹플레이트(Chucking Plate)(G)가 슬라이드 가능한 상태로 삽입되어 일측이 상기한 푸싱플레이트(C)에 계지되어 있다.At the edge of the non-moving plate (A), the projection (D) is integrally formed and a tray (F) F having a hole (E) in the longitudinal direction is detachably installed, and in the hole (E) The chucking plate G is inserted in a slidable state, and one side thereof is locked to the pushing plate C described above.
상기한 트레이(F) 상측에는 척킹플레이트(G)를 고정할 수 있는 척(H)이 일체로 형성된 홀더(I)가 상측에 고정설치되어 있다.On the upper side of the tray F, a holder I in which a chuck H capable of fixing the chucking plate G is integrally formed is fixed to the upper side.
이와 같이 구성되는 종래 기술의 웨이퍼 익스팬션 장치는 웨이퍼(J)와 웨이퍼링(K)이 위치한 마일러(L)가 트레이(F)의 돌기(D)에 얹힌 상태에서 무우빙 플레이트(A)를 상승시키면, 웨이퍼링(K)이 홀더(I)에 형성된 척(H′)에 접촉되고 계속해서 무우빙 플레이트(A)를 상승시키게 되면 트레이(F)에 높이 “h”에 의해 웨이퍼(J)가 익스팬션되게 한다.The wafer expansion apparatus of the prior art configured as described above lifts the non-moving plate A in a state in which the mylar L in which the wafer J and the wafer ring K are located is placed on the protrusion D of the tray F. Then, the wafer ring K contacts the chuck H 'formed in the holder I and continuously raises the non-moving plate A, so that the wafer J is moved by the height “h” in the tray F. Let it expand.
이러한 상태에서 실린더(B)를 작동하면 푸싱플레이트(C)에 의해 척킹 플레이트(G)가 슬라이딩되어 척(H)에 척킹되며, 이때 척킹 플레이트(G)는 관성에 의해 푸싱 플레이트(C)에서 약간 떨어지게 된다.In this state, when the cylinder B is operated, the chucking plate G is slid by the pushing plate C and chucked to the chuck H, where the chucking plate G is slightly moved from the pushing plate C by inertia. Will fall.
척킹 플레이트(G)가 홀더(I)의 척(H)에 완전히 고정되면 웨이퍼(J)는 트레이(F)에 의해 익스팬션된 상태로 고정된다.When the chucking plate G is completely fixed to the chuck H of the holder I, the wafer J is fixed in an expanded state by the tray F.
이때 무우빙 플레이트(A)를 하강시키면 실린더(B)와 푸싱 플레이트(C)도 함께 하강하게 된다.At this time, when the non-moving plate A is lowered, the cylinder B and the pushing plate C are also lowered together.
이상 설명한 바와 같이 종래 기술의 웨이퍼 익스팬션 장치는 웨이퍼(J) 익스팬션량이 트레이(F)의 높이 “h”에 의하여 정해지므로 웨이퍼(J)의 사이즈에 따라 익스팬션량이 차이가 있음에 기인하여 높이 “h”가 다른 트레이(F)로 교체하여 작업을 행하여야 하기 때문에 작업의 번거로움은 물론 작업성을 저하시키는 문제점이 내재되어 있다.As described above, in the wafer expansion apparatus of the prior art, since the amount of expansion of the wafer J is determined by the height “h” of the tray F, the height “h” is due to the difference in the amount of expansion depending on the size of the wafer J. Has to replace the other tray (F) to perform the work is not only troublesome work, but also lowers the workability is inherent.
본 고안은 상기한 바와 같은 종래 기술의 문제점을 해결하기 위해 안출된 것으로서, 본 고안의 목적은 트레이 높이를 조정 가능하게 하여 웨이퍼 사이즈에 따라 익스팬션량을 조절함으로서 작업성 향상을 도모할 수 있는 웨이퍼 익스팬션장치를 제공하는데 있다.The present invention has been made to solve the problems of the prior art as described above, the object of the present invention is to adjust the height of the tray by adjusting the expansion amount according to the wafer size wafer expansion that can improve the workability To provide a device.
상기한 바와 같은 목적을 달성하기 위해, 본 고안은 트레이 상판과 트레이 하판 사이에 격판실린더기 배치되고, 트레이 하판을 관통함과 아울러 볼부쉬를 개재한 가이드축이 트레이 상판과 가이드축 고정판에 고정설치되며, 상기한 가이드축 고정판 아래측에 이송부 고정대가 고정설치되고, 이송 나사가 이송부 고정대와 가이드축 고정판에 형성된 홀을 관통하여 그 끝단이 상기한 트레이 상판에 계지되어 이송 나사의 회전 방향에 따라 격판 실린더에 의해 트레이 상판이 상하 수직운동됨과 아울러 가이드축이 상하 슬라이드됨으로서 트레이 상판과 트레이 하판의 높이가 조절 가능하게됨을 특징으로 하는 웨이퍼 익스팬션 장치를 제공한다.In order to achieve the object as described above, the subject innovation is the plate cylinder is disposed between the tray upper plate and the lower tray, the guide shaft through the tray lower plate and through the ball bush is fixed to the tray upper plate and the guide shaft fixed plate The conveying part holder is fixedly installed below the guide shaft fixing plate, and the feed screw passes through the hole formed in the conveying part holder and the guide shaft fixing plate, and the end thereof is latched on the upper plate of the tray so that the diaphragm according to the rotation direction of the feeding screw It provides a wafer expansion device characterized in that the upper and lower vertical movement of the tray by the cylinder and the guide shaft slides up and down to adjust the height of the upper tray and the lower tray.
이하 본 고안의 바람직한 실시예를 첨부된 도면에 따라서 더욱 상세히 설명한다.Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.
제1도는 본고안의 웨이퍼 익스팬션장치의 구성을 나타내는 도면으로서, 동일 부분은 동일 부호로 표기한다.1 is a diagram showing the configuration of a wafer expansion device in the present disclosure, in which like parts are denoted by like reference numerals.
무우빙 플레이트(A) 상측에 실린더(B)가 고정 설치되고, 이 실린더(B)는 후크 형식의 푸싱플레이트(C)가 연결되어 있다.The cylinder B is fixedly installed on the upper side of the non-ice plate A, and this cylinder B is connected with the pushing plate C of a hook type.
상기한 무우빙 플레이트(A)의 가장자리에는 트레이 하판(1)이 착탈 가능하게 설치되어 있으며, 길이방향으로 홀(2)이 형성되어 있고, 이 홀(2)에 척킹 플레이트(G)가 슬라이드 가능하게 삽입되어 일측이 상기한 푸싱 플레이트(C)에 계지되어 있다.The lower tray 1 is detachably installed at the edge of the non-moving plate A, and a hole 2 is formed in the longitudinal direction, and the chucking plate G is slidable in the hole 2. It is inserted so that one side is locked to the above-mentioned pushing plate (C).
상기한 무우빙 플레이트(A) 중앙에는 홀(3)이 형성되어 있고, 이송나사(4)가 상기한 홀(3)을 관통하여 가이드축 고정판(5) 아래측에 고정설치된 이송부 고정대(6)와 상기한 가이드축 고정판(5)의 중앙에 형성된 홀(5′)을 관통하여 끝단이 트레이 하판(1)에 계지되어 있다.In the center of the non-moving plate A, a hole 3 is formed, and a transfer part holder 6 in which a transfer screw 4 penetrates the hole 3 is fixed to the lower side of the guide shaft fixing plate 5. And an end thereof is penetrated by the lower plate 1 through the hole 5 'formed at the center of the guide shaft fixing plate 5 described above.
상기한 가이드축 고정판(5) 좌, 우측에는 트레이 상판(7)의 상하 이동시 평면도를 유지하기 위해 가이드축(8)이 4개 고정설치됨과 아울러 트레이 하판(1)를 관통하여 트레이 상판(7)에 고정설치되고, 상기한 트레이 하판(1)과 가이드축(8)은 볼부쉬(9)가 개재되어 슬라이드 가능하게 되어 있다.On the left and right sides of the guide shaft fixing plate 5, four guide shafts 8 are fixedly installed to maintain the top view when the tray upper plate 7 is moved up and down, and the tray upper plate 7 passes through the tray lower plate 1. The lower plate 1 and the guide shaft 8 of the tray are fixed to each other and are slidable with a ball bush 9 interposed therebetween.
또한 상기한 트레이 상판(7)과 트레이 하판(1) 사이에 격판 실린더(10)가 가이드축(8) 내측에 설치되어 있다.In addition, a diaphragm 10 is provided inside the guide shaft 8 between the tray upper plate 7 and the tray lower plate 1.
상기한 트레이 상판(7)은 양측에 돌기(11)가 형성되어 있으며 척킹 플레이트(G)가 고정되는 척(H)이 일체로 형성된 홀더(I)가 상측에 고정설치되어 있다.The tray upper plate 7 has protrusions 11 formed on both sides thereof, and a holder I in which the chuck H to which the chucking plate G is fixed is integrally fixed is installed on the upper side.
이와 같이 구성되는 본 고안의 웨이퍼 익스팬션장치는 웨이퍼(J)와 웨이퍼링(K)이 위치한 마일러(L)를 트레이 상판(7)의 돌기(11)에 얹힌 상태에서 무우빙 플레이트(A)를 상승시키면, 제2a도에 도시한 바와 같이 웨이퍼링(K)이 홀더(I)에 형성된 척(H′)에 접촉되고, 계속해서 상승시키게 되면 트레이 상판(7)과 트레이 하판(1)의 높이 “h1”에 의해 웨이퍼(J)가 익스팬션되게 되고, 이 상태에서 실린더(B)를 작동하면 푸싱 플레이트(C)에 의해 척킹 플레이트(G)가 슬라이딩되어 홀더(I)의 척(H)에 고정된다.The wafer expansion device according to the present invention configured as described above includes the moving plate A in a state in which the mylar L in which the wafer J and the wafer ring K are located is placed on the protrusion 11 of the tray upper plate 7. When raised, the wafer ring K contacts the chuck H 'formed in the holder I as shown in FIG. 2A, and when raised, the height of the tray upper plate 7 and the tray lower plate 1 is increased. The wafer J is expanded by “h1”, and when the cylinder B is operated in this state, the chucking plate G is slid by the pushing plate C to be fixed to the chuck H of the holder I. do.
이러한 상태에서 웨이퍼(J)의 익스팬션량을 증가하기 위해서 이송나사(4)를 반시계 방향으로 회전시키면, 제2b도에 일점쇄선으로 도시한 바와 같이 격판 실린더(10)에 의해 트레이 상판(7)이 상승됨과 아울러 가이드축(8)이 슬라이드되어 트레이 상판(7)과 트레이 하판(1)과의 높이가 h1에서 h2로 증가됨에 따라 웨이퍼(J)의 익스팬션량이 증가하게 된다.In this state, when the feed screw 4 is rotated counterclockwise to increase the amount of expansion of the wafer J, the tray upper plate 7 is formed by the diaphragm cylinder 10 as shown by the dashed-dotted line in FIG. 2B. As the guide shaft 8 slides and the height of the tray upper plate 7 and the tray lower plate 1 increases from h1 to h2, the expansion amount of the wafer J increases.
이와 반대로 이송나사(4)를 시계방향으로 회전시키면 트레이 상판(7)이 격판 실린더(10)에 의해 하강됨과 아울러 가이드축(B)도 아래측으로 슬라이드되어 트레이 하판(1)과의 높이 “h1”가 낮아져 웨이퍼(J)의 익스팬션량이 감소하게 된다.On the contrary, when the feed screw 4 is rotated in the clockwise direction, the tray upper plate 7 is lowered by the diaphragm cylinder 10, and the guide shaft B also slides downward so that the height “h1” with the tray lower plate 1 is lowered. The lower the expansion amount of the wafer (J) is reduced.
이상 설명한 바와 같이 본 고안은 웨이퍼(J)의 사이즈에 따라 웨이퍼(J)의 익스팬션량을 증감할 수 있기 때문에 트레이 교체할 필요가 없어 작업시간이 단축되며 작업성 향상을 이룰 수 있는 이점이 있다.As described above, the present invention can increase or decrease the amount of expansion of the wafer J according to the size of the wafer J, thereby eliminating the need to replace the tray, thereby reducing work time and improving workability.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019900010311U KR930002841Y1 (en) | 1990-07-13 | 1990-07-13 | Wafer expansion apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019900010311U KR930002841Y1 (en) | 1990-07-13 | 1990-07-13 | Wafer expansion apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR920003417U KR920003417U (en) | 1992-02-25 |
| KR930002841Y1 true KR930002841Y1 (en) | 1993-05-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019900010311U KR930002841Y1 (en) | 1990-07-13 | 1990-07-13 | Wafer expansion apparatus |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR930002841Y1 (en) |
-
1990
- 1990-07-13 KR KR2019900010311U patent/KR930002841Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR920003417U (en) | 1992-02-25 |
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