KR930002002B1 - Polyamide resin composition - Google Patents

Polyamide resin composition Download PDF

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KR930002002B1
KR930002002B1 KR1019890019717A KR890019717A KR930002002B1 KR 930002002 B1 KR930002002 B1 KR 930002002B1 KR 1019890019717 A KR1019890019717 A KR 1019890019717A KR 890019717 A KR890019717 A KR 890019717A KR 930002002 B1 KR930002002 B1 KR 930002002B1
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polyamide resin
flame retardant
resin composition
melamine
weight
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KR1019890019717A
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Korean (ko)
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KR910012077A (en
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임정철
신문철
이규완
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주식회사 코오롱
하기주
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477Six-membered rings

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The fire reardant polyamide resin composition is prepared by adding, at a time, 5-20 wt.% of 9,10- dihydro-9-oxo-10-phosphapeneantrene-10-melamine and 1-5 wt.% of polyvinylidene difluoride to 75-94 wt.% of the polyamide resin. The obtd. polyamide resin compsn. has excellent moldability and anti- arctracking property. The process prevents corrosion of the mold and machine. The obtd. polyamide resin composition has good thermal properties and electrical properties.

Description

난연성 폴리아미드 수지의 조성물Composition of Flame Retardant Polyamide Resin

본 발명은 난연성 폴리아미드 수지의 조성물에 관한 것으로서, 더욱 상세하게는 폴리아미드 수지에 9,10-디하이드로-9-옥소-10-포스파펜안트렌-10-멜라민과 폴리비닐리덴 디플루오라이드를 동시에 첨가시켜서 된 열적 성질과 전기적 성질 모두 양호한 난연성 폴리아미드 수지 조성물에 관한 것이다.The present invention relates to a composition of a flame retardant polyamide resin, and more particularly to 9,10-dihydro-9-oxo-10-phosphaphenanthrene-10-melamine and polyvinylidene difluoride in a polyamide resin. Both thermal and electrical properties added at the same time relate to good flame retardant polyamide resin compositions.

종래에는 폴리아미드 수지에 난연성을 부여하기 위해서는 폴리아미드 수지에다 난연제 예를들면, 할로겐함유 화합물, 금속산화물의 혼합물, 질소함유 화합물, 인함유 화합물 등을 첨가시키는 방법이 주로 이용되었으나, 이와 같은 난연제를 사용하는 경우에는 폴리아미드 수지의 본질적인 제물성이 변하게 되므로 물성의 조건에 따라 난연제를 적절히 선택하여 사용하여야만 하였다. 즉 할로겐함유 화합물과 금속산화물의 화합물을 난연제로 사용할 경우에는 난연제를 과량 첨가해야 하기 때문에 이에 따른 가공성 및 기계적 물성이 저하될 뿐만아니라, 유독성 가스도 발생하게 되어 금형 및 성형기기를 부식시키는 문제점이 있었고, 또한, 질소함유 화합물을 사용하는 경우에는 사용된 난연제와 섬유사이에 화합물을 사용하는 경우에는 사용된 난연제와 섬유사이에 상용성 및 친화성이 적기 때문에 난연제가 석출되는 블루밍 현상이 나타났으며, 내열성의 부족으로 인해 성형품의 표면상태가 좋지 않은 문제점을 가졌었고, 인함유 화합물을 난연제보 사용하는 경우에도 역시 유독성 가스가 발생되어서 금형 및 성형기기를 부식시키는 문제점이 있었으며, 적린을 난연제로 사용하는 경우에는 낮은 발화점으로 인하여 화재가 일어날 염려가 있으며, 성형품의 색상도 좋지 않은 단점이 있었다.Conventionally, in order to impart flame retardancy to a polyamide resin, a method of adding a flame retardant, for example, a halogen-containing compound, a mixture of metal oxides, a nitrogen-containing compound, a phosphorus-containing compound, and the like to a polyamide resin has been mainly used. In the case of use, since the intrinsic physical properties of the polyamide resin change, the flame retardant had to be selected appropriately according to the physical properties. In other words, when the halogen-containing compound and the metal oxide compound are used as the flame retardant, an excessive amount of the flame retardant must be added, resulting in deterioration of processability and mechanical properties, as well as the generation of toxic gases, which corrode molds and molding equipment. In addition, in the case of using a nitrogen-containing compound, when the compound is used between the flame retardant and the fiber used, there is a small amount of compatibility and affinity between the flame retardant and the fiber used. Due to the lack of heat resistance, there was a problem that the surface state of the molded product was not good, and even when using a phosphorus-containing compound as a flame retardant, a toxic gas was also generated to corrode the mold and the molding machine, and red phosphorus was used as a flame retardant. In case of fire, low flash point There was a disadvantage, and the color of the molding was also a disadvantage.

한편, 미국특허 제 3, 660, 344호에는 질소함유 화합물인 멜라민을 난연제로 사용한다고 기술되어 있으나, 이 경우에는 난연성을 우수하지만 수지와의 상용성 및 친화성이 나빠서 수지내에서 골고루 분산되기가 어렵고, 사출성형시 난연제가 금형내부에 석출되는 현상인 몰드데포지트(moledeposite)현상이 일어나며, 멜라민의 승화성 때문에 블루밍 현상이 발생하는 등의 문제점이 있었다.On the other hand, U.S. Patent No. 3,660,344 describes that melamine, which is a nitrogen-containing compound, is used as a flame retardant. However, in this case, it is excellent in flame retardancy but poor in compatibility and affinity with the resin, so that it is evenly dispersed in the resin. It is difficult, and mold injection is a phenomenon in which a flame retardant precipitates in a mold during injection molding, and a blooming phenomenon occurs due to the sublimability of melamine.

또한 미국특허 제 3, 980, 616호에는 시아눌산을 난연제로 사용하는 방법이 기재되어 있으나, 이 방법은 상기에서 서술한 멜라민을 난연제로 사용하는 경우보다 난연성 및 블루밍 현상이 생기는 것에 대해 개선은 시켰지만, 난연제로 사용하는 시아눌산은 열에 약하고 불안정하기 때문에 성형품의 표면에 발포현상이 생기는 단점이 있었다. 뿐만아니라, 일본특허공고 소 56-106, 955호에서는 시아눌산 멜라민을 난연제로 사용하는 기술이 기재되어 있으나, 상기의 문제점들중 일부에 대해선 개선시키긴 하였지만, 열에 대한 안전성이 부족하므로 가공온도가 상승할 때에 성형품의 표면에 은조현상이 일어나 색상의 변화가 생기고, 난연제와 수지사이에 친화성이 잘 생기지 않아 최종제품에 대해 기계적인 물성이 크게 저하되는 결점이 있었다.In addition, U.S. Patent No. 3,980,616 describes a method of using cyanuric acid as a flame retardant, but this method has improved the flame retardancy and blooming phenomenon than the case of using the melamine described above as a flame retardant. , Because cyanuric acid used as a flame retardant is weak and unstable to heat, foaming occurs on the surface of the molded article. In addition, Japanese Patent Publication No. 56-106, 955 describes the use of cyanuric acid melamine as a flame retardant, although some of the above problems have been improved. There was a drawback that the silver surface phenomenon occurred on the surface of the molded article when it rose, and the color change occurred, and the affinity between the flame retardant and the resin was not good, and the mechanical properties of the final product were greatly reduced.

이에 본 발명은 종래기술의 문제점을 해소시키기 위해서 난연성 폴리아미드 수지 조성물의 제조과정이나 성형가공중에 나타나는 성형품의 상태, 금형 및 성형기기의 부식 등을 해결하고 특히 내아크트랙킹성이 우수한 난연성 폴리아미드 수지 조성물을 제공하는데 그 목적이 있다.In order to solve the problems of the prior art, the present invention solves the state of the molded product during the manufacturing process or the molding process of the flame retardant polyamide resin composition, the corrosion of the mold and the molding machine, and especially the flame retardant polyamide resin having excellent arc tracking resistance. The purpose is to provide a composition.

이하 본 발명을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail.

본 발명은 폴리아미드 수지 조성물에 있어서, 총 수지량에 대해 75 내지 94중량%에 해당하는 폴리아미드수지 멜라민과 9, 10-디하이드로-9-옥소-10-포스파펜안트렌-10-클로라이드 및 그 유도체를 1:1 내지 1:6의 몰비로 반응시켜 합성된 화합물인 9, 10-디하이드로-9-옥소-10-포스파펜안트렌-10-멜라민을 5내지 20중량%, 폴리비닐덴 디플루오라이드 1 내지 5중량%를 동시에 첨가시켜서 된 것을 특징으로 하는 난연성 폴리아미드 수지 조성물인 것이다.In the polyamide resin composition, polyamide resin melamine and 9, 10-dihydro-9-oxo-10-phosphaphenanthrene-10-chloride and 75 to 94% by weight relative to the total resin amount and 5 to 20% by weight of 9, 10-dihydro-9-oxo-10-phosphaphenanthrene-10-melamine, a compound synthesized by reacting the derivative in a molar ratio of 1: 1 to 1: 6, polyvinylidene It is a flame-retardant polyamide resin composition characterized by adding 1-5 weight% of difluorides simultaneously.

이하 본 발명은 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail.

본 발명은 멜라민과 9, 10-디 하이드로-9-옥소-10-포스파펜안트렌-10-클로라이드(이하 DOPC라 함)를 반응시켜서 합성된 9, 10-디하이드로-9-옥소-10-포스파펜 안트렌-10-멜라민(이하 DOPM 라 함)과 이 불화비닐리덴을 중합시켜서 된 폴리비닐리덴 디플루오라이드(이하 PVPE라 함)를 폴리아미드 수지에다 동시에 첨가시켜서 된 조성물로서, 각 첨가제의 특성 및 작용을 설명하면, 9, 10-디하이드로-9-옥소-10-포스파펜안트렌-10-멜라민은 인과 질소를 함유하는 화합물로서 불꽃 접염시 질소에 의한 불연소 가스발생과 인에 의한 불연성 탄환물이 생성되므로 상호간의 상승효과를 유발하여 난연효과를 거두게 된다. 그러나, 이 난연제는 적화촉진하는 효과가 있고 생성된 탄화물은 도전성 길(Path)을 형성하여 내아크트랙킹성(방전시 폴리머 탄화저지능력)이 다소 부족하게 된다. 이때 첨가된 PVDF는 스스로 불연성이면서, 폴리아미드 수지의 용융점도를 올려주는 중점효과를 나타내면서 적하를 방지하고 도전성 길이 생성되는 것을 방지하게 된다.The present invention relates to 9, 10-dihydro-9-oxo-10- synthesized by reacting melamine with 9, 10-dihydro-9-oxo-10-phosphaphenanthrene-10-chloride (hereinafter referred to as DOPC). A polyvinylidene difluoride (hereinafter referred to as PVPE) obtained by polymerizing phosphaprene anthren-10-melamine (hereinafter referred to as DOPM) and vinylidene fluoride (hereinafter referred to as PVPE) is a composition obtained by simultaneously adding a polyamide resin. In the description of the properties and functions, 9,10-dihydro-9-oxo-10-phosphaphenanthrene-10-melamine is a compound containing phosphorus and nitrogen, which is caused by incombustible gas generation and Non-combustible bullets are produced, resulting in synergistic effects and mutually flame retardant effect. However, this flame retardant has an effect of facilitating accumulation and the resulting carbide forms a conductive path, which results in a slight lack of arc-tracking resistance (capacity of polymer carbide at discharge). At this time, the added PVDF is non-flammable by itself, and exhibits a central effect of raising the melt viscosity of the polyamide resin while preventing dripping and preventing the generation of conductive length.

이 난연성 폴리마이드 수지 조성물에 사용되는 DOPM은 평균입경이 5 내지 10μ, 인 함유율이 10 내지 20중량%이며 PVDF는 평균 분자량이 30,000 내지 80,000이며, 융점이 160 내지 180℃이고, 용융점도가 210 내지 270℃일 때 2,000 내지 10,000의 포아즈 정도이다.DOPM used in this flame retardant polyamide resin composition has an average particle diameter of 5 to 10 mu, a phosphorus content of 10 to 20% by weight, and PVDF has an average molecular weight of 30,000 to 80,000, a melting point of 160 to 180 ° C, and a melt viscosity of 210 to It is about 2,000 to 10,000 poise at 270 degreeC.

한편 본 발명에서 폴리아미드 수지로는 나일론 6, 나일론 66, 나일론 6/66, 나일론 6,10, 나일론 6,12, 나일론 11, 나일론 12, 나일론 46 등이 사용되며, 본 발명에 따른 폴리아미드 수지 조성물의 난연성은 ULSubject의 94의 V0 기준에 해당하게 하기 위해서는 폴리아미드 수지에 첨가시키는 DOPM의 양은 총 수지량의 5 내지 20중량% 정도가 바람직한데 만약 5중량% 미만을 첨가시키면 난연성이 저하되고, 20중량% 이상을 첨가시키면 착색력이 높아져서 착색이 어려워질 뿐만아니라 용융 흐름성이 저하되어 가공성이 불량하게 된다. 또 PVDF의 양은 총 수지량의 1 내지 5중량% 정도가 바람직한데 만약 1중량% 미만을 첨가시키면 적하를 방지하고 내아크트랙킹성이 증진되는 본래의 효과가 미미하고, 5중량% 이상은 첨가시키면 수지와의 상분리가 일어나서 여러가지 물리적 성질이 나빠지게 된다.Meanwhile, in the present invention, polyamide resins include nylon 6, nylon 66, nylon 6/66, nylon 6,10, nylon 6,12, nylon 11, nylon 12, nylon 46, and the like. In order to make the flame retardancy of the composition correspond to the V0 standard of ULSubject 94, the amount of DOPM added to the polyamide resin is preferably about 5 to 20% by weight of the total resin amount. When 20 weight% or more is added, coloring power becomes high and coloring becomes difficult, melt flow property falls and workability becomes poor. In addition, the amount of PVDF is preferably about 1 to 5% by weight of the total resin amount. If less than 1% by weight is added, the inherent effect of preventing dropping and improving arc-tracking resistance is insignificant. Phase separation with the resin occurs and various physical properties deteriorate.

그리고 본 발명에서는 DOPM과 PVDF를 폴리아미드 수지에 동시에 첨가시킬 때 특수한 방법을 사용한 것이 아니며 용융된 폴리아미드 분말이나 팰레트 상태로 첨가시킨 다음 이를 분산시키는 방법이 사용되는바, 폴리아이드 수지와 DOPM 및 PVDF를 혼합시켜 혼련용 압출기를 통하여 성형용 칩을 만든 다음 이를 사출성형시키는 방법이 바람직하다.In the present invention, when the DOPM and PVDF are added to the polyamide resin at the same time, a special method is not used, and a method of adding the polyamide resin and the DOPM in the form of molten polyamide powder or pallet and then dispersing them is used. It is preferable to mix PVDF to make a molding chip through a kneading extruder and then injection molding it.

본 발명에 따른 난연성 폴리아미드 수지 조성물은 종래의 수지 조성물과는 달리 난연성 및 열적 성질과 특히 내아크탄화성이 우수하여 전기전자 제품의 절연재료로 유용하게 사용될 수 있다.Unlike the conventional resin composition, the flame retardant polyamide resin composition according to the present invention is excellent in flame retardancy and thermal properties and especially arc carbonization resistance, and thus may be usefully used as an insulating material for electric and electronic products.

이하 본 발명을 실시예에 의거 더욱 상세히 설명하면 다음과 같으며 본 발명의 실시예 및 비교예에 관한 평가방법은 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to Examples. Evaluation methods relating to the Examples and Comparative Examples of the present invention are as follows.

1) 난연성의 평가방법1) Evaluation method of flame retardancy

UL Subject 94 STANDARD에 규정된 연소시험법에 의하여 실시하였다.It was carried out according to the combustion test method specified in UL Subject 94 STANDARD.

2) 블루밍 현상 발생여부와 판정방법2) Blooming phenomenon occurs and how to judge

두께가 3.2mm이고, 직경이 100mm인 원판형 시편을 제조하여 150℃의 열풍오븐하에서 100시간 동안 처리한 다음 95℃, 90%의 상대습도하에서 200시간 동안 처리한 다음에 시편의 표면상태를 관찰하여 판정하였다.A disc-shaped specimen having a thickness of 3.2 mm and a diameter of 100 mm was prepared and treated under a hot air oven at 150 ° C. for 100 hours, and then treated at 95 ° C. and 90% relative humidity for 200 hours to observe the surface state of the specimen. It judged by.

3) 기계적 성질 및 전기적 성질의 평가방법3) Evaluation method of mechanical and electrical properties

사출성형한 시편을 사용하여 인장강도는 ASTM D-638, 충격강도는 ASTM D-256, 내아크성은 ASTM D-495의 규격에 의거 실시하였다.Using injection molded specimens, the tensile strength was ASTM D-638, the impact strength was ASTM D-256, and the arc resistance was according to the standard of ASTM D-495.

[실시예 1 내지 6 및 비교예 1 내지 7][Examples 1 to 6 and Comparative Examples 1 to 7]

일반 성형용 중점도 나일론 6 칩과 다음의 표 I에 표시한 바와 같은 조성비의 첨가제를 실린더 온도가 230 내지 250℃로 유지된 용융 혼련용 압출기에서 혼련압출하여 성형용 칩을 제조한 다음, 이 성형용 칩을 건조시켜 실린더 온도가 235 내지 250℃로 유지된 사출성형기를 사용하여 상기의 평가 시험용 시편을 제조하였다. 그 결과를 표 II와 같이 나타냈다.The molding chip was prepared by kneading and extruding a medium-weight nylon 6 chip for general molding and an additive of a composition ratio as shown in Table I below in a melt kneading extruder maintained at a cylinder temperature of 230 to 250 ° C. The chip was dried to prepare the evaluation test specimen using an injection molding machine maintained at a cylinder temperature of 235 to 250 ° C. The results are shown in Table II.

[표 1]TABLE 1

Figure kpo00001
Figure kpo00001

[표 2]TABLE 2

Figure kpo00002
Figure kpo00002

V0 : 최우수, V2 : 보통V0: Best, V2: Normal

상기 표 II의 결과에서 알 수 있듯이 본 발명에 따른 난연성 폴리아미드 수지 조성물은 종래의 수지 조성물보다 난연성 및 열적 성질과 내아크성 등에서 훨씬 우수하게 나타났다.As can be seen from the results of Table II, the flame retardant polyamide resin composition according to the present invention was much better in flame retardancy, thermal properties and arc resistance than the conventional resin composition.

Claims (1)

폴리아미드 수지 조성물에 있어서, 총 수지량에 대해 75 내지 94중량%에 해당하는 폴리아미드 수지에 9, 10-디하이드로-9-옥소-10-포스파펜 안트렌-10-멜라민 5 내지 20중량%과 폴리비닐리덴 디플루오라이드 1 내지 5중량%를 동시에 첨가시켜서 된 것을 특징으로 하는 난연성 폴리아미드 수지 조성물.In the polyamide resin composition, 5 to 20% by weight of 9, 10-dihydro-9-oxo-10-phosphaphen anthrene-10-melamine in a polyamide resin corresponding to 75 to 94% by weight relative to the total resin amount A flame retardant polyamide resin composition characterized by adding at the same time 1 to 5% by weight of polyvinylidene difluoride.
KR1019890019717A 1989-12-27 1989-12-27 Polyamide resin composition KR930002002B1 (en)

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